Patents by Inventor Roland Bader
Roland Bader has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240261890Abstract: In one aspect, the invention relates to a calibration module (KM) for calibrating a real-time estimator (ES), which is intended for quality estimation of a cutting method using a laser cutting machine (L), comprising: —a load interface (E) for loading a quality estimation result (q?) of the real-time estimator (ES): —a first processor (P1), which is intended to provide a quality measurement result (q) of the cutting edge of the workpiece, wherein the quality measurement result (q) can be provided in particular by detecting (S21) measurement signals of a cutting edge of a finished cut workpiece by means of a measuring device (K): —and wherein a second processor (P2) is intended to compare the loaded quality estimation result (q?) with the quality measurement result (q) and based on the result: is intended to calculate a calibration data set (k) for calibrating the real-time estimator (ES)—an output interface (A) which is intended to output the calculated calibration data set (k).Type: ApplicationFiled: May 30, 2022Publication date: August 8, 2024Inventors: Andreas LUEDI, Roland BADER, Stefan Alfons JACOBI
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Patent number: 11651484Abstract: A method for process monitoring of a laser machining process for estimating a machining quality is dicloses. The method may include steps, which are carried out in real time during the machining process of providing at least one captured first signal sequence with a first feature form a machining zone, providing at least one captured second signal sequence with a second feature from the machining zone, and accessing a trained neural network with at least the recorded first and second signal sequences in order to calculate a result for estimating the machining quality.Type: GrantFiled: March 3, 2021Date of Patent: May 16, 2023Assignee: BYSTRONIC LASER AGInventors: Andreas Luedi, Roland Bader, Matthias Schranz, Joël Baertschi
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Publication number: 20230118061Abstract: The present invention relates, in one aspect, to a method for process monitoring of a laser machining process for estimating a machining quality, having the following steps, which are carried out in real time during the machining process: —providing (S2) at least one captured first signal sequence with a first feature from the machining zone; —providing (S3) at least one captured second signal sequence with a second feature from the machining zone; —accessing (S4) a trained neural network with at least the recorded first and second signal sequence in order to calculate (S5) a result for estimating the machining quality.Type: ApplicationFiled: March 3, 2021Publication date: April 20, 2023Inventors: Andreas LUEDI, Roland BADER, Matthias SCHRANZ, Joël BAERTSCHI
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Publication number: 20230044332Abstract: A method of laser machining a workpiece is provided, with a) generation of a machining laser beam and imaging of the machining laser beam on the workpiece with at least one optical element; b) machining of the workpiece with the imaged machining laser beam and generation of a cutting gap in the workpiece; c) monitoring of at least one geometric parameter of the cutting gap during step b); and d) regulating the monitored geometric parameter of the cutting gap during step c) for harmonisation with a target value of the geometric parameter of the cutting gap. Further provided is an apparatus for laser machining a workpiece.Type: ApplicationFiled: January 22, 2021Publication date: February 9, 2023Inventors: Andreas LÜDI, Titus HAAS, Roland BADER
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Patent number: 11364574Abstract: Controlling a beam cutting device having a cutting tool is disclosed. A workpiece part can be cut out of a workpiece along a cutting contour. A cutting plan for the workpiece having a cutting contour for a workpiece part to be cut out of the workpiece is specified. Subsequently, the relative position of the workpiece and/or of the cutting plan and/or of the workpiece part to be cut out is determined. The relative position of the at least one support point of the workpiece support is determined. Subsequently, at least one risk region on the cutting contour of the workpiece part to be cut out is determined, followed by the defining of at least one starting-cut point and/or one cut-away point for the cutting tool on the cutting contour of the workpiece part to be cut out. A computer-implemented method and a beam cutting device is also disclosed.Type: GrantFiled: August 9, 2018Date of Patent: June 21, 2022Assignee: BYSTRONIC LASER AGInventor: Roland Bader
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Patent number: 11224938Abstract: A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. According to the disclosure the cutting process is interrupted after a first partial processing step, whereupon a partial section (K1 . . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted, and the cutting process continued with the changed set of cutting parameters.Type: GrantFiled: April 28, 2020Date of Patent: January 18, 2022Inventors: Andreas Lüdi, Roland Bader
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Publication number: 20210322994Abstract: Body fluid sample carrier for use in a body fluid analyser and body fluid analyser using a body fluid sample carrier, wherein the body fluid sample carrier has a plurality of rack receptacles and a plurality of marker receptacles for receiving corresponding markers in order to improve the association between racks positioned on the carrier and the correct position on the carrier.Type: ApplicationFiled: February 1, 2019Publication date: October 21, 2021Inventors: Martin MÜLLER, Roland BADER
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Publication number: 20210138589Abstract: The invention relates to a method for controlling a jet cutting device (15) having a cutting tool (21), by means of which at least one workpiece part (18) can be cut out of a workpiece (16) along a cutting contour (17). At least one cutting plan (48) for the workpiece (16) having at least one cutting contour (17) for at least one workpiece part (18) to be cut out of the workpiece (16) is specified (step a)). Subsequently, the relative position of the workpiece (16) and/or of the cutting plan (48) and/or of the workpiece part (18) to be cut out is determined (step b)). Then, the relative position of the at least one support point (32) of the workpiece support (30; 130) is determined (step c)).Type: ApplicationFiled: August 9, 2018Publication date: May 13, 2021Inventor: Roland Bader
