Patents by Inventor Roger Sinsheimer
Roger Sinsheimer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11855376Abstract: An example contact head includes coaxial contacts configured for transmission of radio frequency (RF) signals or digital signals between a test system and a device under test (DUT). Each of the coaxial contacts is configured to target a specific impedance. Each of the coaxial contacts includes a coaxial structure having an open-curve shape. The coaxial structure includes a spring material that bends in response to applied force and that returns to the open-curve shape absent the applied force. The coaxial structure includes a center conductor terminating in a contact pin and a return conductor separated by a dielectric from the center conductor. At least part of the center conductor and the return conductor include an electrically-conductive material. Flexible contacts on the coaxial contact include the electrically-conductive material.Type: GrantFiled: March 24, 2021Date of Patent: December 26, 2023Assignee: Teradyne, Inc.Inventor: Roger A. Sinsheimer
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Patent number: 11604219Abstract: An example test system includes a test head, and a device interface board (DIB) configured to connect to the test head. The DIB is for holding devices under test (DUTs). The DIB includes electrical conductors for transmitting electrical signals between the DUTs and the test head. Servers are programmed to function as test instruments. The servers are external to, and remote from, the test head and are configured to communicate signals over fiber optic cables with the test head. The signals include serial signals.Type: GrantFiled: December 15, 2020Date of Patent: March 14, 2023Assignee: TERADYNE, INC.Inventors: Roger A. Sinsheimer, Daniel L. Engel, Leal J. Daniels
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Publication number: 20220367997Abstract: An example waveguide connector is for making a blind-mate electrical connection between a first waveguide and a second waveguide. The waveguide connector includes a male part connected to the first waveguide, where the first waveguide includes a first conductive channel, and a female part connected to the second waveguide, where the second waveguide includes a second conductive channel. The female part includes a receptacle into which the male part slides to create the blind-mate electrical connection between the first conductive channel and the second conductive channel. A self-alignment feature is on at least one of the male part or the female part.Type: ApplicationFiled: May 14, 2021Publication date: November 17, 2022Inventor: Roger A. Sinsheimer
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Publication number: 20220311166Abstract: An example contact head includes coaxial contacts configured for transmission of radio frequency (RF) signals or digital signals between a test system and a device under test (DUT). Each of the coaxial contacts is configured to target a specific impedance. Each of the coaxial contacts includes a coaxial structure having an open-curve shape. The coaxial structure includes a spring material that bends in response to applied force and that returns to the open-curve shape absent the applied force. The coaxial structure includes a center conductor terminating in a contact pin and a return conductor separated by a dielectric from the center conductor. At least part of the center conductor and the return conductor include an electrically-conductive material. Flexible contacts on the coaxial contact include the electrically-conductive material.Type: ApplicationFiled: March 24, 2021Publication date: September 29, 2022Inventor: Roger A. Sinsheimer
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Publication number: 20220187357Abstract: An example test system includes a test head, and a device interface board (DIB) configured to connect to the test head. The DIB is for holding devices under test (DUTs). The DIB includes electrical conductors for transmitting electrical signals between the DUTs and the test head. Servers are programmed to function as test instruments. The servers are external to, and remote from, the test head and are configured to communicate signals over fiber optic cables with the test head. The signals include serial signals.Type: ApplicationFiled: December 15, 2020Publication date: June 16, 2022Inventors: Roger A. Sinsheimer, Daniel L. Engel, Leal J. Daniels
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Publication number: 20120152309Abstract: Methods and apparatus are described for a concentrated photovoltaic system. A method of creating a paddle structure with a set of solar receivers that are aligned within and mechanically secured in place in each module contained in a paddle structure. Each solar receiver is assembled and aligned, where the assembly of the solar receiver establishes the alignment of the secondary optic to the photovoltaic solar cell. The assembly of a module with its set of solar receivers establishes the alignment in three dimensions the solar receivers with each other. Individual parts making up the receiver are 1) shaped, 2) sized, 3) keyed, 4) pinned and 5) any combination of these to fit together in only one way so that all of the solar receivers containing the photovoltaic solar cell maintain their alignment when installed in a given CPV module.Type: ApplicationFiled: September 8, 2011Publication date: June 21, 2012Applicant: GREENVOLTS, INCInventors: Wayne Miller, Victor Ocegueda, Jeremy Dittmer, Roger Sinsheimer, Mike Prucha
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Patent number: 7358754Abstract: Methods and apparatus are described for connecting a first plurality of signal lines to a second plurality of signal lines. A first assembly includes a plurality of first contact arrays. Each of the contacts in each of the first contact arrays is in electrical contact with a corresponding one of the first plurality of signal lines. Each of the first contact arrays has a first mechanical alignment feature associated therewith. A second assembly includes a plurality of contact assemblies. Each of the contact assemblies is suspended within the second assembly such that each contact assembly is operable to move independently in at least four degrees of freedom relative to the second assembly. Each contact assembly has a second contact array associated therewith. Each of the contacts in each of the second contact arrays is in electrical contact with a corresponding one of the second plurality of signal lines. Each of the contact assemblies has a second mechanical alignment feature associated therewith.Type: GrantFiled: June 30, 2006Date of Patent: April 15, 2008Assignee: Xandex, Inc.Inventors: Roger Sinsheimer, D. Evan Williams
