Patents by Inventor Rolf Becker

Rolf Becker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11135570
    Abstract: An anatase titanium dioxide includes at least one compound selected from oxides of Si, Al, and Zr in an amount of 2-50% b.w., calculated as oxides, of a total weight of the oxides, and a sulfur content of less than 150 ppm based on the total weight of the oxides.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: October 5, 2021
    Assignee: VENATOR GERMANY GMBH
    Inventors: Ralf Becker, Regina Optehostert, Rolf Wittenberg
  • Patent number: 9425118
    Abstract: The invention relates to an electronic component (1) having a corrosion-protected bonding connection and a method for producing said component. For this purpose the electronic component (1) has at least one semiconductor chip (3) on a substrate (4). Moreover, a bonding connection at risk of corrosion is provided on the semiconductor chip (3). For encapsulation of the at least one semiconductor chip (3) and the at least one bonding connection at risk of corrosion, said semiconductor chip and bonding connection are surrounded by a hermetically sealing housing (5). The hermetically sealed bonding connection is a bonding wire connection (2) which is fully enclosed in the housing (5), in which the substrate (4) is at least partially enclosed. The substrate (4) has at least one surface-mounted hydrolysis-sensitive component (6) in the housing (5).
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: August 23, 2016
    Assignee: Robert Bosch GmbH
    Inventors: Fabian Bez, Johannes Duerr, Rolf Becker, Sven Lamers, Lutz Mueller, Michael Schlecht
  • Patent number: 9345139
    Abstract: The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.
    Type: Grant
    Filed: June 6, 2012
    Date of Patent: May 17, 2016
    Assignee: ROBERT BOSCH GMBH
    Inventors: Rolf Becker, Christian Lammers, Juergen Jerg, Joachim Wolff, Volker Hochholzer, Ulrich Trescher, Helmut Bubeck, Klaus Voigtlaender, Jan Benzler, Thomas Raica, Willi Kuehn, Thomas Wiesa, Michael Krapp
  • Publication number: 20150137391
    Abstract: The invention relates to an electronic component (1) having a corrosion-protected bonding connection and a method for producing said component. For this purpose the electronic component (1) has at least one semiconductor chip (3) on a substrate (4). Moreover, a bonding connection at risk of corrosion is provided on the semiconductor chip (3). For encapsulation of the at least one semiconductor chip (3) and the at least one bonding connection at risk of corrosion, said semiconductor chip and bonding connection are surrounded by a hermetically sealing housing (5). The hermetically sealed bonding connection is a bonding wire connection (2) which is fully enclosed in the housing (5), in which the substrate (4) is at least partially enclosed. The substrate (4) has at least one surface-mounted hydrolysis-sensitive component (6) in the housing (5).
    Type: Application
    Filed: November 29, 2012
    Publication date: May 21, 2015
    Applicant: Robert Bosch GMBH
    Inventors: Fabian Bez, Johannes Duerr, Rolf Becker, Sven Lamers, Lutz Mueller, Michael Schlecht
  • Patent number: 8488324
    Abstract: An electrical control unit has a printed circuit board substrate, on which an electronic circuit is situated, which circuit includes multiple electrical components which are interconnected via printed conductors of the printed circuit board substrate, as well as housing parts for covering the electrical components on the printed circuit board substrate, and at least one device plug connector part situated on the printed circuit board substrate outside the section of the printed circuit board substrate covered by the housing parts. Outside the section covered by the at least one housing part and outside the section of the printed circuit board substrate provided with the device plug connector part, at least one contact point for an additional electrical component is situated on the printed circuit board substrate.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: July 16, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Rolf Becker, Christian Lammers, Juergen Jerg, Joachim Wolff, Volker Hochholzer, Ulrich Trescher, Helmut Bubeck, Klaus Voigtlaender, Jan Benzler, Thomas Raica, Willi Kuehn, Thomas Wiesa, Michael Krapp
  • Publication number: 20120240396
    Abstract: The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.
