Abstract: Method for electroplating a metal onto a flat substrate P. Surfaces are electrically polarized for metal deposition by feeding thereto at least one first and second forward-reverse pulse current sequences. The first forward-reverse pulse current sequence includes a first forward pulse generating a first cathodic current during a first forward pulse duration tf1 and having a first forward pulse peak current if1, and a first reverse pulse generating a first anodic current during a first reverse pulse duration tr1 and having a first reverse pulse peak current ir1, the second forward-reverse pulse current sequence including a second forward pulse generating a second cathodic current during a second forward pulse duration tf2 and having a second forward pulse peak current if2, and a second reverse pulse generating a second anodic current during a second reverse pulse duration tr2, the second reverse pulse having a second reverse pulse peak current ir2.

Abstract: Method for electroplating a metal onto a flat substrate P. Surfaces are electrically polarized for metal deposition by feeding thereto at least one first and second forward-reverse pulse current sequences. The first forward-reverse pulse current sequence includes a first forward pulse generating a first cathodic current during a first forward pulse duration tf1 and having a first forward pulse peak current if1, and a first reverse pulse generating a first anodic current during a first reverse pulse duration tr1 and having a first reverse pulse peak current ir1, the second forward-reverse pulse current sequence including a second forward pulse generating a second cathodic current during a second forward pulse duration tf2 and having a second forward pulse peak current if2, and a second reverse pulse generating a second anodic current during a second reverse pulse duration tr2, the second reverse pulse having a second reverse pulse peak current ir2.

Abstract: Method for electroplating a metal onto a flat substrate P. Surfaces are electrically polarized for metal deposition by feeding thereto at least one first and second forward-reverse pulse current sequences. The first forward-reverse pulse current sequence includes a first forward pulse generating a first cathodic current during a first forward pulse duration tf1 and having a first forward pulse peak current if1, and a first reverse pulse generating a first anodic current during a first reverse pulse duration tr1 and having a first reverse pulse peak current ir1, the second forward-reverse pulse current sequence including a second forward pulse generating a second cathodic current during a second forward pulse duration tf2 and having a second forward pulse peak current if2, and a second reverse pulse generating a second anodic current during a second reverse pulse duration tr2, the second reverse pulse having a second reverse pulse peak current ir2.

Abstract: Method for electroplating a metal onto a flat substrate P. Surfaces are electrically polarized for metal deposition by feeding thereto at least one first and second forward-reverse pulse current sequences. The first forward-reverse pulse current sequence includes a first forward pulse generating a first cathodic current during a first forward pulse duration tf1 and having a first forward pulse peak current if1, and a first reverse pulse generating a first anodic current during a first reverse pulse duration tr1 and having a first reverse pulse peak current ir1, the second forward-reverse pulse current sequence including a second forward pulse generating a second cathodic current during a second forward pulse duration tf2 and having a second forward pulse peak current if2, and a second reverse pulse generating a second anodic current during a second reverse pulse duration tr2, the second reverse pulse having a second reverse pulse peak current ir2.

Abstract: To achieve a high adhesive strength of a metallization on an enamel, the surface of the enamel is first roughened and simultaneously treated by ultrasound to remove loose particles. Then the layer is conditioned by a wetting agent, activated and the metal layer is deposited chemically. Particularly good results are obtained when the conditioning and activation of the surface are performed at a temperature slightly elevated above room temperature, about 40.degree. C., for about 5 minutes and the roughening is performed chemically by treating with a 2% solution of ammonium hydrogen fluoride.