Abstract: In a field-accessed magnetic domain device package assembly, the magnetic domain device carrier or support, the circuit line or conductor carrier, and the magnetic bias field source are integrally and coactively provided by a common substrate member. The member is a planar permanent magnetic insulator ceramic and carries a bonded conductor or wiring pattern. The input/output (I/O) terminals of the domain device, also referred to in the art as a chip, are selectively bonded to the conductors of the pattern thereby providing mechanical support of the chip directly to the substrate in a superimposed relationship, input/output electrical connection to the chip, and mounting of the chip in close proximity to the bias field source, the flux of which passes through the superimposed mounted chips to a high permeability member at least part of which is disposed on the opposite side of the chip.

Abstract: Field accessed magnetic domain device apparatus, of the kind which employs an inner and an encompassing outer solenoid as the rotational magnetic field orthogonal drive coil members with the magnetic domain device(s) mounted within the inner solenoid, has conductive shield means disposed within the inner solenoid between the device(s) and the solenoids. This results in a substantially uniform flux distribution which passes through the inner solenoid and/or mitigation of the adverse effects of the stray flux between turns of the solenoids. As a consequence, a substantially uniform rotational magnetic field distribution is provided in the active area for the device(s), generally referred to as magnetic bubble device(s) or chip(s).