Patents by Inventor Rohit Berlia

Rohit Berlia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240018643
    Abstract: Synthesis of high SFE nanotwinned metallic films with varying distributions of twin widths on a low SFE metallic layer using magnetron sputtering is disclosed. In various embodiments, a method for forming a nanotwinned metal film may include providing a single crystal silicon wafer, etching the single crystal silicon wafer, depositing a silver film onto the single crystal silicon wafer forming a silver buffer layer, and depositing a metallic film onto the silver buffer layer using sputtering at a controlled temperature.
    Type: Application
    Filed: July 11, 2023
    Publication date: January 18, 2024
    Inventors: Jagannathan Rajagopalan, Rohit Berlia
  • Publication number: 20230374653
    Abstract: A method to grow metallic glass films utilizes engineering steep, spatially modulated compositional gradients during physical vapor deposition. This method can be used to enhance the thermal stability (increase glass transition and crystallization temperature) of thin film metallic glasses or can be used to produce amorphous films of metallic alloys that do not readily form a glassy structure.
    Type: Application
    Filed: May 16, 2023
    Publication date: November 23, 2023
    Inventors: Jagannathan Rajagopalan, Rohit Berlia
  • Publication number: 20230052052
    Abstract: A method of forming a monocrystalline nitinol film on a single crystal silicon wafer can comprise depositing a first seed layer of a first metal on the single crystal silicon wafer, the first seed layer growing epitaxially on the single crystal silicon wafer in response to the depositing the first seed layer of the first metal; and depositing the monocrystalline nitinol film on a final seed layer, the monocrystalline nitinol film growing epitaxially on the final seed layer in response to the depositing the monocrystalline nitinol film. The method can form a multilayer stack for a micro-electromechanical system MEMS device.
    Type: Application
    Filed: August 12, 2022
    Publication date: February 16, 2023
    Inventors: Jagannathan Rajagopalan, Rohit Berlia
  • Patent number: 11286551
    Abstract: In a method of forming a metallic material with a multimodal microstructure, nickel is deposited on a substrate having a patterned surface comprising two materials having differing microstructure. The resulting materials may desirably be utilized in semiconductor devices or microelectromechanical (MEMS) devices.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: March 29, 2022
    Assignee: Arizona Board of Regents on behalf of Arizona State University
    Inventors: Jagannathan Rajagopalan, Rohit Berlia
  • Publication number: 20210032738
    Abstract: Metallic materials with multimodal microstructure and methods of forming the metallic materials are disclosed. Exemplary methods allow for tuning of desired properties of the metallic materials and of devices including the metallic materials.
    Type: Application
    Filed: October 12, 2020
    Publication date: February 4, 2021
    Inventors: Jagannathan Rajagopalan, Rohit Berlia
  • Patent number: 10801100
    Abstract: Metallic materials with multimodal microstructure and methods of forming the metallic materials are disclosed. Exemplary methods allow for tuning of desired properties of the metallic materials and of devices including the metallic materials.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: October 13, 2020
    Assignee: Arizona Board of Regents on behalf of Arizona State University
    Inventors: Jagannathan Rajagopalan, Rohit Berlia
  • Publication number: 20200080185
    Abstract: Metallic materials with multimodal microstructure and methods of forming the metallic materials are disclosed. Exemplary methods allow for tuning of desired properties of the metallic materials and of devices including the metallic materials.
    Type: Application
    Filed: September 11, 2019
    Publication date: March 12, 2020
    Inventors: Jagannathan Rajagopalan, Rohit Berlia