Abstract: A robust alignment mark used in semiconductor processing to help deter the expansion of cracks and delamination caused by the cutting of a dicing blade. A cross-shaped structure is used as a line site for alignment of the dicing blade. A plurality of rectangular elements is situated about the periphery of the alignment mark and populated with via bar structures that are interconnected at each level of the wafer, and laid in a serpentine fashion throughout each element to expose more of the via bar structure surface area to propagating cracks. The rectangular elements are formed of different sizes to expose more surface area to propagating cracks. A plurality of square, metal-level structures is formed in the area between the cross-shaped structure and the peripherally placed, rectangular elements.