Patents by Inventor ROLANDO MENDOZA CHAN

ROLANDO MENDOZA CHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe die pad with partially-etched groove between through-hole slots
    Patent number: 10770377
    Abstract: A leadframe includes a die pad for mounting a semiconductor die with its top side facing up using a die attach resin material including a resin, the leadframe having leads or lead terminals beyond the die pad. The die pad includes slots including a first slot and at least a second slot on at least a first side of the die pad that penetrate a full thickness of the die pad. At least one non-penetrating groove is in the die pad for providing a fluid connection including between the first and second slots for providing a flow channel for guiding the resin when received by the grooves after bleeding out from under the semiconductor die to flow to at least one of the first slot and the second slot.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: September 8, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Joel De Guzman Raposas, Rolando Mendoza Chan, Kent Lacson Capan
  • LEADFRAME DIE PAD WITH PARTIALLY-ETCHED GROOVE BETWEEN THROUGH-HOLE SLOTS
    Publication number: 20200211933
    Abstract: A leadframe includes a die pad for mounting a semiconductor die with its top side facing up using a die attach resin material including a resin, the leadframe having leads or lead terminals beyond the die pad. The die pad includes slots including a first slot and at least a second slot on at least a first side of the die pad that penetrate a full thickness of the die pad. At least one non-penetrating groove is in the die pad for providing a fluid connection including between the first and second slots for providing a flow channel for guiding the resin when received by the grooves after bleeding out from under the semiconductor die to flow to at least one of the first slot and the second slot.
    Type: Application
    Filed: December 31, 2018
    Publication date: July 2, 2020
    Inventors: JOEL DE GUZMAN RAPOSAS, ROLANDO MENDOZA CHAN, KENT LACSON CAPAN