Abstract: A coating-removal apparatus may include a source positioned on a mounting plate, and operable to emit a laser beam at a first path, where the mounting plate is configured to receive an edge of a photovoltaic module in a designated region substantially proximate to the mounting plate, such that the first path intersects the designated region, and where the mounting plate is further configured to reposition the source to create an additional path that intersects with the designated region, where the additional path is distinct from the first path.

Abstract: A method for removing dielectric layers from semiconductor components by way of a laser beam. The dielectric layer is irradiated with a laser beam which has, upon incidence on the dielectric layer, a substantially homogeneous power density over the laser beam cross-section.

Abstract: A method of laser processing a heat processed transparent material is disclosed wherein the heat processed transparent material includes a top compressive layer, a bottom compressive layer, and a tensile layer between the top compressive layer and the bottom compressive layer. A laser beam includes a burst of laser pulses or a single laser pulse which is externally focussed relative to the heat processed transparent material to form a beam waist at a first location external to the heat processed transparent material avoiding formation of a plasma channel external to the heat processed transparent material. The laser pulses or pulse are focused such that a sufficient energy density is maintained within the bottom compressive layer of the heat processed transparent material to form continuous laser filaments in the top and bottom compressive layers therein without causing optical breakdown. The laser filaments do not extend into the tensile layer.

Abstract: A method of marking components of an aircraft engine, especially turbine blades of a titanium aluminide intermetallic compound. A solid state laser generates a pulsed laser beam with a pulse width of less than 10 ps and the component is marked with the pulsed laser beam.

Abstract: A coating-removal apparatus may include a source positioned on a mounting plate, and operable to emit a laser beam at a first path, where the mounting plate is configured to receive an edge of a photovoltaic module in a designated region substantially proximate to the mounting plate, such that the first path intersects the designated region, and where the mounting plate is further configured to reposition the source to create an additional path that intersects with the designated region, where the additional path is distinct from the first path.

Abstract: A coating-removal apparatus may include a source positioned on a mounting plate, and operable to emit a laser beam at a first path, where the mounting plate is configured to receive an edge of a photovoltaic module in a designated region substantially proximate to the mounting plate, such that the first path intersects the designated region, and where the mounting plate is further configured to reposition the source to create an additional path that intersects with the designated region, where the additional path is distinct from the first path.

Abstract: A coating-removal apparatus may include a source positioned on a mounting plate, and operable to emit a laser beam at a first path, where the mounting plate is configured to receive an edge of a photovoltaic module in a designated region substantially proximate to the mounting plate, such that the first path intersects the designated region, and where the mounting plate is further configured to reposition the source to create an additional path that intersects with the designated region, where the additional path is distinct from the first path.

Abstract: In a method for separating silicon solar cells, a groove is introduced into a silicon wafer containing the silicon solar cells along a separating line in a front side of the silicon wafer adjacent to a p-n junction in the silicon wafer using a first laser beam. The groove has a depth reaching at least to the p-n junction and extends to a lateral edge of the silicon wafer. In a second work step, the silicon wafer is cut along the separating line starting at the lateral edge using a second laser beam directed into the groove. Wherein the melt arising during the cutting is driven out of the cutting kerf arising during the cutting using a cutting gas flowing at least approximately in the direction of the second laser beam.

Abstract: The invention relates to a method for producing a printing plate for intaglio printing. According to said method, a laser is used to create recesses and/or lines in a base body consisting of a brass alloy and/or having an outer layer consisting of a brass alloy.