Abstract: The invention relates to a packaged LED module (1) comprising a module (2) having at least one LED (3) arranged thereon, and a one-piece package (10, 100) having a receptacle for the module (2), a substantially optically transmissive region (11, 11a, 11b, 11c), which makes it possible to emit light from the LED (3) towards the outside, an opening (16) and potting blocking means (17). The package (10, 100) is embodied in such a way that a potting component is introduced via the opening (16) into the package (10, 100) equipped with the module (2). The introduced potting component forms a potting body (30), which completely fills the package (10, 100), excluding a region between the LED (3) and the substantially optically transmissive region (11, 11a, 11b, 11c) on account of the potting blocking means (17), and which connects the package (10, 100), the module (2) and connecting cables (20) that can be connected to the module (2) in an externally sealing manner.

Abstract: The invention relates to a packaged LED module (1) comprising a module (2) having at least one LED (3) arranged thereon, and a one-piece package (10, 100) having a receptacle for the module (2), a substantially optically transmissive region (11, 11a, 11b, 11c), which makes it possible to emit light from the LED (3) towards the outside, an opening (16) and potting blocking means (17). The package (10, 100) is embodied in such a way that a potting component is introduced via the opening (16) into the package (10, 100) equipped with the module (2). The introduced potting component forms a potting body (30), which completely fills the package (10, 100), excluding a region between the LED (3) and the substantially optically transmissive region (11, 11a, 11b, 11c) on account of the potting blocking means (17), and which connects the package (10, 100), the module (2) and connecting cables (20) that can be connected to the module (2) in an externally sealing manner.

Abstract: An method for manufacturing an electrical component comprises providing a base body of a ceramic material with at least two contact regions with terminal elements secured thereto. The base body is immersed into a solution that contains a fluid that wets the base body and a hydrophobic and lipophobic intermediate layer material dissolved in the fluid. The base body is removed from the solution so that a part of the solution remains adhering thereto as a film that completely envelopes the base body. An intermediate layer is produced by evaporating the fluid contained in the film, and a protective layer is applied onto the intermediate layer.

Abstract: An method for manufacturing an electrical component comprises providing a base body of a ceramic material with at least two contact regions with terminal elements secured into. The base body is immersed into a solution that contains a fluid that wets the base body and a hydrophobic and lipophobic intermediate layer material dissolved in the fluid. The base body is removed from the solution so that a part of the solution remains adhering thereto as a film that completely envelopes the base body. An intermediate layer is produced by evaporating the fluid contained in the film, and a protective layer is applied onto the intermediate layer.

Abstract: An electrical component which has a base body that comprises a ceramic material and at least two contact regions arranged on the base body to which terminal elements are secured, is enveloped by a protective layer containing organic constituents, and has an intermediate layer that is arranged between the base body and the protective layer and is composed of an intermediate layer material that is both hydrophobic as well as lipophobic. The intermediate layer can be advantageously composed of a fluoropolymer which is manufactured by immersing the base body into a fluid that dissolves this polymer. The moisture stability of the electrical component is critically improved by the intermediate layer. The components are particularly employed as hot-carrier thermistor temperature sensors.

Abstract: An electrical component which has a base body that comprises a ceramic material and at least two contact regions arranged on the base body to which terminal elements are secured, is enveloped by a protective layer containing organic constituents, and has an intermediate layer that is arranged between the base body and the protective layer and is composed of an intermediate layer material that is both hydrophobic as well as lipophobic. The intermediate layer can be advantageously composed of a fluoropolymer which is manufactured by immersing the base body into a fluid that dissolves this polymer. The moisture stability of the electrical component is critically improved by the intermediate layer. The components are particularly employed as hot-carrier thermistor temperature sensors.