Patents by Inventor Roland Wenzel

Roland Wenzel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnections for integrated circuits
    Patent number: 7951703
    Abstract: An interconnect connection structure having first and second interconnects and multiple connection elements that electrically connect the first interconnect to the second interconnect is described. The multiple connection elements are formed laterally in a lateral region of the first and second interconnects relative to an overlay orientation of the interconnects. A central region may be free of connection elements so that electro-migration properties of the connection structure are improved and the current-carrying capacity is increased.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: May 31, 2011
    Assignee: Infineon Technologies AG
    Inventors: Klaus Goller, Roland Wenzel
  • INTERCONNECTIONS FOR INTEGRATED CIRCUITS
    Publication number: 20090263964
    Abstract: An interconnect connection structure having first and second interconnects and multiple connection elements that electrically connect the first interconnect to the second interconnect is described. The multiple connection elements are formed laterally in a lateral region of the first and second interconnects relative to an overlay orientation of the interconnects.
    Type: Application
    Filed: June 30, 2009
    Publication date: October 22, 2009
    Inventors: Klaus Goller, Roland Wenzel
  • Interconnections for integrated circuits
    Patent number: 7569938
    Abstract: An interconnect connection structure having first and second interconnects and multiple connection elements that electrically connect the first interconnect to the second interconnect is described. The multiple connection elements are formed laterally in a lateral region of the first and second interconnects relative to an overlay orientation of the interconnects. A central region may be free of connection elements so that electro-migration properties of the connection structure are improved and the current-carrying capacity is increased.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: August 4, 2009
    Assignee: Infineon Technologies AG
    Inventors: Klaus Goller, Roland Wenzel
  • Interconnections for integrated circuits
    Publication number: 20060163737
    Abstract: An interconnect connection structure having first and second interconnects and multiple connection elements that electrically connect the first interconnect to the second interconnect is described. The multiple connection elements are formed laterally in a lateral region of the first and second interconnects relative to an overlay orientation of the interconnects. A central region may be free of connection elements so that electro-migration properties of the connection structure are improved and the current-carrying capacity is increased.
    Type: Application
    Filed: March 23, 2006
    Publication date: July 27, 2006
    Inventors: Klaus Goller, Roland Wenzel
  • Test structure for determining the electrical loadability of contacts
    Patent number: 6899543
    Abstract: A test structure can be used to determine the electrical loadability of contacts. This structure includes a first interconnect line and a second interconnect line arranged above the first interconnect line. A via electrically couples the first interconnect line to the second interconnect line. A plurality of additional conductive structures are arranged in a closely adjacent manner around the via. These additional structures lie in the same plane as either the first interconnect line or the second interconnect line.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: May 31, 2005
    Assignee: Infineon Technologies AG
    Inventors: Klaus Goller, Roland Wenzel
  • Test structure for determining the electrical loadability of contacts
    Publication number: 20040115963
    Abstract: A test structure can be used to determine the electrical loadability of contacts. This structure includes a first interconnect line and a second interconnect line arranged above the first interconnect line. A via electrically couples the first interconnect line to the second interconnect line. A plurality of additional conductive structures are arranged in a closely adjacent manner around the via. These additional structures lie in the same plane as either the first interconnect line or the second interconnect line.
    Type: Application
    Filed: November 14, 2003
    Publication date: June 17, 2004
    Inventors: Klaus Goller, Roland Wenzel