Patents by Inventor Rohana Chandratilleke

Rohana Chandratilleke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6173761
    Abstract: In a cryogenic loop heat pipe, a working fluid for heat transport is contained in a loop capillary tube, and a portion of the loop capillary tube is used as a heat absorbing portion (A) while a portion other than the heat absorbing portion (A) is used as a heat dissipating portion (B). In this heat pipe, when the heat exchange length of the heat absorbing portion A of the capillary tube is represented by l, and the inner diameter of the capillary tube at the heat absorbing portion A is represented by d, l and d satisfy 15d<l<882d. When a Laplace constant L is given by L=[&sgr;/{(&rgr;1−&rgr;v)g}]0.5, the inner diameter d satisfies L<d<3L.
    Type: Grant
    Filed: May 15, 1997
    Date of Patent: January 16, 2001
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Rohana Chandratilleke, Yasumi Ohtani, Masahiko Takahashi, Hideki Nakagome, Tatsuya Yoshino
  • Patent number: 5960868
    Abstract: In the adiabatic apparatus of the present invention, a vessel includes an adiabatic layer in which an object is taken. A plurality of thermal shield plates are located in the adiabatic layer. Each thermal shield plate concentrically surrounds the object. A temperature control section cools or heats the object and the plurality of thermal shield plates. A switch section thermally connects the temperature control section to the plurality of thermal shield plates and the object if temperature of the plurality of thermal shield plates and the object is controlled, and thermally separates the temperature control section from the plurality of thermal shield plates and the object if control of the temperature of the plurality of thermal shield plates and the object is completed.
    Type: Grant
    Filed: February 12, 1998
    Date of Patent: October 5, 1999
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Toru Kuriyama, Masahiko Takahashi, Rohana Chandratilleke, Yasumi Ohtani, Hideki Nakagome
  • Patent number: 5842348
    Abstract: A cryogenic cooling apparatus including a vacuum container for containing an object to be cooled, at least one refrigerator for cooling the object, and a thermal switch unit. The refrigerator has a high-temperature cooling stage and a low-temperature cooling stage connected to the high-temperature cooling stage via a low-temperature cylinder. The thermal switch unit has at least one high-temperature heat transfer member attached to the high-temperature cooling stage, at least one low-temperature heat transfer member attached to the low-temperature cooling stage and separated from the high-temperature heat transfer member, and a sealed container provided between the high-temperature cooling stage and the low-temperature cooling stage.
    Type: Grant
    Filed: April 9, 1997
    Date of Patent: December 1, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tomomi Kaneko, Rohana Chandratilleke, Toru Kuriyama
  • Patent number: 5737927
    Abstract: A cryogenic cooling apparatus is provided, wherein the degree of freedom of installation and use is increased without deteriorating the reliability or stability and the range of uses of the apparatus is also increased. A coil unit and a refrigeration unit are positioned such that a second heat conductive member disposed on an extendible wall of a vacuum container and a fourth heat conductive member disposed on an extendible wall of another vacuum container face each other coaxially. In this state, the coil unit and refrigeration unit are relatively moved to approach each other, and thus the second heat conductive member and fourth heat conductive member come in contact. If the coil unit and refrigeration unit are further moved, the extendible wall extends and consequently the second heat conductive member comes in contact with a first heat conductive member. In addition, the extendible wall contracts and consequently the fourth heat conductive member comes in contact with a third heat conductive member.
    Type: Grant
    Filed: March 14, 1997
    Date of Patent: April 14, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masahiko Takahashi, Yasumi Ohtani, Rohana Chandratilleke, Hideo Hatakeyama, Hideki Nakagome, Toru Kuriyama
  • Patent number: 5711157
    Abstract: A superconducting magnet apparatus comprises a superconducting coil unit, and a refrigerant-filled chamber type refrigerator having a plurality of cooling stages. At least a final cooling stage of the cooling stages includes a static-type refrigerant-filled chamber and is associated with the superconducting coil unit, and at least a first cooling stage of the cooling stages includes a movable-type refrigerant-filled chamber.
    Type: Grant
    Filed: May 15, 1996
    Date of Patent: January 27, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yasumi Ohtani, Masahiko Takahashi, Hideo Hatakeyama, Rohana Chandratilleke, Toru Kuriyama, Hideki Nakagome, Takayuki Kobayashi, Tomomi Hattori, Tatsuya Yoshino
  • Patent number: 5647218
    Abstract: A cooling apparatus comprises a main refrigerator having a refrigerant-filled chamber, a sub-refrigerator connected parallel to the main refrigerator and having a refrigerant-filled chamber, switch control means for controlling the switching operation between the supply of a refrigerant used in the main refrigerator to the sub-refrigerator, and the stop of the supply of the refrigerant, on the basis of predetermined conditions.
    Type: Grant
    Filed: May 14, 1996
    Date of Patent: July 15, 1997
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Toru Kuriyama, Yasumi Ohtani, Rohana Chandratilleke, Tatsuya Yoshino, Takayuki Kobayashi
  • Patent number: 5325080
    Abstract: A superconducting coil apparatus comprises a cryostat, a superconducting coil body contained in a cryostat and including a surface portion of an epoxy resin layer, and an interposing member interposed between the resin layer of the superconducting coil body and the cryostat and including a block with a through-hole, a thermal barrier member and a friction-reducing member interposed between the block and the heat barrier member. The thickness of that portion of the surface portion of the superconducting coil body, which contacts the interposing member, is set in a range of 0.4 mm to 3.5 mm, and the thickness of the other portion of the surface portion is set to less than 0.4 mm.
    Type: Grant
    Filed: November 21, 1991
    Date of Patent: June 28, 1994
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Rohana Chandratilleke, Hideaki Maeda