Patents by Inventor Roland Wursche
Roland Wursche has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230131319Abstract: Polymer foams based on polyetherimides (PEI) or blends of polyetherimides and polyether ether ketone (PEEK) meet the legal requirements demanded by the aviation industry for aircraft interiors and for aircraft exteriors too.Type: ApplicationFiled: December 30, 2020Publication date: April 27, 2023Applicant: Evonik Operations GmbHInventors: Roland WURSCHE, Christian Traßl, Sebastian Geerkens, Jõrg Blaschke, Kay Bernhard, Denis Holleyn
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Patent number: 10829590Abstract: A process has the ability to produce polyalkenamer-containing compositions. Stages of the process include converting at least one cycloalkene by ring-opening metathetic polymerization to obtain a polyalkenamer-containing product mixture, and working up the product mixture to remove at least one of a monomer and an oligomer of the at least one cycloalkene to obtain the polyalkenamer-containing composition. The working up stage is effected by a diafiltration.Type: GrantFiled: October 6, 2016Date of Patent: November 10, 2020Assignee: Evonik Operations GmbHInventors: Roland Wursche, Jürgen Herwig, Peter Kreis, Marina Lazar, Martin Roos, Goetz Baumgarten, Christian Schnitzer
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Patent number: 10689483Abstract: The present invention relates to a process for producing cycloalkenamer-containing compositions and to such cycloalkenamer-containing compositions. The invention further relates to the use of these cycloalkenamer-containing compositions in the field of packaging materials, especially for food and drink.Type: GrantFiled: July 14, 2016Date of Patent: June 23, 2020Assignee: Evonik Operations GmbHInventors: Roland Wursche, Juergen Herwig
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Patent number: 10570249Abstract: A process for producing cycloalkenamer-containing compositions involves converting at least one cycloalkene by ring-opening metathetic polymerization to obtain a polyalkenamer-containing product mixture. The product mixture is worked up to remove monomers and oligomers of the cycloalkenes to obtain the polyalkenamer-containing composition by extraction with CO2. The extraction involves at least two stages: an extraction with liquid CO2 under the supercritical conditions, and then an extraction with supercritical CO2. Such cycloalkenamer-containing compositions can be used, for example, in the field of packaging materials, especially for food and drink.Type: GrantFiled: August 11, 2016Date of Patent: February 25, 2020Assignee: Evonik Operations GmbHInventors: Roland Wursche, Florian Schwager, Franz Michlbauer, Helmut Hausner, Claudius Neumann
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Publication number: 20200002467Abstract: The present invention relates to a process for producing cycloalkenamer-containing compositions, comprising the steps of: a) converting at least one cycloalkene by ring-opening metathetic polymerization to obtain a polyalkenamer-containing product mixture, and b) working up the product mixture to remove monomers and oligomers of the cycloalkenes to obtain the polyalkenamer-containing composition by extraction with CO2, whereby the polyalkenamers are polymers of cycloalkenes which comprise at least five cycloalkane monomer units, wherein the extraction comprises at least two stages: b0) an extraction with liquid CO2, then b1) an extraction with supercritical CO2, then b2) an extraction with gaseous CO2, then b0) an extraction with liquid CO2, then and then b3) an extraction with supercritical CO2.Type: ApplicationFiled: February 9, 2018Publication date: January 2, 2020Inventors: Roland Wursche, Florian Schwager, Adam Dieter, Michlbauer Franz
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Patent number: 10479059Abstract: A film comprising the following layers: I. a layer based on a polyamide whose monomer units contain an average of at least 8 carbon atoms, II. an immediately adjacent layer composed of a moulding composition comprising a polyamide as in I. and a copolymer having functional groups is used for the production of a composite with a substrate which comprises PA6, PA66, PA6/66 or PPA, giving secure adhesion.Type: GrantFiled: January 15, 2008Date of Patent: November 19, 2019Assignee: Evonik Degussa GmbHInventors: Kirsten Alting, Roland Wursche, Harald Haeger, Martin Wielpuetz
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Publication number: 20190127516Abstract: The present invention relates to a process for producing cycloalkenamer-containing compositions and to such cycloalkenamer-containing compositions. The invention further relates to the use of these cycloalkenamer-containing compositions in the field of packaging materials, especially for food and drink.Type: ApplicationFiled: July 14, 2016Publication date: May 2, 2019Applicant: Evonik Degussa GmbHInventors: Roland Wursche, Juergen Herwig
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Publication number: 20180273679Abstract: A process has the ability to produce polyalkenamer-containing compositions. Stages of the process include converting at least one cycloalkene by ring-opening metathetic polymerization to obtain a polyalkenamer-containing product mixture, and working up the product mixture to remove at least one of a monomer and an oligomer of the at least one cycloalkene to obtain the polyalkenamer-containing composition. The working up stage is effected by a diafiltration.Type: ApplicationFiled: October 6, 2016Publication date: September 27, 2018Applicant: Evonik Degussa GmbHInventors: Roland Wursche, Juergen Herwig, Peter Kreis, Marina Lazar, Martin Roos, Goetz Baumgarten, Christian Schnitzer