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Publication number: 20200254559Abstract: A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. According to the disclosure the cutting process is interrupted after a first partial processing step, whereupon a partial section (K1 . . . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted, and the cutting process continued with the changed set of cutting parameters.Type: ApplicationFiled: April 28, 2020Publication date: August 13, 2020Inventors: Andreas LÜDI, Roland BADER
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Patent number: 10675709Abstract: A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. The cutting process is interrupted after a first partial processing step, whereupon a partial section (K1 . . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted and the cutting process continued with the changed set of cutting parameters.Type: GrantFiled: October 21, 2016Date of Patent: June 9, 2020Assignee: BYSTRONIC LASER AGInventors: Andreas Lüdi, Roland Bader
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Patent number: 10646961Abstract: A laser-machining device includes an arrangement for producing and guiding a working laser beam. The arrangement includes a nozzle having an opening for emission of the working laser beam to a machining zone. An optical axis is defined in the arrangement and at least one element focuses the working laser beam near the opening of the nozzle. The machining process is monitored via at least one group of detector arrangements for a radiation characteristic of the machining process and an associated evaluating unit. The detector arrangements of each group are arranged in a ring shape about the optical axis. The observation direction of the detector arrangements extends, at least in a sub-region, between the focusing element closest to the machining zone and the machining zone, at a polar angle, in relation to the optical axis of the working laser beam.Type: GrantFiled: May 13, 2016Date of Patent: May 12, 2020Assignee: BYSTRONIC LASER AGInventors: Roland Bader, Andreas Lüdi
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Publication number: 20180147671Abstract: A laser-machining device is disclosed. The device includes an arrangement for producing and guiding a working laser beam. The arrangement includes a nozzle having an opening for emission of the working laser beam to a machining zone. An optical axis is defined in the arrangement and at least one element focuses the working laser beam near the opening of the nozzle. The machining process is monitored via at least one group of detector arrangements for a radiation characteristic of the machining process and an associated evaluating unit. The detector arrangements of each group are arranged in a ring shape about the optical axis. The observation direction of the detector arrangements extends, at least in a sub-region, between the focusing element closest to the machining zone and the machining zone, at a polar angle, in relation to the optical axis of the working laser beam.Type: ApplicationFiled: May 13, 2016Publication date: May 31, 2018Inventors: Roland BADER, Andreas LÜDI
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Publication number: 20170113300Abstract: A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. The cutting process is interrupted after a first partial processing step, whereupon a partial section (K1 . . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted and the cutting process continued with the changed set of cutting parameters.Type: ApplicationFiled: October 21, 2016Publication date: April 27, 2017Applicant: Bystronic Laser AGInventors: Andreas LÜDI, Roland BADER
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Patent number: 9291462Abstract: A method for position determination for a motor vehicle includes the acts of: satellite based determination of a geographical position of the motor vehicle, providing digital road map data, which include at least information about road segments in the surroundings of the geographical position; carrying out a first determining step for determining at least a first road segment, on which the motor vehicle is located with high probability, wherein the first determining step is based on a matching of the geographical position with the digital road map data; retrieval of traffic lane data, regarding at least the number of traffic lanes for the first road segment, from the road map database; determining the traffic lane, in which the motor vehicle is currently traveling, by use of at least the traffic lane data; and carrying out a second determining step for determining a second road segment, on which the motor vehicle is located with high probability, wherein the second determining step is based on a matching of tType: GrantFiled: February 4, 2011Date of Patent: March 22, 2016Assignee: Bayerische Motoren Werke AktiengesellschaftInventors: Axel Jansen, Robert Hein, Roland Bader, Carsten Isert
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Publication number: 20110196608Abstract: A method for position determination for a motor vehicle includes the acts of: satellite based determination of a geographical position of the motor vehicle, providing digital road map data, which include at least information about road segments in the surroundings of the geographical position; carrying out a first determining step for determining at least a first road segment, on which the motor vehicle is located with high probability, wherein the first determining step is based on a matching of the geographical position with the digital road map data; retrieval of traffic lane data, regarding at least the number of traffic lanes for the first road segment, from the road map database; determining the traffic lane, in which the motor vehicle is currently traveling, by use of at least the traffic lane data; and carrying out a second determining step for determining a second road segment, on which the motor vehicle is located with high probability, wherein the second determining step is based on a matching of tType: ApplicationFiled: February 4, 2011Publication date: August 11, 2011Applicant: Bayerische Motoren Werke AktiengesellschaftInventors: Axel JANSEN, Robert Hein, Roland Bader, Carsten Isert