Patents by Inventor Rohn Kenneth SERAPIO

Rohn Kenneth SERAPIO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tapeless leadframe package with exposed integrated circuit die
    Patent number: 11916090
    Abstract: A first side of a tapeless leadframe package is etched to form a ring shaped protrusion and a lead protrusion extending from a base layer. An integrated circuit die is mounted to tapeless leadframe package in flip chip orientation with a front side facing the first side. An electrical and mechanical attachment is made between a bonding pad of the integrated circuit die and the lead protrusion. A mechanical attachment is made between the front side of the integrated circuit die and the ring shaped protrusion. The integrated circuit die and the protrusions from the tapeless leadframe package are encapsulated within an encapsulating block. The second side of the tapeless leadframe package is then etched to remove portions of the base layer and define a lead for a leadframe from the lead protrusion and further define a die support for the leadframe from the ring shaped protrusion.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: February 27, 2024
    Assignee: STMicroelectronics, Inc.
    Inventors: Aaron Cadag, Rohn Kenneth Serapio, Ela Mia Cadag
  • TAPELESS LEADFRAME PACKAGE WITH EXPOSED INTEGRATED CIRCUIT DIE
    Publication number: 20220005857
    Abstract: A first side of a tapeless leadframe package is etched to form a ring shaped protrusion and a lead protrusion extending from a base layer. An integrated circuit die is mounted to tapeless leadframe package in flip chip orientation with a front side facing the first side. An electrical and mechanical attachment is made between a bonding pad of the integrated circuit die and the lead protrusion. A mechanical attachment is made between the front side of the integrated circuit die and the ring shaped protrusion. The integrated circuit die and the protrusions from the tapeless leadframe package are encapsulated within an encapsulating block. The second side of the tapeless leadframe package is then etched to remove portions of the base layer and define a lead for a leadframe from the lead protrusion and further define a die support for the leadframe from the ring shaped protrusion.
    Type: Application
    Filed: June 9, 2021
    Publication date: January 6, 2022
    Applicant: STMicroelectronics, Inc.
    Inventors: Aaron CADAG, Rohn Kenneth SERAPIO, Ela Mia CADAG