Patents by Inventor Roland Mader

Roland Mader has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for the production of process gas that includes water vapor and hydrogen formed by burning oxygen in a hydrogen-rich environment
    Patent number: 7144826
    Abstract: The aim of the invention is the simple and economical production of a hydrogen-rich process gas from water vapour and hydrogen, whereby the proportion of water vapour to hydrogen may be precisely controllable and reproducible. Said aim is achieved, with a method and device for the production of a process gas for the treatment of substrates, in particular semiconductor substrates, in which the oxygen for formation of a process gas, comprising water vapour and hydrogen, is burnt in a hydrogen-rich environment in a combustion chamber.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: December 5, 2006
    Assignee: Mattson Thermal Products
    Inventors: Georg Roters, Roland Mader, Helmut Sommer, Genrih Erlikh, Yehuda Pashut
  • Method and apparatus for the production of process gases
    Publication number: 20040137754
    Abstract: The aim of the invention is the simple and economical production of a hydrogen-rich process gas from water vapour and hydrogen, whereby the proportion of water vapour to hydrogen may be precisely controllable and reproducible. Said aim is achieved, with a method and device for the production of a process gas for the treatment of substrates, in particular semiconductor substrates, in which the oxygen for formation of a process gas, comprising water vapour and hydrogen, is burnt in a hydrogen-rich environment in a combustion chamber.
    Type: Application
    Filed: February 2, 2004
    Publication date: July 15, 2004
    Inventors: Georg Roters, Roland Mader, Helmut Sommer, Genrih Erlikh, Yehuda Pashut
  • Device and method for thermally treating substrates
    Patent number: 6614005
    Abstract: The aim of the invention is to provide an economical and homogenous thermal treatment for substrate. To this end, the inventive device and method for thermally treating substrates, especially semiconductor wafers, comprise at least one heating device for heating at least one substrate by electromagnetic radiation. Said heating device comprises at least two arc lamps, the radiation characteristics for each arc lamp being controlled individually, and the electromagnetic radiation of the arc lamps contributing essentially to the power density of the electromagnetic radiation of the heating device.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: September 2, 2003
    Assignee: STEAG RTP Systems GmbH
    Inventors: Heinrich Walk, Roland Mader, Werner Blersch, Markus Hauf
  • Method of oxidation of semiconductor wafers in a rapid thermal processing (RTP) system
    Patent number: 5935650
    Abstract: A method of producing a film on the surface of a semiconductor wafer in an RTP system, comprising: a) rapidly processing the wafer at a first temperature T.sub.1 in an atmosphere containing a substantial vapor pressure of a first reactive gas; then b) rapidly processing the wafer at a second temperature T.sub.2 in an atmosphere substantially free of the first reactive gas is described.
    Type: Grant
    Filed: October 17, 1997
    Date of Patent: August 10, 1999
    Inventors: Wilfried Lerch, Georg Roters, Peter Muenzinger, Roland Mader