Patents by Inventor Rohit Bhosale

Rohit Bhosale has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8908728
    Abstract: A transistor outline package with integrated thermoelectric cooler is disclosed. The thermoelectric cooler is arranged on a heatsink which extends vertically into the housing of the transistor outline package.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: December 9, 2014
    Assignee: Schott AG
    Inventors: George Lin Huikai, Amy Soon Li Ping, Tetsushi Morikawa, Rohit Bhosale, Shaifullah Bin Mohamed Kamari
  • Patent number: 8796709
    Abstract: A housing for radiation-emitting or radiation-receiving optoelectronic components such as LEDs and a method for producing the housing are provided. The housing has a base part and a head part that are joined by a glass layer. The top face of the base part defines an assembly region for an optoelectronic functional element and is also a heat sink for the optoelectronic functional element. The head part extends at least in sections over the peripheral extent of the assembly region, and above the assembly region it forms a passage area for the radiation emitted from or to be received by the optoelectronic functional element.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: August 5, 2014
    Assignee: Schott AG
    Inventors: Matthias Rindt, Josef Kiermeier, Thomas Zetterer, Robert Hettler, Shaifullah Bin Mohamed Kamari, Lea-Li Chew, Rohit Bhosale
  • Publication number: 20110108857
    Abstract: The present invention relates to a housing for radiation-emitting or radiation-receiving optoelectronic components, such as LEDs, and to a method for producing said housing. The housing comprises a composite assembly comprising a base pan (1) and a head pan (5) which are connected by means of a glass layer (2). One section of the top side of the base pan defines a mounting region (12) for an optoelectronic functional element (60) and is additionally a heal sink for the optoelectronic functional element. The head pan extends, at least in sections, over the periphery of the mounting region and forms, above the mounting region, a passage region (52, 61) for the radiation emitted by the optoelectronic functional element or the radiation to be received.
    Type: Application
    Filed: April 29, 2009
    Publication date: May 12, 2011
    Applicant: SCHOTT AG
    Inventors: Matthias Rindt, Josef Kiermeier, Thomas Zetterer, Robert Hettler, Shaifullah Bin Mohamed Kamari, Lea-Li Chew, Rohit Bhosale
  • Patent number: 7638758
    Abstract: The electronic package contains an electronic component or components generating and/or receiving light-based signals, an optical element or elements for transceiving the signals and a housing encapsulating the electronic component or components. According to the invention the optical elements for transceiving the signals are diffractive/refractive optical elements (D/ROEs), which are also part of a sealing device for the housing. Accordingly, the diffractive/refractive optical elements (D/ROEs) have both optical and sealing functions.
    Type: Grant
    Filed: July 25, 2005
    Date of Patent: December 29, 2009
    Assignee: Schott AG
    Inventor: Rohit Bhosale
  • Publication number: 20070075643
    Abstract: The invention is directed to a lighting device, particularly a high-pressure metal halide lamp, wherein a material combination of the body, frit and base materials is selected such that: a. the Coefficient of Thermal Expansion of the material of the frit material (CTEfrit) matches with the Coefficients of Thermal Expansion of the material of the lamp base (CTEbase) and the material of the body (CTEbody), respectively, or, b. the material of the frit (CTEfrit) bridges with the Coefficients of Thermal Expansion of the material of the lamp base (CTEbase) and the material of the body (CTEbody), respectively, at least at the joining surfaces of the body, frit and base materials, to sustain a hermetic bonding and withstand pressure and temperature conditions.
    Type: Application
    Filed: September 27, 2006
    Publication date: April 5, 2007
    Inventors: Rohit Bhosale, Jorn Besinger, Robert Hettler, Dieter Godeke, Susanne Kiermayer, Claudia Schmidpeter, Ulrich Peuchert, Thilo Zachau
  • Publication number: 20070075644
    Abstract: The invention relates to a bonding system method and for the fabrication of a bonding system, as well as to a light device formed using the method of the invention. The bonding of the two components which are to be joined, whereby at least one of the two components consists at least partially, preferably completely of glass or glass-ceramics, in other words of a glass-based material, is achieved by way of the following methods on their own merit. Through material sealing when utilizing an inorganic glass-based solder material or through sealing mechanisms without solder material by utilizing tensile stress and/or compressive strain conditions, at least in a high temperature range.
    Type: Application
    Filed: September 14, 2006
    Publication date: April 5, 2007
    Inventors: Ulrich Peuchert, Thilo Zachau, Rohit Bhosale, Jorn Besinger, Dirk Sprenger, Kurt Nattermann, Henk Elst
  • Publication number: 20060027731
    Abstract: The electronic package contains an electronic component or components generating and/or receiving light-based signals, an optical element or elements for transceiving the signals and a housing encapsulating the electronic component or components. According to the invention the optical elements for transceiving the signals are diffractive/refractive optical elements (D/ROEs), which are also part of a sealing device for the housing. Accordingly, the diffractive/refractive optical elements (D/ROEs) have both optical and sealing functions.
    Type: Application
    Filed: July 25, 2005
    Publication date: February 9, 2006
    Inventor: Rohit Bhosale