Abstract: The present invention teaches and discloses method and apparatus for alerting a grocery store check out cashier of merchandise placed on the bottom tray of a typical grocery shopping cart. A passive RFID transponder is incorporated into the structure of the cart which when interrogated by an associated reader, located at the cashier's check out station, responds with a signal verifying the presence, or absence, of an unseen item upon the carts bottom tray.

Abstract: A small water-cooling type electronic component cooling apparatus is provided. The electronic component cooling apparatus comprises a so-called water-cooling heat sink 3, a radiator 7 cooled by an electric fan 5, first and second coolant paths 9, 11 for circulating a coolant between the heat sink 3 and the radiator 7, and an electric pump 13 to supply a moving energy to the coolant. The electric pump 13 is arranged at a position facing the heat-radiating portion of the radiator 7.

Abstract: The present invention teaches and discloses method and apparatus for alerting a grocery store check out cashier of merchandise placed on the bottom tray of a typical grocery shopping cart. A passive RFID transponder is incorporated into the structure of the cart which when interrogated by an associated reader, located at the cashier's check out station, responds with a signal verifying the presence, or absence, of an unseen item upon the carts bottom tray.

Abstract: A cooling system hinge mounted to a portion of an enclosure of an electronic system to which a cooling device may be releasably and pivotably attached in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover to close the enclosure.

Abstract: A small water-cooling type electronic component cooling apparatus is provided. The electronic component cooling apparatus comprises a so-called water-cooling heat sink 3, a radiator 7 cooled by an electric fan 5, first and second coolant paths 9, 11 for circulating a coolant between the heat sink 3 and the radiator 7, and an electric pump 13 to supply a moving energy to the coolant. The electric pump 13 is arranged at a position facing the heat-radiating portion of the radiator 7.

Abstract: A cooling system hinge mounted to a portion of an enclosure of an electronic system to which a cooling device may be releasably and pivotably attached in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover to close the enclosure.

Abstract: According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchanger, tubing, and a pump volume. A coolant may be contained in the fluid-containing space.

Abstract: According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchanger, tubing, and a pump volume. A coolant may be contained in the fluid-containing space.

Abstract: A cooling system for a processor-based system may include a housing that contains a heat exchanger, a tank, and an internal pump that pumps fluid through the heat exchanger and through a cooling plate coupled thermally to a processor to be cooled.

Abstract: A cooling system for a processor-based system may include a housing that contains a heat exchanger, a tank, and an internal pump that pumps fluid through the heat exchanger and through a cooling plate coupled thermally to a processor to be cooled.

Abstract: A computer system is provided having a heat exchanger that is relatively large. Although the heat exchanger is large, it is still sufficiently light because of its plastic material. Because of the large size of the heat exchanger, a relatively large surface is provided by the cumulative outer surfaces of fins. The relatively large surface area results in a lower heat flux. The lower heat flux obviates the need for forced convection. There is thus no need to use fans when the computer system is at room temperature.

Abstract: A computer system is provided having a heat exchanger that is relatively large. Although the heat exchanger is large, it is still sufficiently light because of its plastic material. Because of the large size of the heat exchanger, a relatively large surface is provided by the cumulative outer surfaces of fins. The relatively large surface area results in a lower heat flux. The lower heat flux obviates the need for forced convection. There is thus no need to use fans when the computer system is at room temperature.

Abstract: To manage heat generated by an electric circuit, a fan is provided to generate an air flow through a ducting structure over the electric circuit. For example, in a graphics accelerator card, a fan is placed in a void in the card and a ducting structure is placed over the fan and the graphics controller IC chip of the card. Air flow generated by the fan travels over the IC chip via the ducting structure to reduce the ambient temperature around the IC chip. The height of the ducting structure from a surface of the graphics accelerator card may be made sufficiently small so as to satisfy height requirements set forth in specifications such as the Peripheral Component Interconnect (PCI) and Accelerated Graphics Port (AGP) specifications.

Abstract: An improved computer assembly is disclosed, which includes a chassis that has at least one drive bay, the drive bay having an opening. A heat sink is positioned within the drive bay and a thermally conductive component is coupled to the heat sink and to a processor assembly. In a preferred embodiment, a heat pipe couples the thermally conductive component to the heat sink.

Abstract: An improved assembly for a computer that includes a memory card inserted into a socket mounted to a computer motherboard. A fan is positioned adjacent to the memory card and a support structure couples the fan to the motherboard.

Abstract: A fastener for an electronic assembly. The fastener may have a spring arm that extends from a stem. The fastener can attach a cover to a heat sink of an electronic assembly. The stem may be inserted into a boss of the cover. The spring arm may exert a force onto the heat sink to press the sink into an integrated circuit package of the assembly.

Abstract: A low-profile zero-insertion socket includes a plurality of resilient contacts mounted directly into the motherboard. The socket has a support plate slidingly attached to the motherboard and including a plurality of through apertures formed to receive the pins of a microprocessor package. A low-profile eccentric cam actuator, rotationally coupled to the motherboard, is provided for moving the support plate that bears the microprocessor to and from a position where the microprocessor pins engage the resilient contacts.