Abstract: A method of bonding copper to a heat conducting and electrically insulating power electronics substrate made of a non-oxide ceramic selected from AlN, SiC, and BN, the method including the steps of oxidizing the surface of the substrate and then directly bonding copper to the oxidized surface of the substrate, wherein the step of oxidizing the surface of the substrate is performed by irradiating the surface using a laser beam to a thickness in the range 0.1 .mu.m to 3 .mu.m.

Abstract: A method of fabricating a superconductive flexible conductor having a high critical temperature in which method a deposit of superconductive ceramic is applied to a metal tape of thickness lying in the range 0.1 mm to 1 mm, wherein:the deposit of thickness lying in the range 50 .mu.m to 300 .mu.m and of concentration by volume of not less than 70% runs through an infrared beam at a speed of not less than 5 cm per minute, the zone treated by the the beam having a width of less than 10 mm relative to the travel direction and a surface temperature of not less than 1200.degree. C., thereby imparting a surface superconductive layer to the deposit which is of concentration by volume close to 100%, which is textured in the travel direction, and which is of thickness lying in the range 10 .mu.m to 100 .mu.m; andannealing is then performed under oxygen.