Abstract: A packaging technology for MECS components, which allows the realization of extremely robust components which are resistant to high temperatures and media. Such a component includes at least one micro-electrochemical sensor (MECS) component having a diaphragm, which is developed in a layer construction on the substrate of the component and spans an opening in the substrate rear side, and a carrier for the mounting and electrical contacting of the MECS component on an application circuit board. The MECS component is bonded to the carrier in flip chip technology, so that a hermetically tight mechanical connection between the top surface of the MECS component and the carrier surface exists at least in one connection region, and an electric connection between the MECS component and the carrier exists in at least one contact area.

Abstract: A packaging technology for MECS components, which allows the realization of extremely robust components which are resistant to high temperatures and media. Such a component includes at least one micro-electrochemical sensor (MECS) component having a diaphragm, which is developed in a layer construction on the substrate of the component and spans an opening in the substrate rear side, and a carrier for the mounting and electrical contacting of the MECS component on an application circuit board. The MECS component is bonded to the carrier in flip chip technology, so that a hermetically tight mechanical connection between the top surface of the MECS component and the carrier surface exists at least in one connection region, and an electric connection between the MECS component and the carrier exists in at least one contact area.

Abstract: An assembly and connection technology for a sensor system, including a sensor element having circuit elements integrated into the top side and a carrier for the sensor element, which is simple and robust and which does not require any further packaging measures for protecting the circuit elements and electrical terminals of the sensor elements after the isolation of the sensor elements. For this purpose, the carrier is provided with through contacts. In addition, the sensor element is installed in flip-chip technology on the carrier, so that the top side of the sensor element is at least regionally capped by the carrier and the circuit elements of the sensor element can be electrically contacted from the rear side of the carrier via the through contacts.

Abstract: In the measurement of sensor elements in a wafer composite, whereby non-electric stimuli are to be applied to the sensor elements, a semiconductor wafer having a multitude of sensor elements, each sensor element having a voltage supply connection, a grounded connection, and at least one sensor signal output, is configured such that a bus system is integrated in the semiconductor wafer, to which bus system at least the grounded connections of the sensor elements are connected and via which a supply voltage may be applied to the sensor elements, and that each sensor element is equipped with at least one controllable switching element for selecting the sensor element, so that only a selected sensor element supplies a sensor signal to a diagnosis device.

Abstract: In the measurement of sensor elements in a wafer composite, whereby non-electric stimuli are to be applied to the sensor elements, a semiconductor wafer having a multitude of sensor elements, each sensor element having a voltage supply connection, a grounded connection, and at least one sensor signal output, is configured such that a bus system is integrated in the semiconductor wafer, to which bus system at least the grounded connections of the sensor elements are connected and via which a supply voltage may be applied to the sensor elements, and that each sensor element is equipped with at least one controllable switching element for selecting the sensor element, so that only a selected sensor element supplies a sensor signal to a diagnosis device.

Abstract: A micromechanical pressure sensor includes a substrate having a front side and a back side, the front side facing a medium and the back side being situated on the opposite side of the substrate. A sensor diaphragm having at least one sensor area is situated on the front side, and a recess or cavity is situated behind the sensor diaphragm, and electrical contacting is provided on the back side.

Abstract: The present invention describes a device having a housing and at least one electrical component, the housing having at least one of the electrical components and being filled at least partially by a passivating agent. Furthermore, it is provided that the electrical component is covered at least partially by the passivating agent. Now, the crux of the present invention is that an additional material layer is applied on top of the passivating agent. Using this additional material layer, a device is able to be implemented in a simple and cost-effective construction, that is resistive to environmental damages. This makes possible using electrical components in corrosive environments.

Abstract: A micromechanical pressure sensor includes a substrate having a front side and a back side, the front side facing a medium and the back side being situated on the opposite side of the substrate. A sensor diaphragm having at least one sensor area is situated on the front side, and a recess or cavity is situated behind the sensor diaphragm, and electrical contacting is provided on the back side.

Abstract: A micromechanical device for measuring a pressure variable and a method for manufacturing a micromechanical pressure sensor. The sensor includes, two components; a first component featuring a diaphragm made of a first material, and a second component of a second material. This second component is designed to have a thin first region and a thick second region. The first and second components are permanently joined together via the first diaphragm and at least a portion of the first region. The materials are selected such that the temperature expansion coefficient of the first material is higher than that of the second material. The first and second components are joined in such a manner that a lateral expansion of the first diaphragm caused by temperature changes is transferred to the first region of the second component as a lateral expansion as well.

Abstract: A method for adjusting the electrical resistance of an electrical resistor run running in meandering windings and situated between two layers, to a specified value at which the resistor run is produced having a lower resistance with reference to the specified value and having burn-up segments bridging meandering windings, and the adjustment is undertaken by cutting open selected burn-up segments. To achieve a simple adjusting method, constant current pulses having a controlled pulse duration are sent through the burn-up segments to cut open the burn-up segment.

Abstract: A micromechanical pressure sensor which is made up of at least one first component element and a second component element bordering on the first component element. In this context, the first component element includes at least one diaphragm and one cavity. The cavity is arranged or structured so that the medium to be measured gains access to the diaphragm through the cavity. In addition, in the second component element an opening is provided which guides the medium to be measured to the cavity. At least a part of the cavity represents an extension, without a transition, of the opening in the second component.

Abstract: A method for packaging semiconductor chips and a corresponding semiconductor chip system. The method includes making available a semiconductor chip having a diaphragm region; providing a cap over the diaphragm region, while leaving the diaphragm region open; mounting the semiconductor chip on a support frame; and providing a molded housing around the semiconductor chip and at least a partial region of the support frame for packaging the semiconductor chip.

Abstract: A micromechanical device for measuring a pressure variable and a method for manufacturing a micromechanical pressure sensor. The sensor includes, two components; a first component featuring a diaphragm made of a first material, and a second component of a second material. This second component is designed to have a thin first region and a thick second region. The first and second components are permanently joined together via the first diaphragm and at least a portion of the first region. The materials are selected such that the temperature expansion coefficient of the first material is higher than that of the second material. The first and second components are joined in such a manner that a lateral expansion of the first diaphragm caused by temperature changes is transferred to the first region of the second component as a lateral expansion as well.

Abstract: A micromechanical pressure sensor which is made up of at least one first component element and a second component element bordering on the first component element. In this context, the first component element includes at least one diaphragm and one cavity. The cavity is arranged or structured so that the medium to be measured gains access to the diaphragm through the cavity. In addition, in the second component element an opening is provided which guides the medium to be measured to the cavity. At least a part of the cavity represents an extension, without a transition, of the opening in the second component.