Abstract: In various embodiments, a method for processing a substrate is provided. The method includes placing the substrate on at least one substrate carrier. The substrate carrier includes at least one carrier layer and a thermal insulating layer arranged over the carrier layer. The thermal insulating layer is arranged between the carrier layer and the substrate placed on. The thermal insulating layer includes at least one of a lower density or a lower thermal conductivity than the carrier layer. The method further includes coating the substrate with a coating material while the substrate is lying on the at least one substrate carrier, and removing coating material that adheres to the substrate carrier during the coating of the substrate from the at least one substrate carrier, the removal of the coating material from the at least one substrate carrier taking place by irradiating the at least one substrate carrier.