Abstract: Systems and methods are provided for monitoring equipment in a semiconductor manufacturing facility. A processing device maintains baseline measurement record generated from measurements performed by a plurality of tools over a first time range. A measurement record is received, the measurement record corresponding to a measurement performed on a wafer, the wafer having been processed by a first tool of the plurality of tools. The measurement record is stored in a drift candidate table corresponding to a second time range. A determination is made as to whether the measurement record satisfy a set of excursion rules in view of the drift candidate table, and, in response to the determination, the measurement record is stored in an alert table.

Abstract: Systems and methods are provided for monitoring equipment in a semiconductor manufacturing facility. A processing device maintains baseline measurement record generated from measurements performed by a plurality of tools over a first time range. A measurement record is received, the measurement record corresponding to a measurement performed on a wafer, the wafer having been processed by a first tool of the plurality of tools. The measurement record is stored in a drift candidate table corresponding to a second time range. A determination is made as to whether the measurement record satisfy a set of excursion rules in view of the drift candidate table, and, in response to the determination, the measurement record is stored in an alert table.

Abstract: A method and apparatus for severing the mandrel of an anchor device such as a packer to release the packer and remove it from a well. A cutter locator profile above the packer assembly and a cutter locator element on the cutting tool are located so as to precisely position the cutting element at a desired location on the packer mandrel. Once the mandrel is severed, the packer assembly can elongate to release the expansion mechanism. Then, the packer assembly can be pulled upwardly to release the packer, and to remove it from the well. A cutting tool can be lowered through production tubing to sever the mandrel, followed by pulling the packer with the production tubing. Alternatively, a cutting tool can be lowered on a workstring and latched to the upper end of the packer assembly, followed by severing the mandrel and pulling the packer with the workstring.

Abstract: A method and apparatus for severing the mandrel of an anchor device such as a packer to release the packer and remove it from a well. A cutter locator profile above the packer assembly and a cutter locator element on the cutting tool are located so as to precisely position the cutting element at a desired location on the packer mandrel. Once the mandrel is severed, the packer assembly can elongate to release the expansion mechanism. Then, the packer assembly can be pulled upwardly to release the packer, and to remove it from the well. A cutting tool can be lowered through production tubing to sever the mandrel, followed by pulling the packer with the production tubing. Alternatively, a cutting tool can be lowered on a workstring and latched to the upper end of the packer assembly, followed by severing the mandrel and pulling the packer with the workstring.

Abstract: A method within adjusting values of a passive temperature compensation network for use in an oscillator includes the steps of determining the frequency variation of the oscillator from nominal over a specified temperature range, determining the maximum frequency variation over the temperature range, and recalculating the performance of the circuit over the temperature range utilizing reduced values for the temperature compensation components therein. The oscillation frequency can be utilized as the controlled parameter to a laser based component trimming system. Power is applied to the oscillator and the compensation component is trimmed until the circuit oscillates at the specified target frequency.