    Type: Application
    Filed: June 6, 2012
    Publication date: September 27, 2012
    Inventors: Rolf BECKER, Christian Lammers, Juergen Jerg, Joachim Wolff, Volker Hochholzer, Ulrich Trescher, Helmut Bubeck, Klaus Voigtlaender, Jan Benzler, Thomas Raica, Willi Kuehn, Thomas Wiesa, Michael Krapp
  • Publication number: 20110037483
    Abstract: The invention relates to a sensor having a conductor arrangement and an intervening dielectric to detect local sensor impedances in response to external forces. The conductor arrangement comprises elongate conductor strips between which the intervening dielectric is arranged as a compressible insulating medium.
    Type: Application
    Filed: May 8, 2008
    Publication date: February 17, 2011
    Applicants: KARLSRUHER INSTITUT FUER TECHNOLOGIE, HOCHSCHULE MANNHEIM
    Inventors: Alexander Scheuermann, Christof Huebner, Holger Woersching, Andreas Bieberstein, Rolf Nueesch, Ruth Haas Nueesch, Stefan Schlaeger, Rainer Schuhmann, Rolf Becker
  • Patent number: 7831396
    Abstract: A method and a device are for predicting a life expectancy of a product, which includes at least two components. The life expectancy is ascertained as a function of an assumed field loading of the product. The components of the product are acted upon by different loadings and are operated, in each instance, at the different loadings until they fail. An end-of-life curve of the component is recorded on the basis of the load-dependent failure times of a component. An EOL curve of the product is ascertained such that at the different loadings, it includes the EOL curve of the components which has, in each instance, the shortest failure time at the corresponding loading. The anticipated service life of the product is determined as a functional value of the EOL curve of the product as a function of the predefined loading of the product.
    Type: Grant
    Filed: November 25, 2005
    Date of Patent: November 9, 2010
    Assignee: Robert Bosch GmbH
    Inventors: Klaus Voigtlaender, Johannes Duerr, Rolf Becker, Reinhold Muench, Ivica Durdevic, Uwe Wostradowski, Christopher Hahn, Joerg Breibach, Philippe Jaeckle, Hendrik Ehrhardt, Thomas Rupp, Antoine Chabaud
  • Publication number: 20100202110
    Abstract: Electric control units are known having a printed circuit board substrate 2 on which an electronic circuit 9 is situated which includes multiple electrical components 11 which are interconnected via printed conductors 12 of the printed circuit board substrate, housing parts 3, 4 for covering the electrical components on the printed circuit board substrate and at least one device plug connector part 6 which is electrically connected to the components and situated on the printed circuit board substrate outside the section of the printed circuit board substrate 2 covered by the housing parts 3, 4, the electrical connections between the components and the device plug connector part being established via printed conductors 14 of the printed circuit board substrate.
    Type: Application
    Filed: May 13, 2008
    Publication date: August 12, 2010
    Inventors: Rolf Becker, Christian Lammers, Juergen Jerg, Joachim Wolff, Volker Hochholzer, Ulrich Trescher, Helmut Bubeck, Klaus Voigtlaender, Jan Benzler, Thomas Raica, Willi Kuehn, Thomas Wiesa, Michael Krapp
  • Patent number: 7601560
    Abstract: The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips (46) with essentially the same structure are mounted on a surface (13) pertaining to a first conductor carrier (10) and coated with strip conductors (16). Said two semiconductor chips (46) comprise a first surface (49) and a second surface (58), one semiconductor chip (46) being mounted on the conductor carrier surface (13) with the first surface (49) thereof, and the other semiconductor chip (46) being mounted on the conductor carrier surface (13) with the second surface (58) thereof. The second surface (58) of the first semiconductor chip (46) and the first surface (49) of the other semiconductor chip (46) are interconnected by a lead frame (64) with an A.C. power supply (31).
