Patents by Inventor Roger St. Amand

Roger St. Amand has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190189552
    Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.
    Type: Application
    Filed: January 29, 2019
    Publication date: June 20, 2019
    Inventors: Michael Kelly, David Hiner, Ronald Huemoeller, Roger St. Amand
  • Patent number: 10192816
    Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: January 29, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Michael Kelly, David Hiner, Ronald Huemoeller, Roger St. Amand
  • Publication number: 20180240744
    Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.
    Type: Application
    Filed: December 26, 2017
    Publication date: August 23, 2018
    Inventors: Michael Kelly, David Hiner, Ronald Huemoeller, Roger St. Amand
  • Patent number: 9852976
    Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: December 26, 2017
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Michael Kelly, David Hiner, Ronald Huemoeller, Roger St. Amand
  • Publication number: 20170133310
    Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.
    Type: Application
    Filed: January 6, 2017
    Publication date: May 11, 2017
    Inventors: Michael Kelly, David Hiner, Ronald Huemoeller, Roger St. Amand
  • Patent number: 9543242
    Abstract: A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: January 10, 2017
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Michael Kelly, David Hiner, Ronald Huemoeller, Roger St. Amand
  • Publication number: 20150303170
    Abstract: A singulated substrate for a semiconductor device may include a singulated unit substrate comprising circuit patterns on a top surface and a bottom surface of the singulated unit substrate. A semiconductor die may be bonded to the top surface of the singulated unit substrate. An encapsulation layer may encapsulate the semiconductor die and cover the top surface of the singulated unit substrate. The side surfaces of the singulated unit substrate between the top surface and bottom surface of the singulated unit substrate may be coplanar with side surfaces of the encapsulation layer. The semiconductor die may be electrically coupled to the singulated unit substrate utilizing solder bumps. Solder balls may be formed on the circuit patterns on the bottom surface of the singulated unit substrate. An underfill material may be formed between the semiconductor die and the top surface of the singulated unit substrate.
    Type: Application
    Filed: April 17, 2014
    Publication date: October 22, 2015
    Applicant: Amkor Technology, Inc.
    Inventors: Keun Soo Kim, Byoung Jun Ahn, Choon Heung Lee, Jin Young Kim, Dae Byoung Kang, Roger St. Amand
  • Patent number: 6571617
    Abstract: A wireless tire inflation pressure measurement device is used to obtain inflation pressure information for a tire of a vehicle and a signal therefrom may be used for determining the location of the tire. An identifier may be associated with the inflation pressure information for each wheel of the vehicle. Tire rotation speed may be determined by amplitude fluctuations of a radio frequency carrier from a radio frequency transmitter rotating with the wheel. Differences in wheel rotation speeds during a turn may be used in determining the location of each tire of the vehicle. An antenna may be placed on each wheel toward the outer perimeter of the wheel and connected to the radio frequency transmitter. A radio frequency identification (RFID) tag and pressure sensor may be used as the wireless tire inflation pressure measurement device and a RFID pickup coil may be provided in each wheel well for pickup of the inflation pressure signals from each RFID tag on a wheel.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: June 3, 2003
    Assignee: Microchip Technology Incorporated
    Inventors: Jan Van Niekerk, Roger St. Amand, Joseph A. Uradnik, Paul N. Katz
  • Patent number: 6496113
    Abstract: A radio frequency identification (RFID) tag on a single layer substrate comprises a semiconductor integrated circuit RFID tag device and antenna circuit. A connection jumper may be used to bridge over the antenna circuit coil turns. The RFID tag device is located on the same side as an inductor coil and capacitor which forms a parallel resonant antenna circuit. The inductor coil has an inner end and an outer end. The inner or outer end may be connected directly to the RFID tag device and the outer or inner end be may connected to the RFID tag device with a jumper over the inductor coil turns, or the RFID tag device may bridge the inductor coil turns when being connected to both the inner and outer ends. An encapsulation (glop top) may be used to seal the RFID tag device and jumper, and an insulated coating may be used to cover the entire surface of the substrate to create an inexpensive “chip-on-tag.
