Abstract: A controllable damping member has a substrate with a semiconductor material; a coplanar conductor applied on the substrate and having a metalization; and a control voltage applied between the metalization of the coplanar conductor and the semiconductor material of the substrate and determining a damping of the coplanar conductor.

Abstract: The optical signal transmission system includes one or more optical wave guide switches (11 to 15) for switching between transmission paths for transmission of light signals and an optical level adjusting device (16 to 24) connected with the one or more optical wave guide switches in at least one of the transmission paths. The optical level adjusting device (16 to 24) controls its own light transmittance with a thermooptic device (22,24) and the one or more optical wave guide switches (11 to 15) switch between transmission paths by a similar thermooptic device (14,15). The one or more optical wave guide switches and the optical level adjusting device are arranged in an integrated thermooptic circuit in a common substrate.

Abstract: A method for fabricating a locally reinforced metallic microfeature on a substrate provided preferably with an electrical contacting or a driving circuit, and on an organic, patterned sacrificial layer, which is removed after the metallic microfeature is applied, is described. In fabricating the local reinforcement of the microfeature, at least one further organic layer, formed as a mask, is deposited, which is likewise removed following pattern delineation of the metallic layer.

Abstract: The thermooptic modulator includes a wave guide (1) having a switching section (4), a refracting section (5) bordering the switching section (4) and extending transversely to a signal propagation direction (14) in the wave guide and a first heating element (8) extending on the refracting section (5) along a boundary (6) between the wave guide (1) and the refracting section (5). In order to improve signal suppression when the modulator is switched to an impermable state, a second heating element (9) is provided extending on the wave guide (1) along the boundary (6).

Abstract: With a sensor and method, it is possible for platinum resistor elements to be used advantageously as heating elements, temperature sensors, printed circuit traces, or as chemically resistant electron beam sensitive layers. To ensure a long-lasting adhesion of the platinum resistance layer to a dielectric substrate, even during exposure to temperatures which are elevated over ambient temperature and under dry and most atmospheric conditions, a thin adhesion layer of platinum silicide, for example, is deposited between the platinum resistance layer and the dielectric substrate. Resistor elements patterned from the platinum layer can advantageously be used in temperature sensors, mass flow sensors, chemical sensors, gas sensors, or humidity sensors.

Abstract: An optical, beam-splitting component has a prism carrier plate which supports a prism member upon which a deflecting layer is applied. At the same time, the prism member juts into a groove between two optical waveguides carrying the light signals.

Abstract: The optical switching device includes an optical layer (5) provided with at least one optical waveguide (11) having an entrance (13) and an outlet (15) and at least one other optical waveguide (21) provided in the optical layer (5) with another outlet (23); a piezoelectric layer (7) arranged on the optical layer (5); electrodes (9) for producing an acoustic wave provided on the piezoelectric layer (7); and a device for performing a Bragg light deflection with optical frequency shift by one of activating and deactivating the electrodes to optically couple the entrance (13) of the at least one optical waveguide (11) with one or the other of the outlets (15, 23). The invention also relates to an optical by-pass circuit which is a combination of two optical switching devices.

Abstract: The invention relates to an optical fiber amplifier having an amplification waveguide, having a pump source and having a wavelength-selective coupler. The pump light from the pump source is coupled into the amplification waveguide via the coupler. A carrier substrate (GS) is provided, on which passive (eg. couplers, dividers) and active components (eg. amplification waveguides) of the fiber amplifier are integrated. In addition, a silicon carrier (ST1) is provided, which is fitted to one end of the carrier substrate (GS). The silicon carrier (ST1) has anisotropically etched grooves with optical components. The pump source is fixed on the silicon carrier (ST1).The optical components on silicon carrier (ST1) and carrier substrate (GS) are adjusted in relation to one another.

Abstract: In the case of the above devices, exact adjustment is very important; however, the devices ought to be very compact. It is not sufficient to utilize the silicon etching technique for the precision. The optical transmitting element (LD) is situated on a first carrier (T1), the optical receiving element (PD) and the transmission fiber (Fa) are situated on a third carrier. Provided in between them is a second carrier (T2) which is transparent to the wavelength of the light emitted by the transmitting element (LD). The carriers are structured by means of anisotropic etching in order to make possible the accommodation of the individual components. In addition, the carriers lie flat on one another and can thus be adjusted. A monitor diode (MD) is provided. Application of the arrangement in all transmission systems having optical waveguides.