Patents by Inventor Rok Park Buckley

Rok Park Buckley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9889951
    Abstract: A heat transfer assembly (HTA) includes an equipment panel having a first longitudinal length and a first radiator panel that is coupled to one of an east end and a west end of the equipment panel. The first radiator panel is longer in the longitudinal direction than the equipment panel and has least one longitudinal heat pipe. The HTA also includes at least one flexible heat pipe having a first rigid tube coupled to the equipment panel, a second rigid tube thermally coupled to the first longitudinal heat pipe, and a flexible tube coupled between the first and second rigid tubes. The equipment panel is configured to retain an equipment module in thermal contact with the first rigid tube.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: February 13, 2018
    Assignee: Lockheed Martin Corporation
    Inventors: Hamilton Wong, Rok Park Buckley
  • Patent number: 8967547
    Abstract: A heat transfer assembly can include an equipment panel having an east end and a west end. East and west radiator panels are coupled to the east and west ends, respectively, of the equipment panel. The assembly also includes a plurality of flexible heat pipes each having a first rigid tube thermally coupled to the east radiator panel, a second rigid tube coupled to the equipment panel, a third rigid tube thermally coupled to the west radiator panel, a first flexible tube sealingly coupled between the first and second rigid tubes, and a second flexible tube sealingly coupled between the second and third rigid tubes. The equipment panel is configured to retain one or more equipment modules in thermal contact with the second rigid tube of at least one of the plurality of flexible heat pipes.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: March 3, 2015
    Assignee: Lockheed Martin Corporation
    Inventors: Hamilton Wong, Neil E. Goodzeit, Rok Park Buckley, David J. Hentosh