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: December 17, 2002
    Assignee: Microchip Technology Incorporated
    Inventors: Youbok Lee, Lee Furey, Roger St. Amand
  • Patent number: 6480110
    Abstract: A radio frequency identification tag having a step-tunable inductor for tuning a parallel resonant antenna circuit of the radio frequency identification tag to a desired frequency. The step-tunable inductor comprises a plurality of branches in which each branch is adapted for adjusting the step-tunable inductor to a desired inductance value for resonating the parallel antenna circuit to a carrier frequency of a tag interrogator/reader.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: November 12, 2002
    Assignee: Microchip Technology Incorporated
    Inventors: Youbok Lee, Lee Furey, Roger St. Amand
  • Patent number: 6463798
    Abstract: A wireless tire inflation pressure measurement device is used to obtain inflation pressure information for a tire of a vehicle and a signal therefrom may be used for determining the location of the tire. An identifier may be associated with the inflation pressure information for each wheel of the vehicle. Tire rotation speed may be determined by amplitude fluctuations of a radio frequency carrier from a radio frequency transmitter rotating with the wheel. Differences in wheel rotation speeds during a turn may be used in determining the location of each tire of the vehicle. An antenna may be placed on each wheel toward the outer perimeter of the wheel and connected to the radio frequency transmitter. A radio frequency identification (RFID) tag and pressure sensor may be used as the wireless tire inflation pressure measurement device and a RFID pickup coil may be provided in each wheel well for pickup of the inflation pressure signals from each RFID tag on a wheel.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: October 15, 2002
    Assignee: Microchip Technology Incorporated
    Inventors: Jan Van Niekerk, Roger St. Amand, Joseph A. Uradnik, Paul N. Katz
  • Patent number: 6424263
    Abstract: A radio frequency identification (RFID) tag on a single layer substrate comprises a semiconductor integrated circuit RFID tag device and antenna circuit. A connection jumper may be used to bridge over the antenna circuit coil turns. The RFID tag device is located on the same side as an inductor coil and capacitor which forms a parallel resonant antenna circuit. The inductor coil has an inner end and an outer end. The inner or outer end may be connected directly to the RFID tag device and the outer or inner end be may connected to the RFID tag device with a jumper over the inductor coil turns, or the RFID tag device may bridge the inductor coil turns when being connected to both the inner and outer ends. An encapsulation (glop top) may be used to seal the RFID tag device and jumper, and an insulated coating may be used to cover the entire surface of the substrate to create an inexpensive “chip-on-tag.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: July 23, 2002
    Assignee: Microchip Technology Incorporated
    Inventors: Youbok Lee, Lee Furey, Roger St. Amand
  • Publication number: 20020092347
    Abstract: A wireless tire inflation pressure measurement device is used to obtain inflation pressure information for a tire of a vehicle and a signal therefrom may be used for determining the location of the tire. An identifier may be associated with the inflation pressure information for each wheel of the vehicle. Tire rotation speed may be determined by amplitude fluctuations of a radio frequency carrier from a radio frequency transmitter rotating with the wheel. Differences in wheel rotation speeds during a turn may be used in determining the location of each tire of the vehicle. An antenna may be placed on each wheel toward the outer perimeter of the wheel and connected to the radio frequency transmitter. A radio frequency identification (RFID) tag and pressure sensor may be used as the wireless tire inflation pressure measurement device and a RFID pickup coil may be provided in each wheel well for pickup of the inflation pressure signals from each RFID tag on a wheel.
    Type: Application
    Filed: January 17, 2001
    Publication date: July 18, 2002
    Inventors: Jan Van Niekerk, Roger St. Amand, Joseph A. Uradnik, Paul N. Katz
  • Publication number: 20020092345
    Abstract: A wireless tire inflation pressure measurement device is used to obtain inflation pressure information for a tire of a vehicle and a signal therefrom may be used for determining the location of the tire. An identifier may be associated with the inflation pressure information for each wheel of the vehicle. Tire rotation speed may be determined by amplitude fluctuations of a radio frequency carrier from a radio frequency transmitter rotating with the wheel. Differences in wheel rotation speeds during a turn may be used in determining the location of each tire of the vehicle. An antenna may be placed on each wheel toward the outer perimeter of the wheel and connected to the radio frequency transmitter. A radio frequency identification (RFID) tag and pressure sensor may be used as the wireless tire inflation pressure measurement device and a RFID pickup coil may be provided in each wheel well for pickup of the inflation pressure signals from each RFID tag on a wheel.