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Publication number: 20080030211Abstract: Methods and apparatus are described for controlling orientation of a probe contact array relative to a wafer contact array on a wafer. The probe contact array is configured on a probe card having first kinematic reference features associated therewith. The wafer is positioned in a wafer prober having an interface with second kinematic features. The first and second kinematic features are together operable to restrain relative motion between the probe card and the wafer prober when the probe card and the interface are docked. The orientation of the probe contact array relative to the wafer contact array is determined. Where the probe contact array is out of alignment with the wafer contact array, a height of at least one of the kinematic reference features is adjusted to bring the probe contact array and the wafer contact array into substantial alignment.Type: ApplicationFiled: October 10, 2007Publication date: February 7, 2008Applicant: XANDEX, INC.Inventor: Roger Sinsheimer
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Publication number: 20080030213Abstract: Methods and apparatus are described for controlling orientation of a probe contact array relative to a wafer contact array on a wafer. The probe contact array is configured on a probe card having first kinematic reference features associated therewith. The wafer is positioned in a wafer prober having an interface with second kinematic features. The first and second kinematic features are together operable to restrain relative motion between the probe card and the wafer prober when the probe card and the interface are docked. The orientation of the probe contact array relative to the wafer contact array is determined. Where the probe contact array is out of alignment with the wafer contact array, a height of at least one of the kinematic reference features is adjusted to bring the probe contact array and the wafer contact array into substantial alignment.Type: ApplicationFiled: October 10, 2007Publication date: February 7, 2008Applicant: XANDEX, INC.Inventor: Roger Sinsheimer
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Publication number: 20080030212Abstract: Methods and apparatus are described for controlling orientation of a probe contact array relative to a wafer contact array on a wafer. The probe contact array is configured on a probe card having first kinematic reference features associated therewith. The wafer is positioned in a wafer prober having an interface with second kinematic features. The first and second kinematic features are together operable to restrain relative motion between the probe card and the wafer prober when the probe card and the interface are docked. The orientation of the probe contact array relative to the wafer contact array is determined. Where the probe contact array is out of alignment with the wafer contact array, a height of at least one of the kinematic reference features is adjusted to bring the probe contact array and the wafer contact array into substantial alignment.Type: ApplicationFiled: October 10, 2007Publication date: February 7, 2008Applicant: XANDEX, INC.Inventor: Roger Sinsheimer
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Publication number: 20080025012Abstract: A contact signal block for facilitating connections between test equipment and a device under test (DUT) is described. The contact signal block includes a plurality of ground layers and a plurality of signal transmission layers disposed between and alternating with the ground layers. Each signal transmission layer includes a plurality of signal conductors. Each signal conductor forms a controlled-impedance transmission line with adjacent ground layers and is terminated at a first end in a plurality of signal spring probes. A plurality of non-conductive spacer structures separates the ground layers and signal transmission layers and maintains a substantially constant separation between the ground layers and the signal conductors. The ground layers and the signal conductors are primarily separated by a medium having a loss tangent of approximately 0.002 and a dielectric constant of less than about 1.5.Type: ApplicationFiled: October 3, 2007Publication date: January 31, 2008Applicant: XANDEX, INC.Inventor: Roger Sinsheimer
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Patent number: 7295024Abstract: A contact signal block for facilitating connections between test equipment and a device under test (DUT) is described. The contact signal block includes a plurality of ground layers and a plurality of signal transmission layers disposed between and alternating with the ground layers. Each signal transmission layer includes a plurality of signal conductors. Each signal conductor forms a controlled-impedance transmission line with adjacent ground layers and is terminated at a first end in a plurality of signal spring probes. A plurality of non-conductive spacer structures separates the ground layers and signal transmission layers and maintains a substantially constant separation between the ground layers and the signal conductors. The ground layers and the signal conductors are primarily separated by a medium having a loss tangent of approximately 0.002 and a dielectric constant of less than about 1.5.Type: GrantFiled: January 25, 2006Date of Patent: November 13, 2007Assignee: Xandex, Inc.Inventor: Roger Sinsheimer
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Publication number: 20070176615Abstract: Methods and apparatus are described for controlling orientation of a probe contact array relative to a wafer contact array on a wafer. The probe contact array is configured on a probe card having first kinematic reference features associated therewith. The wafer is positioned in a wafer prober having an interface with second kinematic features. The first and second kinematic features are together operable to restrain relative motion between the probe card and the wafer prober when the probe card and the interface are docked. The orientation of the probe contact array relative to the wafer contact array is determined. Where the probe contact array is out of alignment with the wafer contact array, a height of at least one of the kinematic reference features is adjusted to bring the probe contact array and the wafer contact array into substantial alignment.Type: ApplicationFiled: May 15, 2006Publication date: August 2, 2007Inventor: Roger Sinsheimer
