Abstract: An assembly comprises an element that is mechanically stressed during operation or transport in at least one loading direction, and a decoupling joint for mechanically mounting the element. The decoupling joint effects at least partial decoupling in the loading direction. The decoupling joint is composed of a plurality of separate joint segments. At least two of these joint segments are shifted relative to one another in the loading direction in a stepped arrangement.

Abstract: A component of an optical system comprises an optical element and a first channel system outside the optical element and through which a cooling fluid can flow, such that, during operation of the optical system, heat generated by electromagnetic radiation incident on the optical element is absorbed and drawn off via the cooling fluid in the first channel system. The component also includes a second channel system through which a cooling fluid can flow to at least partially thermally shield a region of the component from the heat absorbed by the cooling fluid in the first channel system. The second channel system is outside the first channel system in the radial direction relative to the center of the optical element.

Abstract: A projection exposure apparatus for semiconductor lithography includes a cooling device for cooling components of the projection exposure apparatus. The cooling device contains a liquid cooling medium having a thermal conductivity of greater than 5W/mK.