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Publication number: 20180230263Abstract: A process for producing cycloalkenamer-containing compositions involves converting at least one cycloalkene by ring-opening metathetic polymerization to obtain a polyalkenamer-containing product mixture. The product mixture is worked up to remove monomers and oligomers of the cycloalkenes to obtain the polyalkenamer-containing composition by extraction with CO2. The extraction involves at least two stages: an extraction with liquid CO2 under the supercritical conditions, and then an extraction with supercritical CO2. Such cycloalkenamer-containing compositions can be used, for example, in the field of packaging materials, especially for food and drink.Type: ApplicationFiled: August 11, 2016Publication date: August 16, 2018Applicant: Evonik Degussa GmbHInventors: Roland WURSCHE, Florian SCHWAGER, Franz MICHLBAUER, Helmut HAUSNER, Claudius NEUMANN
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Patent number: 9524807Abstract: A polyamide composition contains the following components: (a) at least 40 parts by weight PA12; (b) 0.1-15 parts by weight of at least one salt with a non-metallic cation; (c) 0.1-25% by weight of at least one dispersant based on esters or amides; (d) a quantity of carbon nanotubes that produces in the molding compound a specific surface resistance according to IEC standard 60167 of maximum 10?1-1010?; (e) 0-5 parts by weight of at least one metal salt; and optionally (f) conventional auxiliary substances and additives, the sum of the parts by weight of components (a) to (f) amounting to 100. The polyamide composition can be used for manufacturing moldings with improved electrical conductivity and improved surface quality.Type: GrantFiled: October 31, 2011Date of Patent: December 20, 2016Assignee: Evonik Degussa GmbHInventors: Sylvia Anita Hermasch, Roland Wursche, Harald Haeger, Petra Poetschke, Beate Krause, Robert Socher
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Patent number: 9418773Abstract: A polyamide composition comprising the following components: a) at least 40 parts by weight of a polyamide whose monomer units contain an arithmetic average of at least 7.5 carbon atoms, b) 0.1 to 15 parts by weight of at least one salt with a non-metallic cation, c) 0.1 to 25 parts by weight of at least one dispersant based on esters or amides and d) an electrically conductive carbon selected from the group of carbon black, graphite powder, carbon fibers, carbon nanotubes and/or graphene, in an amount which results in a specific surface resistance of the polymer composition to IEC 60167 of 10?1 to 1010?, e) 0 to 5 parts by weight of at least one metal salt, and optionally f) customary assistants and additives, where the polyamide of component a) is not a PA12 if carbon nanotubes are present as component d), and where the sum of the parts by weight of components a) to f) is 100, can be used for production of mouldings with improved electrical conductivity and improved surface quality.Type: GrantFiled: October 31, 2011Date of Patent: August 16, 2016Assignee: Evonik Degussa GmbHInventors: Sylvia Anita Hermasch, Roland Wursche, Harald Häger, Kathrin Lehmann
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Patent number: 9312043Abstract: A polyamide composition which provides moldings having a significantly reduced percolation threshold and an improved electrical conductivity is provided. The composition contains a) at least 40 parts by weight of a polyamide; b) from 0.15 to 25 parts by weight of an electrically conductive carbon; c) from 0.3 to 8 parts by weight of an oligofunctional compound; and, optionally, d) conventional auxiliaries and additives, wherein the electrically conductive carbon comprises at least one of carbon nanotubes and graphene, the oligofunctional compound comprises at least one functional group reactive with reactive groups on a surface of the electrically conductive carbon and at least one functional group reactive with an end group of the polyamide, and the sum of the parts by weight of the components a) to d) is 100.Type: GrantFiled: March 14, 2013Date of Patent: April 12, 2016Assignee: Evonik Degussa GmbHInventors: Harald Haeger, Roland Wursche, Sylvia Anita Hermasch, Lothar Jakisch, Beate Krause, Petra Poetschke, Robert Socher
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Patent number: 8764992Abstract: A method of fractionating a dispersion of oxidic nanoparticles wherein at least one step of the method is a membrane crossflow filtration step, the flow of the dispersion over the membrane being brought about by means of driven rotating parts; and dispersions of oxidic nanoparticles that are obtainable by the method.Type: GrantFiled: April 1, 2010Date of Patent: July 1, 2014Assignee: Evonik Degussa GmbHInventors: Roland Wursche, Goetz Baumgarten, Wolfgang Lortz, Michael Kroell