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Publication number: 20070126439Abstract: Methods and apparatus are described for aligning a probe card with a wafer probe interface by bringing first kinematic features into contact with second kinematic features, thereby restraining relative motion between the probe card and the wafer probe interface when the probe card and the wafer probe interface are docked.Type: ApplicationFiled: October 11, 2006Publication date: June 7, 2007Applicant: XANDEX, INC.Inventors: Roger Sinsheimer, D. Evan Williams
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Publication number: 20060244471Abstract: Methods and apparatus are described for connecting a first plurality of signal lines to a second plurality of signal lines. A first assembly includes a plurality of first contact arrays. Each of the contacts in each of the first contact arrays is in electrical contact with a corresponding one of the first plurality of signal lines. Each of the first contact arrays has a first mechanical alignment feature associated therewith. A second assembly includes a plurality of contact assemblies. Each of the contact assemblies is suspended within the second assembly such that each contact assembly is operable to move independently in at least four degrees of freedom relative to the second assembly. Each contact assembly has a second contact array associated therewith. Each of the contacts in each of the second contact arrays is in electrical contact with a corresponding one of the second plurality of signal lines. Each of the contact assemblies has a second mechanical alignment feature associated therewith.Type: ApplicationFiled: June 30, 2006Publication date: November 2, 2006Inventors: Roger Sinsheimer, D. Evan Williams
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Publication number: 20060183377Abstract: A contact signal block for facilitating connections between test equipment and a device under test (DUT) is described. The contact signal block includes a plurality of ground layers and a plurality of signal transmission layers disposed between and alternating with the ground layers. Each signal transmission layer includes a plurality of signal conductors. Each signal conductor forms a controlled-impedance transmission line with adjacent ground layers and is terminated at a first end in a plurality of signal spring probes. A plurality of non-conductive spacer structures separates the ground layers and signal transmission layers and maintains a substantially constant separation between the ground layers and the signal conductors. The ground layers and the signal conductors are primarily separated by a medium having a loss tangent of approximately 0.002 and a dielectric constant of less than about 1.5.Type: ApplicationFiled: January 25, 2006Publication date: August 17, 2006Inventor: Roger Sinsheimer
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Patent number: 7078890Abstract: A clamping assembly for connecting a first plurality of contacts to a second plurality of contacts on a circuit board. The circuit board has a first outer face and a second outer face. The second contacts are arranged on at least one of the first and second outer faces. The clamping assembly includes a first assembly having a first inner face, and a second assembly having a second inner face substantially parallel to the first inner face. The first plurality of contacts are arranged on at least one of the first and second inner faces. Mechanical alignment features facilitate alignment of the first contacts with the second contacts. The first and second assemblies are configured to enable relative motion therebetween to effect clamping of the first and second inner faces to the first and second outer faces of the circuit board.Type: GrantFiled: July 25, 2005Date of Patent: July 18, 2006Assignee: Xandex, Inc.Inventors: Roger Sinsheimer, D. Evan Williams
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Publication number: 20050264311Abstract: A clamping assembly is described for connecting a first plurality of contacts to a second plurality of contacts on a circuit board. The circuit board has a first outer face at an end and on one side of the circuit board, and a second outer face at the end and on the other side of the circuit board. The second contacts are arranged on at least one of the first and second outer faces. The circuit board also includes at least one first mechanical alignment feature. The clamping assembly includes a first assembly having a first inner face, and a second assembly having a second inner face substantially parallel to the first inner face. The first plurality of contacts are arranged on at least one of the first and second inner faces. At least one second mechanical alignment feature is operable in conjunction with the at least one first mechanical alignment feature on the circuit board to facilitate alignment of the first contacts with the second contacts.Type: ApplicationFiled: July 25, 2005Publication date: December 1, 2005Inventors: Roger Sinsheimer, D. Williams
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Patent number: 6963211Abstract: A device-under test (DUT) assembly includes a DUT board having a plurality of spine assemblies. Each spine assembly has a first outer face, a second outer face, and a first plurality of contacts on at least one of the first and second outer faces in electrical contact with a subset of the first signal lines. A connector assembly includes a plurality of clamping assemblies arranged to receive the plurality of spine assemblies. Each clamping assembly includes a first inner face, a second inner face, and a second plurality of contacts on at least one of the first and second inner faces in electrical contact with a subset of the second signal lines. Electrical connections between the first and second contacts are formed when the first and second inner faces of each clamping assembly are clamped to the first and second outer faces of the corresponding spine assembly.Type: GrantFiled: October 13, 2004Date of Patent: November 8, 2005Assignee: Xandex, Inc.Inventors: Roger Sinsheimer, D. Evan Williams
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Patent number: 6888427Abstract: A transmission line circuit is described which includes a conductive plane, a plurality of signal traces, and an intermediate layer between the conductive plane and the signal traces. The intermediate layer maintains a substantially constant separation between the conductive plane and the signal traces. At least a portion of the intermediate layer comprises air. The signal traces and the conductive plane form transmission lines.Type: GrantFiled: February 11, 2003Date of Patent: May 3, 2005Assignee: Xandex, Inc.Inventors: Roger Sinsheimer, Vladan Temer