Patents by Inventor Roland Cordero

Roland Cordero has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package with leadframe enhancement and method of manufacturing the same
    Patent number: 7109570
    Abstract: An integrated circuit package having a die pad and a plurality of leads is disclosed. At least one of the plurality of leads has a recess formed in a first face thereof. The package also has an integrated circuit chip coupled to the die pad through an adhesive layer. A plurality of wires each link a first face of the integrated circuit chip to one of the plurality of leads. An encapsulant encloses the integrated circuit chip, the plurality of wires, the die pad, and a portion of each of the plurality of leads. The encapsulant forms a plurality of side walls which slant downward and outward. At least one of the side walls intersects with the first face of the at least one lead within the side walls of the recess formed therein.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: September 19, 2006
    Assignee: United Test and Assembly Test Center Ltd.
    Inventors: Rodel Manalac, Hien Boon Tan, Francis Poh, Jaime Siat, Roland Cordero
  • Integrated circuit package with leadframe enhancement and method of manufacturing the same
    Publication number: 20050051876
    Abstract: An integrated circuit package having a die pad and a plurality of leads is disclosed. At least one of the plurality of leads has a recess formed in a first face thereof. The package also has an integrated circuit chip coupled to the die pad through an adhesive layer. A plurality of wires each link a first face of the integrated circuit chip to one of the plurality of leads. An encapsulant encloses the integrated circuit chip, the plurality of wires, the die pad, and a portion of each of the plurality of leads. The encapsulant forms a plurality of side walls which slant downward and outward. At least one of the side walls intersects with the first face of the at least one lead within the side walls of the recess formed therein.
    Type: Application
    Filed: March 30, 2004
    Publication date: March 10, 2005
    Inventors: Rodel Manalac, Hien Tan, Francis Poh, Jaime Slat, Roland Cordero