Abstract: In one embodiment, an apparatus includes an optical module comprising a first end for insertion into a network device and a second end extending from the network device when the optical module is inserted into the network device, and a temperature indicator thermally coupled to the optical module and extending from said second end of the optical module. The temperature indicator provides an indication that a surface temperature of the optical module exceeds a predefined safe touch temperature limit.

Abstract: A rack-mountable heat-exchanger for modular electronic systems is provided that include a heat exchanger including ambient air inlets and outlets forming an ambient airflow path in a first direction, and recirculating air inlets and outlets forming a recirculating airflow path in a second direction perpendicular to the first direction separated from the ambient airflow path; housing for an electronic device, the housing including internal air inlets and outlets forming an internal airflow path; a first duct configured to link the recirculating air outlet to the internal air inlet; a second duct configured to link the recirculating air inlet to the internal air outlet; and fan assemblies located one of the airflow path, configured to propel air through the heat exchanger in the respective airflow path.

Abstract: In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.

Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

Abstract: In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes a mating surface. The TIM includes a first surface that is coupled to the mating surface and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a shape memory alloy (SMA) element. When the SMA element is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the SMA element moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

Abstract: An apparatus includes a tray, a shaft connected to the tray, a bracket that secures the tray to a networking device such that the tray is distanced from a surface of the networking device, and a support post coupled to the tray via the shaft, the support post including: a rotating pin having a cylindrical passage through which the shaft passes, the rotating pin being coupled to the support post to allow the support post to rotate about the rotating pin and about the shaft, and a locking pin having a latch that is configured to engage with a corresponding opening on the tray to secure the support post to the tray.

Abstract: In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

Abstract: In one embodiment, an apparatus includes an optical module comprising a first end for insertion into a network device and a second end extending from the network device when the optical module is inserted into the network device, and a temperature indicator thermally coupled to the optical module and extending from said second end of the optical module. The temperature indicator provides an indication that a surface temperature of the optical module exceeds a predefined safe touch temperature limit.

Abstract: A method that includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.

Abstract: In one embodiment, a method includes detecting reverse rotation of a fan inserted into a modular electronic system comprising at least one other fan, wherein the reverse rotation of the fan is caused by a back pressure generated by the other fan rotating in a forward direction, applying current pulses to stop reverse rotation of the inserted fan and start rotation of the fan in a forward direction, and operating all of the fans with rotation in the forward direction.

Abstract: A system includes a tray, where the tray includes a rail and a bracket that secures the rail to a networking device such that the rail is distanced from a surface of the networking device. A support post is removably coupled to the rail. The support post includes a first support member and a second support member vertically displaced from the first support member, where each of the first and second support members includes a support structure that supports a cable connected with a port at the surface of the networking device and routes the cable away from the networking device to another location distanced from the networking device. The cable supported by the first support member is separated and segregated from the cable supported by the second support member. With minimal touch, a support post can be moved from one location to another along the rail.

Abstract: In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.

Abstract: In one embodiment, a modular electronic system includes a front panel comprising openings for receiving a plurality of modules, a removable fan tray comprising a plurality of fans for cooling one or more of the modules with airflow entering the modular electronic system at the front panel when the plurality of fans are operating, and a fan tray channel for receiving the fan tray and positioning the fans in a row generally parallel to the front panel. The channel extends from one of the openings in the front panel and is contained within a horizontal plane in the modular electronic system.

Abstract: In one embodiment, an apparatus includes a module receivable in a modular electronic system, arms extending from a front panel of the module, and a cable support bracket connected to the arms. The cable support bracket is slidably connected to the arms to change a distance between the cable support bracket and the front panel of the module.

Abstract: In one embodiment, an apparatus includes a fan tray comprising a plurality of fans for cooling modules within a modular electronic system with airflow from a front of the modular electronic system to a back of the modular electronic system, and a hinge member for connecting the fan tray to a front panel of the modular electronic system with the fans positioned in front of the modules. The fan tray is rotatable on the hinge member for movement away from the front panel to allow for replacement of one of the modules.

Abstract: An apparatus includes a tray, a shaft connected to the tray, a bracket that secures the tray to a networking device such that the tray is distanced from a surface of the networking device, and a support post coupled to the tray via the shaft, the support post including: a rotating pin having a cylindrical passage through which the shaft passes, the rotating pin being coupled to the support post to allow the support post to rotate about the rotating pin and about the shaft, and a locking pin having a latch that is configured to engage with a corresponding opening on the tray to secure the support post to the tray.

Abstract: A system includes a tray, where the tray includes a rail and a bracket that secures the rail to a networking device such that the rail is distanced from a surface of the networking device. A support post is removably coupled to the rail. The support post includes a first support member and a second support member vertically displaced from the first support member, where each of the first and second support members includes a support structure that supports a cable connected with a port at the surface of the networking device and routes the cable away from the networking device to another location distanced from the networking device. The cable supported by the first support member is separated and segregated from the cable supported by the second support member. With minimal touch, a support post can be moved from one location to another along the rail.

Abstract: In one embodiment, a cable management bracket for managing cables connected to a modular electronic system mounted on a rack comprises a fixed portion and a rotatable portion extending from the fixed portion and comprising a support member for supporting the cables, the rotatable portion rotatable with the cables to allow for removal and insertion of a module of the modular electronic system.