Abstract: An electronic device structure and a method for making an electronic device. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device that comprises the utilization of a carrier assisted substrate, and an electronic device manufactured thereby.

Abstract: An electronic device structure and a method for making an electronic device. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device that comprises the utilization of a carrier assisted substrate, and an electronic device manufactured thereby.

Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

Abstract: An electronic device structure and a method for making an electronic device. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device that comprises the utilization of a carrier assisted substrate, and an electronic device manufactured thereby.

Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

Abstract: An electronic device structure and a method for making an electronic device. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device that comprises the utilization of a carrier assisted substrate, and an electronic device manufactured thereby.

Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

Abstract: An electronic device structure and a method for making an electronic device. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device that comprises the utilization of a carrier assisted substrate, and an electronic device manufactured thereby.

Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

Abstract: A singulated substrate for a semiconductor device may include a singulated unit substrate comprising circuit patterns on a top surface and a bottom surface of the singulated unit substrate. A semiconductor die may be bonded to the top surface of the singulated unit substrate. An encapsulation layer may encapsulate the semiconductor die and cover the top surface of the singulated unit substrate. The side surfaces of the singulated unit substrate between the top surface and bottom surface of the singulated unit substrate may be coplanar with side surfaces of the encapsulation layer. The semiconductor die may be electrically coupled to the singulated unit substrate utilizing solder bumps. Solder balls may be formed on the circuit patterns on the bottom surface of the singulated unit substrate. An underfill material may be formed between the semiconductor die and the top surface of the singulated unit substrate.

Abstract: A wireless tire inflation pressure measurement device is used to obtain inflation pressure information for a tire of a vehicle and a signal therefrom may be used for determining the location of the tire. An identifier may be associated with the inflation pressure information for each wheel of the vehicle. Tire rotation speed may be determined by amplitude fluctuations of a radio frequency carrier from a radio frequency transmitter rotating with the wheel. Differences in wheel rotation speeds during a turn may be used in determining the location of each tire of the vehicle. An antenna may be placed on each wheel toward the outer perimeter of the wheel and connected to the radio frequency transmitter. A radio frequency identification (RFID) tag and pressure sensor may be used as the wireless tire inflation pressure measurement device and a RFID pickup coil may be provided in each wheel well for pickup of the inflation pressure signals from each RFID tag on a wheel.

Abstract: A radio frequency identification (RFID) tag on a single layer substrate comprises a semiconductor integrated circuit RFID tag device and antenna circuit. A connection jumper may be used to bridge over the antenna circuit coil turns. The RFID tag device is located on the same side as an inductor coil and capacitor which forms a parallel resonant antenna circuit. The inductor coil has an inner end and an outer end. The inner or outer end may be connected directly to the RFID tag device and the outer or inner end be may connected to the RFID tag device with a jumper over the inductor coil turns, or the RFID tag device may bridge the inductor coil turns when being connected to both the inner and outer ends. An encapsulation (glop top) may be used to seal the RFID tag device and jumper, and an insulated coating may be used to cover the entire surface of the substrate to create an inexpensive “chip-on-tag.

Abstract: A radio frequency identification tag having a step-tunable inductor for tuning a parallel resonant antenna circuit of the radio frequency identification tag to a desired frequency. The step-tunable inductor comprises a plurality of branches in which each branch is adapted for adjusting the step-tunable inductor to a desired inductance value for resonating the parallel antenna circuit to a carrier frequency of a tag interrogator/reader.

Abstract: A wireless tire inflation pressure measurement device is used to obtain inflation pressure information for a tire of a vehicle and a signal therefrom may be used for determining the location of the tire. An identifier may be associated with the inflation pressure information for each wheel of the vehicle. Tire rotation speed may be determined by amplitude fluctuations of a radio frequency carrier from a radio frequency transmitter rotating with the wheel. Differences in wheel rotation speeds during a turn may be used in determining the location of each tire of the vehicle. An antenna may be placed on each wheel toward the outer perimeter of the wheel and connected to the radio frequency transmitter. A radio frequency identification (RFID) tag and pressure sensor may be used as the wireless tire inflation pressure measurement device and a RFID pickup coil may be provided in each wheel well for pickup of the inflation pressure signals from each RFID tag on a wheel.