Abstract: The present disclosure relates to a cooling stage for cooling down a heated carrier on which a plurality of components has been mounted. Further aspects of the present disclosure relate to a pick-and-place apparatus that includes such a cooling stage and to a method for cooling down a heated carrier on which a plurality of components has been mounted. The cooling stage according to an aspect of the present disclosure uses supporting members for keeping the heated carrier separated from a cooling body. By relying on thermal convection between the heated carrier and the cooling body, dependency of the cooling stage on the type of carrier used is reduced compared to known cooling stages. For example, for different types of carries, it generally suffices to use different supporting members, e.g. having a different height, and/or to use a different temperature of the cooling body.

Abstract: A lithographic apparatus includes a substrate table to hold a substrate; a substrate table position measurement system to measure a position quantity of the substrate table, a projection system to project a patterned radiation beam onto a target portion of the substrate, a fluid supply system to supply an immersion fluid in a space between a downstream lens of the projection system and the substrate, and a fluid supply system position measurement system to measure a position quantity of the fluid supply system. To prevent a collision between the fluid supply system and the substrate table, a damage control system of the lithographic apparatus may include a calculator to calculate a dimensional quantity of a gap between the fluid supply system and the substrate table from the positioned quantity of the substrate table and the position quantity of the fluid supply system. The damage control system may generate a warning signal when the dimensional quantity goes beyond a predetermined safety level.