Abstract: The invention relates to an electronic component (1) having a corrosion-protected bonding connection and a method for producing said component. For this purpose the electronic component (1) has at least one semiconductor chip (3) on a substrate (4). Moreover, a bonding connection at risk of corrosion is provided on the semiconductor chip (3). For encapsulation of the at least one semiconductor chip (3) and the at least one bonding connection at risk of corrosion, said semiconductor chip and bonding connection are surrounded by a hermetically sealing housing (5). The hermetically sealed bonding connection is a bonding wire connection (2) which is fully enclosed in the housing (5), in which the substrate (4) is at least partially enclosed. The substrate (4) has at least one surface-mounted hydrolysis-sensitive component (6) in the housing (5).

Abstract: The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.

Abstract: The invention relates to an electronic component (1) having a corrosion-protected bonding connection and a method for producing said component. For this purpose the electronic component (1) has at least one semiconductor chip (3) on a substrate (4). Moreover, a bonding connection at risk of corrosion is provided on the semiconductor chip (3). For encapsulation of the at least one semiconductor chip (3) and the at least one bonding connection at risk of corrosion, said semiconductor chip and bonding connection are surrounded by a hermetically sealing housing (5). The hermetically sealed bonding connection is a bonding wire connection (2) which is fully enclosed in the housing (5), in which the substrate (4) is at least partially enclosed. The substrate (4) has at least one surface-mounted hydrolysis-sensitive component (6) in the housing (5).

Abstract: An electrical control unit has a printed circuit board substrate, on which an electronic circuit is situated, which circuit includes multiple electrical components which are interconnected via printed conductors of the printed circuit board substrate, as well as housing parts for covering the electrical components on the printed circuit board substrate, and at least one device plug connector part situated on the printed circuit board substrate outside the section of the printed circuit board substrate covered by the housing parts. Outside the section covered by the at least one housing part and outside the section of the printed circuit board substrate provided with the device plug connector part, at least one contact point for an additional electrical component is situated on the printed circuit board substrate.

Abstract: The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.

Abstract: The invention relates to a sensor having a conductor arrangement and an intervening dielectric to detect local sensor impedances in response to external forces. The conductor arrangement comprises elongate conductor strips between which the intervening dielectric is arranged as a compressible insulating medium.

Abstract: A method and a device are for predicting a life expectancy of a product, which includes at least two components. The life expectancy is ascertained as a function of an assumed field loading of the product. The components of the product are acted upon by different loadings and are operated, in each instance, at the different loadings until they fail. An end-of-life curve of the component is recorded on the basis of the load-dependent failure times of a component. An EOL curve of the product is ascertained such that at the different loadings, it includes the EOL curve of the components which has, in each instance, the shortest failure time at the corresponding loading. The anticipated service life of the product is determined as a functional value of the EOL curve of the product as a function of the predefined loading of the product.

Abstract: Electric control units are known having a printed circuit board substrate 2 on which an electronic circuit 9 is situated which includes multiple electrical components 11 which are interconnected via printed conductors 12 of the printed circuit board substrate, housing parts 3, 4 for covering the electrical components on the printed circuit board substrate and at least one device plug connector part 6 which is electrically connected to the components and situated on the printed circuit board substrate outside the section of the printed circuit board substrate 2 covered by the housing parts 3, 4, the electrical connections between the components and the device plug connector part being established via printed conductors 14 of the printed circuit board substrate.

Abstract: The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips (46) with essentially the same structure are mounted on a surface (13) pertaining to a first conductor carrier (10) and coated with strip conductors (16). Said two semiconductor chips (46) comprise a first surface (49) and a second surface (58), one semiconductor chip (46) being mounted on the conductor carrier surface (13) with the first surface (49) thereof, and the other semiconductor chip (46) being mounted on the conductor carrier surface (13) with the second surface (58) thereof. The second surface (58) of the first semiconductor chip (46) and the first surface (49) of the other semiconductor chip (46) are interconnected by a lead frame (64) with an A.C. power supply (31).

Abstract: A method and a device are for predicting a life expectancy of a product, which includes at least two components. The life expectancy is ascertained as a function of an assumed field loading of the product. The components of the product are acted upon by different loadings and are operated, in each instance, at the different loadings until they fail. An end-of-life curve of the component is recorded on the basis of the load-dependent failure times of a component. An EOL curve of the product is ascertained such that at the different loadings, it includes the EOL curve of the components which has, in each instance, the shortest failure time at the corresponding loading. The anticipated service life of the product is determined as a functional value of the EOL curve of the product as a function of the predefined loading of the product.

