Abstract: A packaging system or tag is provided for at least one article or item, which employs a multilayer laminate structure that includes an encapsulated transformative material that is disposed between first and second conductive layers. The transformative material is configured to undergo a state change (for example, by a chemical reaction or physical change) that changes impedance between the first and second conductive layers in response to an intrusion or perforation through at least part of the multilayer laminate structure. Furthermore, one of the first and second conductive layers can be configured (for example, by printing or etching) to provide an RF antenna and a first electrode of the at least one integrated galvanic cell. The other of the first and second conductive layers can provide a second electrode of the at least one integrated galvanic cell.

Abstract: A packaging system or tag is provided for at least one article or item, which employs a multilayer laminate structure that includes an encapsulated transformative material that is disposed between first and second conductive layers. The transformative material is configured to undergo a state change (for example, by a chemical reaction or physical change) that changes impedance between the first and second conductive layers in response to an intrusion or perforation through at least part of the multilayer laminate structure. Furthermore, one of the first and second conductive layers can be configured (for example, by printing or etching) to provide an RF antenna and a first electrode of the at least one integrated galvanic cell. The other of the first and second conductive layers can provide a second electrode of the at least one integrated galvanic cell.

Abstract: A packaging system for at least one article includes a multilayer laminate structure that encapsulates a transformative material between first and second conductive layers where one of the first and second conductive layers defines a set of elongate sections. An NFC/RFID IC is electrically coupled to an antenna. The NFC/RFID IC has a plurality of input terminals electrically coupled to a plurality of electrical circuits that provide for electrical connection or electrical disconnection between sections in the set of elongate sections in accordance with a predefined codeword. The NFC/RFID IC is configured to sense voltage signals produced by the plurality of electrical circuits, determine a sensed codeword based on the sensed voltage signals, compare the sensed codeword to the predefined codeword, and output a signal based on such comparison.

Abstract: A packaging system for at least one article includes a multilayer laminate structure that encapsulates a transformative material between first and second conductive layers where one of the first and second conductive layers defines a set of elongate sections. An NFC/RFID IC is electrically coupled to an antenna. The NFC/RFID IC has a plurality of input terminals electrically coupled to a plurality of electrical circuits that provide for electrical connection or electrical disconnection between sections in the set of elongate sections in accordance with a predefined codeword. The NFC/RFID IC is configured to sense voltage signals produced by the plurality of electrical circuits, determine a sensed codeword based on the sensed voltage signals, compare the sensed codeword to the predefined codeword, and output a signal based on such comparison.

Abstract: A packaging system for at least one article includes a multilayer laminate structure and at least one sensor. The laminate structure encapsulates a transformative material between first and second conductive layers, which undergoes a state change that changes impedance between the first and second conductive layers in response to a perforation produced by the at least one sensor. An NFC/RFID circuit is electrically coupled to the first and second conductive layers of the multilayer laminate structure. At least one operational characteristic of the NFC/RFID circuit is dependent on the impedance change between the first and second conductive layers in response to a perforation produced by the sensor under predetermined environmental conditions. The operational characteristic(s) of the NFC/RFID circuit can be ascertained and analyzed (for example, by operations of an NFC/RFID interrogator) to detect and register the predetermined environmental conditions and provide an indication thereof.

Abstract: A packaging system is provided includes a sensing barrier protecting at least one article. The sensing barrier is formed from a multilayer laminate structure that encapsulates a transformative material between first and second conductive layers. The transformative material is configured to undergo a state change (for example, by a chemical reaction or physical reaction) that changes impedance between the first and second conductive layers in response to intrusion through the multilayer laminate structure. An NFC/RFID circuit is electrically coupled to the first and second conductive layers of the multilayer laminate structure. At least one operational characteristic of the NFC/RFID circuit is dependent on the change in impedance between the first and second conductive layers of the multilayer laminate structure in response to intrusion.