    Type: Application
    Filed: January 17, 2001
    Publication date: July 18, 2002
    Inventors: Jan Van Niekerk, Roger St. Amand, Joseph A. Uradnik, Paul N. Katz
  • Publication number: 20020092346
    Abstract: A wireless tire inflation pressure measurement device is used to obtain inflation pressure information for a tire of a vehicle and a signal therefrom may be used for determining the location of the tire. An identifier may be associated with the inflation pressure information for each wheel of the vehicle. Tire rotation speed may be determined by amplitude fluctuations of a radio frequency carrier from a radio frequency transmitter rotating with the wheel. Differences in wheel rotation speeds during a turn may be used in determining the location of each tire of the vehicle. An antenna may be placed on each wheel toward the outer perimeter of the wheel and connected to the radio frequency transmitter. A radio frequency identification (RFID) tag and pressure sensor may be used as the wireless tire inflation pressure measurement device and a RFID pickup coil may be provided in each wheel well for pickup of the inflation pressure signals from each RFID tag on a wheel.
    Type: Application
    Filed: January 17, 2001
    Publication date: July 18, 2002
    Inventors: Jan Van Niekerk, Roger St. Amand, Joseph A. Uradnik, Paul N. Katz
  • Publication number: 20020067268
    Abstract: A radio frequency identification (RFID) tag on a single layer substrate comprises a semiconductor integrated circuit RFID tag device and antenna circuit. A connection jumper may be used to bridge over the antenna circuit coil turns. The RFID tag device is located on the same side as an inductor coil and capacitor which forms a parallel resonant antenna circuit. The inductor coil has an inner end and an outer end. The inner or outer end may be connected directly to the RFID tag device and the outer or inner end be may connected to the RFID tag device with a jumper over the inductor coil turns, or the RFID tag device may bridge the inductor coil turns when being connected to both the inner and outer ends. An encapsulation (glop top) may be used to seal the RFID tag device and jumper, and an insulated coating may be used to cover the entire surface of the substrate to create an inexpensive “chip-on-tag.
    Type: Application
    Filed: August 10, 2001
    Publication date: June 6, 2002
    Inventors: Youbok Lee, Lee Furey, Roger St. Amand
  • Publication number: 20020067266
    Abstract: A radio frequency identification (RFID) tag on a single layer substrate comprises a semiconductor integrated circuit RFID tag device and antenna circuit. A connection jumper may be used to bridge over the antenna circuit coil turns. The RFID tag device is located on the same side as an inductor coil and capacitor which forms a parallel resonant antenna circuit. The inductor coil has an inner end and an outer end. The inner or outer end may be connected directly to the RFID tag device and the outer or inner end be may connected to the RFID tag device with a jumper over the inductor coil turns, or the RFID tag device may bridge the inductor coil turns when being connected to both the inner and outer ends. An encapsulation (glop top) may be used to seal the RFID tag device and jumper, and an insulated coating may be used to cover the entire surface of the substrate to create an inexpensive “chip-on-tag.
    Type: Application
    Filed: December 1, 2000
    Publication date: June 6, 2002
    Inventors: Youbok Lee, Lee Furey, Roger St. Amand
  • Patent number: 6208500
    Abstract: An improved high quality factor capacitive device is implemented on a single, monolithic integrated circuit. The new layout techniques improve the quality factor (Q) of the capacitor by reducing intrinsic resistance of the capacitor by reducing the distance between the metal contacts of the top and bottom conductive plates. The layout techniques require laying out the top conductive plate of the capacitor in strips such that metal contacts from the bottom conductive plate pass in between the strips and through the dielectric layer. Alternatively, the apertures may be etched into the top conductive plate so that metal contacts pass through the apertures and connect to the bottom conductive plate.
    Type: Grant
    Filed: November 25, 1998
    Date of Patent: March 27, 2001
    Assignee: Microchip Technology Incorporated
    Inventors: Sam E. Alexander, Randy L. Yach, Roger St. Amand
  • Patent number: 6087241
    Abstract: A method is disclosed for forming narrow thermal silicon dioxide side isolation regions in a semiconductor substrate and MOS or CMOS semiconductor devices fabricated by this method. A thin stress relief layer is used in conjunction with a polysilicon buffering stress relief layer on the surface of a semiconductor substrate prior to the field oxidation process to restrict lateral silicon dioxide expansion thereby permitting the creation of narrow thermal silicon dioxide side isolation regions in the semiconductor substrate. A silicon dioxide layer is also used between an amorphous polysilicon (buffering stress relief) layer and a silicon nitride layer to function as an oxide cap, to avoid undesired pitting of the amorphous polysilicon layer, and to avoid interaction between the silicon nitride and amorphous polysilicon layers in areas of high stress.
    Type: Grant
    Filed: April 24, 1998
    Date of Patent: July 11, 2000
    Assignee: Microchip Technology Incorporated
    Inventors: Roger St. Amand, Robert Ma, Neil Deutscher