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: October 13, 2009
    Assignee: Robert Bosch GmbH
    Inventors: Wolfgang Jacob, Christoph Ruf, Albert-Andreas Hoebel, Rolf Becker
  • Publication number: 20090119029
    Abstract: A method and a device are for predicting a life expectancy of a product, which includes at least two components. The life expectancy is ascertained as a function of an assumed field loading of the product. The components of the product are acted upon by different loadings and are operated, in each instance, at the different loadings until they fail. An end-of-life curve of the component is recorded on the basis of the load-dependent failure times of a component. An EOL curve of the product is ascertained such that at the different loadings, it includes the EOL curve of the components which has, in each instance, the shortest failure time at the corresponding loading. The anticipated service life of the product is determined as a functional value of the EOL curve of the product as a function of the predefined loading of the product.
    Type: Application
    Filed: November 25, 2005
    Publication date: May 7, 2009
    Applicant: ROBERT BOSCH GMBH
    Inventors: Klaus Voigtlaender, Johannes Duerr, Rolf Becker, Reinhold Muench, Ivica Durdevic, Uwe Wostradowski, Christopher Hahn, Joerg Breibach, Philippe Jaeckle, Hendrik Ehrhardt, Thomas Rupp, Antoine Chabaud
  • Publication number: 20070231968
    Abstract: The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips (46) with essentially the same structure are mounted on a surface (13) pertaining to a first conductor carrier (10) and coated with strip conductors (16). Said two semiconductor chips (46) comprise a first surface (49) and a second surface (58), one semiconductor chip (46) being mounted on the conductor carrier surface (13) with the first surface (49) thereof, and the other semiconductor chip (46) being mounted on the conductor carrier surface (13) with the second surface (58) thereof. The second surface (58) of the first semiconductor chip (46) and the first surface (49) of the other semiconductor chip (46) are interconnected by a lead frame (64) with an A.C. power supply (31).
    Type: Application
    Filed: November 28, 2005
    Publication date: October 4, 2007
    Inventors: Wolfgang Jacob, Christoph Ruf, Albert-Andreas Hoebel, Rolf Becker
  • Publication number: 20060164058
    Abstract: Apparatus (10) comprising a level shifter (15) connectable to a signal input (1) for receiving an input signal (s(t)) with a negative signal swing. The level shifter (15) provides for a DC shift of the input signal (s(t)) to provide an output signal (r(t)) with positive signal swing. The level shifter (15) comprises an amplifier (17) with a first input (11), a second input (12), and an output (13). A first capacitor (C1), a second capacitor (C2), a reference voltage supply (16), and a transistor (14; 74) serving as a switch, are arranged in a network as follows: the first capacitor (C1) is arranged between the signal input (1) and the first input (11), the second capacitor (C2) is arranged in a feedback-loop (18) between the output (13) and the first input (11), and the reference voltage supply (16) is connected to the second input (12). The transistor (14) is arranged in a branch (19) that bridges the second capacitor (C2), whereby a control signal (CNTRL) is applicable to a gate (14.
    Type: Application
    Filed: July 8, 2004
    Publication date: July 27, 2006
    Inventors: Rolf Becker, Willem Groeneweg, Wolfgang Kemper
  • Publication number: 20050189966
    Abstract: Circuit comprising a signal input (11) for receiving an input signal (s(t)) and a digital output stage (15) being designed for operation at a supply voltage (VDD). The output stage (15) comprises a series of two n-channel CMOS transistors (no1, no2), a common node (17) between the two n-channel CMOS transistors (no1, no2), and an output port (16). Active voltage limiting means (14) are arranged between the signal input (11) and the common node (17) for limiting voltages (VNM) at the common node (17) to a voltage limit (Vmax). The voltage limiting means (14) are controllable by the state of the input signal (s(t)).
