Abstract: A medical device management system includes a plurality of medical devices communicating with a local area network. A local network appliance forwards device data gathered from the medical devices to a cloud based service that processes and organizes the device data. The cloud based service may also be in communication with a sales database, an ERP system, a manufacturing database, and/or other databases. Users may request device data from the cloud based service using a conventional web browser. The device data may include location data, usage data, repair data, etc. In some cases, device data may come from a variety of sources and the cloud based service collates the multi-source data together into a set of records that form a digital replica of the actual medical device.

Abstract: A multilayer rigid flex printed circuit board wherein the board laminate comprises a basestock composite containing a flexible core, formed by laminating a first conductive layer to a flexible insulator layer, a second insulator layer affixed to the basestock, said second insulator layer having a cutout region proximate to the flexible core of the basestock composite to expose a portion of said first conducting layer on said flexible core, a second conductive layer attached to said second insulator layer said second conductive layer having a cutout region proximate to the flexible core of the basestock composite, and a photo-imageable soldermask applied to the exposed portion said first conducting layer, and to the second conductive layer, wherein said photoimageable soldermask allows for photo definition of openings on the conductive layers to which it is applied.

Abstract: A multilayer rigid flex printed circuit board wherein the board laminate comprises a basestock composite containing a flexible core, formed by laminating a first conductive layer to a flexible insulator layer, a second insulator layer affixed to the basestock, said second insulator layer having a cutout region proximate to the flexible core of the basestock composite to expose a portion of said first conducting layer on said flexible core, a second conductive layer attached to said second insulator layer said second conductive layer having a cutout region proximate to the flexible core of the basestock composite, and a photo-imageable soldermask applied to the exposed portion said first conducting layer, and to the second conductive layer, wherein said photoimageable soldermask allows for photo definition of openings on the conductive layers to which it is applied.

Abstract: A novel basestock composite comprising two copper conducting sheets bonded to insulator layers comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers are both affixed to a release layer which is not coextensive with the borders of the insulator layers such that when the basestock is cut at a point internal to its borders and into the release layer the two basestock composites can be separated.

Abstract: A rigid flex printed circuit board wherein the flex section of said board comprises a basestock composite with edges formed by laminating a conductive layer to a flexible insulator layer, the conductor layer containing at least one conductive pathway and the flexible insulator layer comprises fibers dispersed in a matrix polymer. The fibers are oriented with respect to the conductive pathway so that the conductive pathway is substantially non-aligned with said fibers, substantially along an entirety of the conductive pathway in the flex section so as to be flexible.

Abstract: Multilayer rigid/flex printed circuits are fabricated from a novel basestock composite (10) comprising two copper conducting sheets (12, 14), bonded to insulator layers (16, 18) comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers (16, 18) are both affixed to a release layer (20) is not coextensive with the borders of the insulator layers, then can the basestock composite be imaged and etched on the conductor layers to form conductor patterns (22) and the basestock can be cut at a point (24) internal to its borders and into the release layer (20) thereby separating two imaged and etched conductor layers (22), along with removal of the release material from the insulating layer.

Abstract: A multilayer rigid flex printed circuit board, wherein the board laminate comprises a double-sided basestock composite, formed by laminating two conducting sheets (12 and 14) to an insulating layer, said insulator layer contacting a flexible core (20), a second insulator layer (24 and 26) affixed to each side of the basestock, said insulator having a cutout region proximate to the flexible core of the basestock composite, a flexible layer (28 and 30) affixed to said cutout regions with an adhesive, wherein said flexible layer contacts the conducting layers and abuts and overlaps a portion of the second insulator layer such that upon stacking of the board laminate a hollow region (32) is produced as between the stacked laminate sections.

Abstract: Multilayer rigid flex printed circuits are fabricated from a novel basestock composite comprising two copper conducting sheets, bonded to insulator layers comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers are both affixed to Kapton layers wherein said Kapton layers are not coextensive with the borders of the insulator layers. The basestock composite can then be imaged and etched on the conductor layers to form conductor patterns, laminated or coated with a coverlay of dielectric material, and the basestock can be cut at a point internal to its borders and into the Kapton layers thereby separating two imaged and etched conductor layers.

Abstract: Multilayer rigid flex printed circuits are fabricated from a novel basestock composite comprising two copper conducting sheets, bonded to insulator layers comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers are both affixed to Kapton layers wherein said Kapton layers are not coextensive with the borders of the insulator layers. The basestock composite can then be imaged and etched on the conductor layers to form conductor patterns, laminated or coated with a coverlay of dielectric material, and the basestock can be cut at a point internal to its borders and into the Kapton layers thereby separating two imaged and etched conductor layers.

Abstract: A method and an apparatus are provided for safely testing an autotransformer of power distribution lines which has an identified centre tap ground connector, a primary winding terminal and a secondary winding terminal. The method for safely testing the autotransformer includes the steps of disconnecting the terminals and connector of the autotransformer from the distribution lines, applying a first testing AC voltage having a maximum value of substantially one volt only between a first of the terminals and the ground connector, measuring a first value of an AC voltage between the first terminal and the ground connector, and measuring a second value of an AC voltage between the second of the terminals and the ground connector.

Abstract: In a process for manufacturing a rigid-flex printed circuit wherein a rigid insulating layer supports one portion of the printed circuit and a flexible insulator supports another portion thereof to furnish flexible leads for connection the printed circuit to an operative device, a first assembly is provided comprising a curable prepreg insulator layer having an opening for the flexible leads. A flexible sheet spans the opening, and the assembly is pressed with one surface in contact with a smooth hard surface while the other surface is supported by a flowable curable prepreg layer. The insulator and flowable layers are a release layer which prevents bonding between the prepreg layers throughout most of the areas while permitting bonding along the edges. The assembly is maintained under heat and pressure to partially cure both prepreg layers and bond the flexible sheet to the edges of the opening and bond the edges of the prepregs together to form a flat rigid sandwich.

Abstract: In a process for manufacturing a rigid-flex printed circuit wherein a rigid insulating layer supports one portion of the printed circuit and a flexible insulator supports another portion thereof to furnish flexible leads for connection the printed circuit to an operative device, a first assembly is provided comprising a curable prepreg insulator layer having an opening for the flexible leads. A flexible sheet spans the opening, and the assembly is pressed with one surface in contact with a smooth hard surface while the other surface is supported by a flowable curable prepreg layer. The insulator and flowable layers are a release layer which prevents bonding between the prepreg layers throughout most of the areas while permitting bonding along the edges. The assembly is maintained under heat and pressure to partially cure both prepreg layers and bond the flexible sheet to the edges of the opening and bond the edges of the prepregs together to form a flat rigid sandwich.