Abstract: A method for treating spent abrasive slurry obtained from cutting a body of a substrate material into wafer-like slices, the slurry comprising a lubricant fluid, unspent abrasive particles and fines, is disclosed, method comprising separating the spent slurry in a first sedimentation step into a solids concentrate comprising unspent abrasive particles and a solids depleted slurry; and subsequently separating the solids depleted slurry by cross-flow filtration into a fines containing fraction and a solids and fines depleted regenerated lubricant fluid.

Abstract: The present invention relates to a method and a system for manufacturing wafer-like slices from a body of a substrate material, especially for use in the manufacture of semiconductor devices. The method comprises providing a slicing device with a cutting wire equipped on its surface with abrasive particles; providing an aqueous cooling and lubricating fluid, said fluid having an ionic strength corresponding to an electrical conductivity of about 30 IJS/cm or less; cutting said body with said cutting wire into slices while dispensing said cooling and lubricating fluid into a kerf area where said cutting wire contacts and cuts said body, said cooling and lubricating fluid promoting removal of powdered substrate material from said kerf area resulting in spent fluid; and removing said spent fluid from said cutting device and recovering said powdered substrate material from said spent fluid.

Abstract: The present invention relates to a method and a system for treating spent abrasive slurry obtained from a process for cutting a body of a substrate material into wafer-like slices, said slurry comprising a lubricant fluid, unspent abrasive particles and fines. The method comprises separating the spent slurry in a first sedimentation step into a solids concentrate comprising unspent abrasive particles and a solids depleted slurry; and subsequently separating the solids depleted slurry by cross-flow filtration into a fines containing fraction and a solids and fines depleted regenerated lubricant fluid.

Abstract: The present invention relates to a method and a system for manufacturing wafer-like slices from a body of a substrate material, especially for use in the manufacture of semiconductor devices. The method comprises providing a slicing device with a cutting wire equipped on its surface with abrasive particles; providing an aqueous cooling and lubricating fluid, said fluid having an ionic strength corresponding to an electrical conductivity of about 30 ?S/cm or less; cutting said body with said cutting wire into slices while dispensing said cooling and lubricating fluid into a kerf area where said cutting wire contacts and cuts said body, said cooling and lubricating fluid promoting removal of powdered substrate material from said kerf area resulting in spent fluid; and removing said spent fluid from said cutting device and recovering said powdered substrate material from said spent fluid.

Abstract: Specification discloses the use of a dynamic cross-flow filtration system for the filtration of mash. Also disclosed are a mashing process, wherein mash is filtered and wort is obtained, and a process for the preparation of beer, as well as apparatuses and devices for performing one or more of these process.

Abstract: Specification discloses the use of a dynamic cross-flow filtration system for the filtration of mash. Also disclosed are a mashing process, wherein mash is filtered and wort is obtained, and a process for the preparation of beer, as well as apparatuses and devices for performing one or more of these process.