Patents by Inventor Rolf Brenner
Rolf Brenner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10930899Abstract: An electrochemical cell includes an annular electrode composite body; and an annular liquid-tight housing formed as a hollow cylinder and including an annular interior space, wherein the housing is arranged around a central aperture or recess, the housing has a height of 5 mm to 40 mm and an external diameter of 6 mm to 20 mm, and the annular electrode composite body is arranged in the annular interior space.Type: GrantFiled: July 18, 2017Date of Patent: February 23, 2021Assignee: VARTA Microbattery GmbHInventors: Bernd Kreidler, Goran Kilibarda, Rainer Hald, Winfried Gaugler, Claus-Christian Fischer, Jürgen Ernsperger, Rolf Brenner
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Patent number: 10658695Abstract: A battery has a prismatic metal housing that includes a rectangular base having a base inner side and a base outer side, a rectangular cover having a cover inner side and a cover outer side, the size and shape of which substantially correspond to that of the base, and four rectangular side elements connecting the base and the cover and each have an inner side and an outer side. The at least one individual cell is a winding having a first and a second end face and the first end face faces in the direction of the base and the second end face faces in the direction of the cover. Conductor vanes electrically connect to the base of the metal housing exit from the first end face. These are fixed to an electrically conductive collecting and positioning means inserted into a receiving means in the base of the metal housing and fixed therein.Type: GrantFiled: March 18, 2016Date of Patent: May 19, 2020Assignee: VARTA Microbattery GmbHInventors: Rolf Brenner, Juergen Ernsperger
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Patent number: 10573924Abstract: An electrochemical cell includes a composite electrode body with at least one positive and at least one negative electrode; an electrolyte that impregnates the composite electrode body; and a housing with a liquid-impervious interior, wherein the composite electrode body impregnated with the electrolyte is disposed in the interior, and the housing consists of PEK or a PEK based material.Type: GrantFiled: June 15, 2017Date of Patent: February 25, 2020Assignee: VARTA Microbattery GmbHInventors: Rolf Brenner, Juergen Ernsperger, Claus-Christian Fischer, Winfried Gaugler, Rainer Hald, Goran Kilibarda, Bernd Kreidler
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Publication number: 20190165335Abstract: An electrochemical cell includes an annular electrode composite body; and an annular liquid-tight housing formed as a hollow cylinder and including an annular interior space, wherein the housing is arranged around a central aperture or recess, the housing has a height of 5 mm to 40 mm and an external diameter of 6 mm to 20 mm, and the annular electrode composite body is arranged in the annular interior space.Type: ApplicationFiled: July 18, 2017Publication date: May 30, 2019Inventors: Bernd Kreidler, Goran Kilibarda, Rainer Hald, Winfried Gaugler, Claus-Christian Fischer, Jürgen Ernsperger, Rolf Brenner
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Publication number: 20180108934Abstract: A battery has a prismatic metal housing that includes a rectangular base having a base inner side and a base outer side, a rectangular cover having a cover inner side and a cover outer side, the size and shape of which substantially correspond to that of the base, and four rectangular side elements connecting the base and the cover and each have an inner side and an outer side. The at least one individual cell is a winding having a first and a second end face and the first end face faces in the direction of the base and the second end face faces in the direction of the cover. Conductor vanes electrically connect to the base of the metal housing exit from the first end face. These are fixed to an electrically conductive collecting and positioning means inserted into a receiving means in the base of the metal housing and fixed therein.Type: ApplicationFiled: March 18, 2016Publication date: April 19, 2018Inventors: Rolf Brenner, Juergen Ernsperger
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Publication number: 20180069261Abstract: An electrochemical cell includes a composite electrode body with at least one positive and at least one negative electrode; an electrolyte that impregnates the composite electrode body; and a housing with a liquid-impervious interior, wherein the composite electrode body impregnated with the electrolyte is disposed in the interior, and the housing consists of PEK or a PEK based material.Type: ApplicationFiled: June 15, 2017Publication date: March 8, 2018Inventors: Rolf Brenner, Juergen Ernsperger, Claus-Christian Fischer, Winfried Gaugler, Rainer Hald, Goran Kilibarda, Bernd Kreidler
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Patent number: 9806034Abstract: A method of protecting sidewalls a plurality of semiconductor devices is disclosed. The method includes fabricating the plurality of semiconductor devices on a semiconductor wafer, etching to form a trench grid network on the backside of the semiconductor wafer. The trench grid network demarcate physical boundaries of each of the plurality of semiconductor devices. The method also includes depositing a protective layer on the backside and etching to remove the protective layer from horizontal surfaces and to singulate each of the plurality of semiconductor devices from the semiconductor wafer.Type: GrantFiled: June 16, 2016Date of Patent: October 31, 2017Assignee: Nexperia B.V.Inventors: Hans-Juergen Funke, Tobias Sprogies, Rolf Brenner, Rüdiger Weber, Wolfgang Schnitt, Frank Burmeister
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Patent number: 9263335Abstract: Disclosed is a discrete semiconductor device package (100) comprising a semiconductor die (110) having a first surface and a second surface opposite said first surface carrying a contact (112); a conductive body (120) on said contact; an encapsulation material (130) laterally encapsulating said conductive body; and a capping member (140, 610) such as a solder cap, a further semiconductor die or a combination thereof in conductive contact with the solder portion, said solder cap extending over the encapsulation material. A further solder cap (150) may be provided over the first surface. A method of manufacturing such a discrete semiconductor device package is also disclosed.Type: GrantFiled: January 28, 2015Date of Patent: February 16, 2016Assignee: NXP B.V.Inventors: Tim Boettcher, