Abstract: A speaker integrated into a scanner is provided. The scanner comprises speaker firmware that presents the scanner as two separate logical devices to an Operating System (OS) of a connected host device. The integrated speaker of the scanner can be configured from the OS of the host device to be a primary or secondary speaker of the host device. The host device ports audio generated data on the host device over a wired or wireless connection to the speaker firmware, and the speaker firmware plays the host-generated audio data over or through the integrated speaker of the scanner.

Abstract: A speaker integrated into a scanner is provided. The scanner comprises speaker firmware that presents the scanner as two separate logical devices to an Operating System (OS) of a connected host device. The integrated speaker of the scanner can be configured from the OS of the host device to be a primary or secondary speaker of the host device. The host device ports audio generated data on the host device over a wired or wireless connection to the speaker firmware, and the speaker firmware plays the host-generated audio data over or through the integrated speaker of the scanner.

Abstract: A reagent chemical is directed along a first pipe portion (20) that extends along one side of the array of wafers (14) and which contains a plurality of jets (33) for projecting the chemical toward the wafers. A plurality of second pipe portions (21) transmits an inert gas, with each pipe portion having a plurality of jets (34) for projecting the gas toward the floor of the tank.

Abstract: A template (148), having at least one opening (152) therein, is placed in close, spaced, relation to a PCB (30). The opening (152) is circular with a small semicircular notch (154) on the periphery thereof. A chip carrier (10) is positioned in the opening (152) with one corner (22) loosely captured in the notch (154). The PCB (30), template (148) and the loosely captured chip carriers (10) are placed in a condensation soldering facility to reflow the solder. As the solder reflows the chip carrier (10) rotates slightly about the loosely captured corner (22) to self align pads (33) on the PCB (30) to leads (16) on the chip carrier (10) as the bond is being formed.