Patents by Inventor Rohan Raghunathan

Rohan Raghunathan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked die ground shield
    Patent number: 9972578
    Abstract: The present disclosure relates to semiconductor devices. Embodiments of the teachings thereof may include processes for manufacturing of semiconductor devices and the devices themselves. For example, some embodiments may include an integrated circuit package comprising: a lead frame; a first die mounted on the lead frame in flip-chip fashion, with a frontside of the first die connected to the lead frame; wherein the first die comprises an oxide layer deposited on a backside of the first die and a back metal layer deposited on the oxide layer; and a second die mounted on the back metal layer of the first die.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: May 15, 2018
    Assignee: MICROCHIP TECHNOLOGY INCORPORATED
    Inventors: Gregory Dix, Lee Furey, Rohan Raghunathan
  • Stacked Die Ground Shield
    Publication number: 20170287850
    Abstract: The present disclosure relates to semiconductor devices. Embodiments of the teachings thereof may include processes for manufacturing of semiconductor devices and the devices themselves. For example, some embodiments may include an integrated circuit package comprising: a lead frame; a first die mounted on the lead frame in flip-chip fashion, with a frontside of the first die connected to the lead frame; wherein the first die comprises an oxide layer deposited on a backside of the first die and a back metal layer deposited on the oxide layer; and a second die mounted on the back metal layer of the first die.
    Type: Application
    Filed: March 28, 2017
    Publication date: October 5, 2017
    Applicant: Microchip Technology Incorporated
    Inventors: Gregory Dix, Lee Furey, Rohan Raghunathan