Abstract: A moisture-curable polyurethane hotmelt adhesive composition having high green peel strength and good creep resistance is formed from a polyester, low molecular weight polypropylene glycol and a diisocyanate, and optionally a tackifier. A method of bonding a sole to a shoe upper using the adhesive composition is also described.

Abstract: The hotmelt adhesive according to the invention containsA) at least one polyurethane prepolymer ofa) at least one polyisocyanate, more particularly toluene diisocyanate and/or MDI,b) at least one polyalkylene glycol in a concentration of more than 10% by weight, based on the hotmelt adhesive as a whole, more particularly polypropylene glycol,c) at least one polyester glycol, preferably at least two polyester glycols with different glass transition temperatures andd) at least one chain extender andB) optionally additives, such ase) a resin, more particularly a hydrocarbon resin, andf) a stabilizer, more particularly toluene sulfonyl isocyanate.The hotmelt adhesive preferably has a melt viscosity of 4 to 100 Pa.cndot.s at 170.degree. C. The PU prepolymer has only one Tg in the DSC curve. The hotmelt adhesive is distinguished by high creep resistance and high early and ultimate strengths.

Abstract: The hot-melt adhesive of the invention includesA) at least one polyurethane prepolymer ofa) at least one polyisocyanate, in particular, toluene diisocyanate and/or MDI,b) at least one polyalkylene glycol at a concentration of more than 10% by weight based on total hot-melt adhesive, in particular, polypropylene glycol,c) at least one polyester glycol, preferably of at least two polyester glycols having different glass transition temperature, andB) optional additives such asd) a resin, particularly a hydrocarbon resin, ande) a stabilizer, particularly toluenesulfonyl isocyanate.Preferably, the hot-melt adhesive has a melt viscosity ranging from 10 to 300 Pa.s at 130.degree. C. The PU pre-polymer has only one single Tg in the DSC diagram. The hot-melt adhesive is notable for its high creep resistance with similarly high initial and final strength.

Abstract: The invention relates to the use of moisture-curing PU hotmelt adhesives as molding compounds for the production of moldings, the PU hotmelt adhesives having a melt viscosity of less than 100 Pa.multidot.s at the processing temperature of 70.degree. to 190.degree. C. To produce the moldings, the molding compound is melted at temperatures of 70.degree. to 200.degree. C., the melt is injected into closed molds under an excess pressure of 1 to 50 bar, the cooled moldings are removed from the mold after a short time and are then cured with atmospheric moisture. Economic and technical advantages include distinctly lower processing pressures, expense on machinery and tooling and firm adhesion to various substrates. The moldings are heat-resistant and adhere to various substrates. They are particularly suitable for the production of electrical components.

Abstract: The hot-melt adhesive of the invention includesA) at least one polyurethane prepolymer ofa) at least one polyisocyanate, in particular, toluene diisocyanate and/or MDI,b) at least one polyalkylene glycol at a concentration of more than 10% by weight based on total hot-melt adhesive, in particular, polypropylene glycol,c) at least one polyester glycol, preferably of at least two polyester glycols having different glass transition temperature, andB) optional additives such asd) a resin, particularly a hydrocarbon resin, ande) a stabilizer, particularly toluenesulfonyl isocyanate.Preferably, the hot-melt adhesive has a melt viscosity ranging from 10 to 300 Pa.s at 130.degree. C. The PU prepolymer has only one single Tg in the DSC diagram. The hot-melt adhesive is notable for its high creep resistance with similarly high initial and final strength.