Abstract: The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips (46) with essentially the same structure are mounted on a surface (13) pertaining to a first conductor carrier (10) and coated with strip conductors (16). Said two semiconductor chips (46) comprise a first surface (49) and a second surface (58), one semiconductor chip (46) being mounted on the conductor carrier surface (13) with the first surface (49) thereof, and the other semiconductor chip (46) being mounted on the conductor carrier surface (13) with the second surface (58) thereof. The second surface (58) of the first semiconductor chip (46) and the first surface (49) of the other semiconductor chip (46) are interconnected by a lead frame (64) with an A.C. power supply (31).

Abstract: Apparatus (10) comprising a level shifter (15) connectable to a signal input (1) for receiving an input signal (s(t)) with a negative signal swing. The level shifter (15) provides for a DC shift of the input signal (s(t)) to provide an output signal (r(t)) with positive signal swing. The level shifter (15) comprises an amplifier (17) with a first input (11), a second input (12), and an output (13). A first capacitor (C1), a second capacitor (C2), a reference voltage supply (16), and a transistor (14; 74) serving as a switch, are arranged in a network as follows: the first capacitor (C1) is arranged between the signal input (1) and the first input (11), the second capacitor (C2) is arranged in a feedback-loop (18) between the output (13) and the first input (11), and the reference voltage supply (16) is connected to the second input (12). The transistor (14) is arranged in a branch (19) that bridges the second capacitor (C2), whereby a control signal (CNTRL) is applicable to a gate (14.

Abstract: Circuit comprising a signal input (11) for receiving an input signal (s(t)) and a digital output stage (15) being designed for operation at a supply voltage (VDD). The output stage (15) comprises a series of two n-channel CMOS transistors (no1, no2), a common node (17) between the two n-channel CMOS transistors (no1, no2), and an output port (16). Active voltage limiting means (14) are arranged between the signal input (11) and the common node (17) for limiting voltages (VNM) at the common node (17) to a voltage limit (Vmax). The voltage limiting means (14) are controllable by the state of the input signal (s(t)).

Abstract: A system with a transmitter for transmitting digital data via an interface to a receiver. The interface has at least one data line and a clock line. A clock generator supplies a clock signal to the clock line. The receiver uses the clock signal received from the clock line for deriving timing information for processing received digital data. The clock signal may have an amplitude that is lower than the power supply voltage VDD, typically less than half of the power supply voltage, and less stringent requirements can be applied to the waveform of the clock signal than traditionally applied to data and clock signals. The clock signals are hereby less power consuming and cause significantly less electromagnetic interference.

Abstract: A method for increasing the manufacturing certainty of soldered connections between a ceramic carrier and a printed-circuit board. It includes the method step of applying a first decomposition-resistant metallization layer on a ceramic carrier and the subsequent imprinting onto the first metallizing layer of a second metallizing layer, improving the wetting performance. In this manner, it is possible to achieve an increase in the overall metallizing layer thickness in the edge area of a soldered connection, whose solder rise in turn makes possible an optical, fully-automatic monitoring of the soldered connection.

Abstract: In a method for producing a pressure sensor, a ceramic plate is joined to a shaped ceramic part. The shaped ceramic part has a depression. Around the depression there is provided a thick-layer paste which does not completely surround the depression. As a result, the air can escape from the depression during firing and a subatmospheric pressure can thus be enclosed in the depression.

Abstract: An ABS which evaluates slip values prescribes pressure values for the wheel brakes. In order to improve the driving stability, these pressure values are varied by a brake controller using the deviation of the yawing speed from a set value and the front-axle steering angle as input variables. The brake controller determines its output values (variation values) with the aid of the fuzzy logic. Additionally, rear-axle steering is integrated into the system, the system partially also using fuzzy logic. Subsequently, an adaptation which is based on fuzzy logic and uses the brake controller and the rear-axle steering controller in a weighted fashion is proposed.

Abstract: A method for electroconductively connecting two electronic circuits to one another. A contact is coated with a liquefied, electrically conductive, flux-free solder, and the coated contact is arranged over the other contact. Then, in the molten state, the electrically conductive solder is electroconductively connected to the other contact and hardened. In addition, a liquefied, hardenable, non-conducting bonding means is introduced between the two electronic circuits.

Abstract: Described is an ABS for vehicles in which all wheels are driven. Of particular concern is the forming of a final reference speed for the slip control. From the speeds of wheels with different speeds, an auxiliary reference speed, and a reference speed and a final reference speed for the slip control is formed . In the event of instability, however, the increase of the auxiliary reference speed determines the reference speed.

Abstract: The invention relates to a foil sachet (1) with at least one chamber (7) consisting of an upper and lower foil (2, 3) secured together by a closed seam (5, 6). In order to fill the chambers (7) with a substance, especially air, there is a channel (10, 14) having channel sections (14) opening in the region of a seam (5, 6) and preferably in the region of the corner of the chamber concerned where there is an aperture in said chamber. There are preferably a main (10) and a subsidiary channel (14), wherein the main channel may also run outside the foil sachet (1).