    Type: Application
    Filed: May 23, 2003
    Publication date: September 1, 2005
    Inventor: Rolf Becker
  • Publication number: 20050105628
    Abstract: A system with a transmitter for transmitting digital data via an interface to a receiver. The interface has at least one data line and a clock line. A clock generator supplies a clock signal to the clock line. The receiver uses the clock signal received from the clock line for deriving timing information for processing received digital data. The clock signal may have an amplitude that is lower than the power supply voltage VDD, typically less than half of the power supply voltage, and less stringent requirements can be applied to the waveform of the clock signal than traditionally applied to data and clock signals. The clock signals are hereby less power consuming and cause significantly less electromagnetic interference.
    Type: Application
    Filed: December 9, 2002
    Publication date: May 19, 2005
    Inventors: Stephan Koch, Gerd Scheller, Rolf Becker
  • Patent number: 6488199
    Abstract: A method for increasing the manufacturing certainty of soldered connections between a ceramic carrier and a printed-circuit board. It includes the method step of applying a first decomposition-resistant metallization layer on a ceramic carrier and the subsequent imprinting onto the first metallizing layer of a second metallizing layer, improving the wetting performance. In this manner, it is possible to achieve an increase in the overall metallizing layer thickness in the edge area of a soldered connection, whose solder rise in turn makes possible an optical, fully-automatic monitoring of the soldered connection.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: December 3, 2002
    Assignee: Robert Bosch GmbH
    Inventors: J├╝rgen Schwaiger, Rolf Becker
  • Patent number: 5776276
    Abstract: In a method for producing a pressure sensor, a ceramic plate is joined to a shaped ceramic part. The shaped ceramic part has a depression. Around the depression there is provided a thick-layer paste which does not completely surround the depression. As a result, the air can escape from the depression during firing and a subatmospheric pressure can thus be enclosed in the depression.
    Type: Grant
    Filed: February 12, 1996
    Date of Patent: July 7, 1998
    Assignee: Robert Bosch GmbH
    Inventors: Ulrich Goebel, Andreas Thomae, Juergen Schwaiger, Rolf Becker, Andreas Fischer
  • Patent number: 5634698
    Abstract: An ABS which evaluates slip values prescribes pressure values for the wheel brakes. In order to improve the driving stability, these pressure values are varied by a brake controller using the deviation of the yawing speed from a set value and the front-axle steering angle as input variables. The brake controller determines its output values (variation values) with the aid of the fuzzy logic. Additionally, rear-axle steering is integrated into the system, the system partially also using fuzzy logic. Subsequently, an adaptation which is based on fuzzy logic and uses the brake controller and the rear-axle steering controller in a weighted fashion is proposed.
    Type: Grant
    Filed: February 21, 1995
    Date of Patent: June 3, 1997
    Assignee: Robert Bosch GmbH
    Inventors: Chi-Thuan Cao, Rolf Becker, Ulrich Belzner, Thorsten-Wilhelm Moeller, Bernd Lieberoth-Leden
  • Patent number: 5537739
    Abstract: A method for electroconductively connecting two electronic circuits to one another. A contact is coated with a liquefied, electrically conductive, flux-free solder, and the coated contact is arranged over the other contact. Then, in the molten state, the electrically conductive solder is electroconductively connected to the other contact and hardened. In addition, a liquefied, hardenable, non-conducting bonding means is introduced between the two electronic circuits.
    Type: Grant
    Filed: February 9, 1995
    Date of Patent: July 23, 1996
    Assignee: Robert Bosch GmbH
    Inventor: Rolf Becker
  • Patent number: 5364174
    Abstract: Described is an ABS for vehicles in which all wheels are driven. Of particular concern is the forming of a final reference speed for the slip control. From the speeds of wheels with different speeds, an auxiliary reference speed, and a reference speed and a final reference speed for the slip control is formed . In the event of instability, however, the increase of the auxiliary reference speed determines the reference speed.
    Type: Grant
    Filed: September 4, 1992
    Date of Patent: November 15, 1994
    Assignee: Robert Bosch GmbH
    Inventors: Rolf Becker, Thomas Michel, Manfred Meissner, Bernd Gutohrlein