Patents by Inventor Roland Helm

Roland Helm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for an acoustic transducer and environmental sensor package
    Patent number: 10028052
    Abstract: According to an embodiment, a transducer package includes a circuit board including a port, a lid disposed over the port, an acoustic transducer disposed over the port and including a membrane, and an environmental transducer disposed at the circuit board in the port. The lid encloses a first region, and the membrane separates the port from the first region. Other embodiments include corresponding systems, apparatus, and structures, each configured to perform the actions or steps of corresponding embodiment methods.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: July 17, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Andreas Kopetz, Andreas Wiesbauer, Roland Helm, Christian Mandl, Arnaud Walther
  • Motion detection using pressure sensing
    Patent number: 9945746
    Abstract: According to an embodiment, a method of sensing motion includes receiving a first signal from a first pressure sensor and a second signal from a second pressure sensor, comparing the first signal and the second signal, and characterizing a motion based on the comparing.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: April 17, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Andreas Wiesbauer, Christian Mandl, Andreas Kopetz, Roland Helm
  • System and Method for an Acoustic Transducer and Environmental Sensor Package
    Publication number: 20170280237
    Abstract: According to an embodiment, a transducer package includes a circuit board including a port, a lid disposed over the port, an acoustic transducer disposed over the port and including a membrane, and an environmental transducer disposed at the circuit board in the port. The lid encloses a first region, and the membrane separates the port from the first region. Other embodiments include corresponding systems, apparatus, and structures, each configured to perform the actions or steps of corresponding embodiment methods.
    Type: Application
    Filed: June 12, 2017
    Publication date: September 28, 2017
    Inventors: Andreas Kopetz, Andreas Wiesbauer, Roland Helm, Christian Mandl, Arnaud Walther
  • System and method for an acoustic transducer and environmental sensor package
    Patent number: 9706294
    Abstract: According to an embodiment, a transducer package includes a circuit board including a port, a lid disposed over the port, an acoustic transducer disposed over the port and including a membrane, and an environmental transducer disposed at the circuit board in the port. The lid encloses a first region, and the membrane separates the port from the first region. Other embodiments include corresponding systems, apparatus, and structures, each configured to perform the actions or steps of corresponding embodiment methods.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: July 11, 2017
    Assignee: Infineon Technologies AG
    Inventors: Andreas Kopetz, Andreas Wiesbauer, Roland Helm, Christian Mandl, Arnaud Walther
  • Motion Detection Using Pressure Sensing
    Publication number: 20170191894
    Abstract: According to an embodiment, a method of sensing motion includes receiving a first signal from a first pressure sensor and a second signal from a second pressure sensor, comparing the first signal and the second signal, and characterizing a motion based on the comparing.
    Type: Application
    Filed: March 17, 2017
    Publication date: July 6, 2017
    Inventors: Andreas Wiesbauer, Christian Mandl, Andreas Kopetz, Roland Helm
  • Sensor structure for sensing pressure waves and ambient pressure
    Patent number: 9670059
    Abstract: In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive layer arranged on an opposite side of the electrode element from the first conductive layer. The first conductive layer and the second conductive layer may form a chamber. The pressure in the chamber may be lower than the pressure outside of the chamber.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: June 6, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Alfons Dehe, Roland Helm
  • Packaged MEMS device comprising adjustable ventilation opening
    Patent number: 9673785
    Abstract: A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: June 6, 2017
    Assignee: Infineon Technologies AG
    Inventors: Christian Herzum, Martin Wurzer, Roland Helm, Michael Kropfitsch, Stefan Barzen
  • Motion detection using pressure sensing
    Patent number: 9631996
    Abstract: According to an embodiment, a method of sensing motion includes receiving a first signal from a first pressure sensor and a second signal from a second pressure sensor, comparing the first signal and the second signal, and characterizing a motion based on the comparing.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: April 25, 2017
    Assignee: Infineon Technologies AG
    Inventors: Andreas Wiesbauer, Christian Mandl, Andreas Kopetz, Roland Helm
  • System and Method for an Acoustic Transducer and Environmental Sensor Package
    Publication number: 20160277844
    Abstract: According to an embodiment, a transducer package includes a circuit board including a port, a lid disposed over the port, an acoustic transducer disposed over the port and including a membrane, and an environmental transducer disposed at the circuit board in the port. The lid encloses a first region, and the membrane separates the port from the first region. Other embodiments include corresponding systems, apparatus, and structures, each configured to perform the actions or steps of corresponding embodiment methods.
    Type: Application
    Filed: March 18, 2015
    Publication date: September 22, 2016
    Inventors: Andreas Kopetz, Andreas Wiesbauer, Roland Helm, Christian Mandl, Arnaud Walther
  • SENSOR STRUCTURE FOR SENSING PRESSURE WAVES AND AMBIENT PRESSURE
    Publication number: 20160200567
    Abstract: In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive layer arranged on an opposite side of the electrode element from the first conductive layer. The first conductive layer and the second conductive layer may form a chamber. The pressure in the chamber may be lower than the pressure outside of the chamber.
    Type: Application
    Filed: March 23, 2016
    Publication date: July 14, 2016
    Inventors: Alfons DEHE, Roland HELM
  • Sensor structure for sensing pressure waves and ambient pressure
    Patent number: 9309105
    Abstract: In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive layer arranged on an opposite side of the electrode element from the first conductive layer. The first conductive layer and the second conductive layer may form a chamber. The pressure in the chamber may be lower than the pressure outside of the chamber.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: April 12, 2016
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Alfons Dehe, Roland Helm
  • Packaged MEMS Device and Method of Calibrating a Packaged MEMS Device
    Publication number: 20160087606
    Abstract: A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.
    Type: Application
    Filed: December 7, 2015
    Publication date: March 24, 2016
    Inventors: Christian Herzum, Martin Wurzer, Roland Helm, Michael Kropfitsch, Stefan Barzen
  • Motion Detection Using Pressure Sensing
    Publication number: 20160003698
    Abstract: According to an embodiment, a method of sensing motion includes receiving a first signal from a first pressure sensor and a second signal from a second pressure sensor, comparing the first signal and the second signal, and characterizing a motion based on the comparing.
    Type: Application
    Filed: July 3, 2014
    Publication date: January 7, 2016
    Inventors: Andreas Wiesbauer, Christian Mandl, Andreas Kopetz, Roland Helm
  • Packaged MEMS device and method of calibrating a packaged MEMS device
    Patent number: 9210516
    Abstract: A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.
    Type: Grant
    Filed: April 23, 2012
    Date of Patent: December 8, 2015
    Assignee: Infineon Technologies AG
    Inventors: Christian Herzum, Martin Wurzer, Roland Helm, Michael Kropfitsch, Stefan Barzen
  • SENSOR STRUCTURE FOR SENSING PRESSURE WAVES AND AMBIENT PRESSURE
    Publication number: 20150251899
    Abstract: In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive layer arranged on an opposite side of the electrode element from the first conductive layer. The first conductive layer and the second conductive layer may form a chamber. The pressure in the chamber may be lower than the pressure outside of the chamber.
    Type: Application
    Filed: March 6, 2014
    Publication date: September 10, 2015
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Alfons Dehe, Roland Helm
  • Packaged MEMS Device and Method of Calibrating a Packaged MEMS Device
    Publication number: 20130277776
    Abstract: A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.
    Type: Application
    Filed: April 23, 2012
    Publication date: October 24, 2013
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Christian Herzum, Martin Wurzer, Roland Helm, Michael Kropfitsch, Stefan Barzen