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Patent number: 8647551Abstract: A process for producing moldings with condensing-up of a polyamide molding composition whose polyamide component contains, as a result of the method of preparation, at least 5 ppm of phosphorus in the form of an acidic compound by means of a compound having at least two carbonate units, wherein a) from 0.001 to 10% by weight, based on the polyamide, of a salt of a weak acid is added to the polyamide molding composition prior to compounding or during compounding, b) a mixture of the finished composition and the compound having at least two carbonate units is prepared, c) the mixture is, if appropriate, stored and/or transported and d) the mixture is subsequently processed to produce the molding, with the condensing-up occurring only in this step, effects a significant increase in the melt stiffness combined with moderate processing pressures, which considerably simplifies, in particular, the production of hollow bodies and hollow profiles having large diameters.Type: GrantFiled: February 15, 2006Date of Patent: February 11, 2014Assignee: Evonik Degussa GmbHInventors: Andreas Dowe, Rainer Goering, Martin Himmelmann, Sonja Bollmann, Franz-Erich Baumann, Roland Wursche
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Publication number: 20140037937Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.Type: ApplicationFiled: October 10, 2013Publication date: February 6, 2014Applicant: EVONIK DEGUSSA GmbHInventors: Roland Wursche, Sonja Bollmann, Harald Haeger, Martin Wielpuetz, Kirsten Alting, Michael Beyer, Franz-Erich Baumann
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Patent number: 8614005Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.Type: GrantFiled: December 21, 2011Date of Patent: December 24, 2013Assignee: Evonik Degussa GmbHInventors: Roland Wursche, Sonja Bollmann, Harald Haeger, Martin Wielpuetz, Kirsten Alting, Michael Beyer, Franz-Erich Baumann
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Publication number: 20130299750Abstract: A polyamide composition comprising the following components: a) at least 40 parts by weight of a polyamide whose monomer units contain an arithmetic average of at least 7.5 carbon atoms, b) 0.1 to 15 parts by weight of at least one salt with a non-metallic cation, c) 0.1 to 25 parts by weight of at least one dispersant based on esters or amides and d) an electrically conductive carbon selected from the group of carbon black, graphite powder, carbon fibres, carbon nanotubes and/or graphene, in an amount which results in a specific surface resistance of the polymer composition to IEC 60167 of 10?1 to 1010 ?, e) 0 to 5 parts by weight of at least one metal salt, and optionally f) customary assistants and additives, where the polyamide of component a) is not a PA12 if carbon nanotubes are present as component d), and where the sum of the parts by weight of components a) to f) is 100, can be used for production of mouldings with improved electrical conductivity and improved surface quality.Type: ApplicationFiled: October 31, 2011Publication date: November 14, 2013Applicant: Evonik Degussa GmbHInventors: Sylvia Anita Hermasch, Roland Wursche, Harald Häger, Kathrin Lehmann
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Publication number: 20130240799Abstract: A polyamide composition which provides moldings having a significantly reduced percolation threshold and an improved electrical conductivity is provided. The composition contains a) at least 40 parts by weight of a polyamide; b) from 0.15 to 25 parts by weight of an electrically conductive carbon; c) from 0.3 to 8 parts by weight of an oligofunctional compound; and, optionally, d) conventional auxiliaries and additives, wherein the electrically conductive carbon comprises at least one of carbon nanotubes and graphene, the oligofunctional compound comprises at least one functional group reactive with reactive groups on a surface of the electrically conductive carbon and at least one functional group reactive with an end group of the polyamide, and the sum of the parts by weight of the components a) to d) is 100.Type: ApplicationFiled: March 14, 2013Publication date: September 19, 2013Inventors: Harald HAEGER, Roland Wursche, Sylvia Anita Hermasch, Lothar Jakisch, Beate Krause, Petra Poetschke, Robert Socher
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Patent number: 8535811Abstract: A polyamide molding composition which can be used for production of a printable or printed item contains a) at most 90 parts by weight of a polyamide obtained from a lactam or from an amino carboxylic acid having at least 10 carbon atoms; and b) from 10 to 100 parts by weight of PA1010, wherein a total of components a) and b) is 100 parts by weight.Type: GrantFiled: June 1, 2011Date of Patent: September 17, 2013Assignee: Evonik Degussa GmbHInventors: Kirsten Luetzeler, Franz-Erich Baumann, Sonja Bollmann, Andreas Dowe, Roland Wursche, Georg Schaefer
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Publication number: 20130207050Abstract: A polyamide composition contains the following components: (a) at least 40 parts by weight PA12; (b) 0.1-15 parts by weight of at least one salt with a non-metallic cation; (c) 0.1-25% by weight of at least one dispersant based on esters or amides; (d) a quantity of carbon nanotubes that produces in the moulding compound a specific surface resistance according to IEC standard 60167 of maximum 10?1-1010?; (e) 0-5 parts by weight of at least one metal salt; and optionally (f) conventional auxiliary substances and additives, the sum of the parts by weight of components (a) to (f) amounting to 100. The polyamide composition can be used for manufacturing mouldings with improved electrical conductivity and improved surface quality.Type: ApplicationFiled: October 31, 2011Publication date: August 15, 2013Applicant: Evonik Degussa GmbHInventors: Sylvia Anita Hermasch, Roland Wursche, Harald Haeger, Petra Poetschke, Beate Krause, Robert Socher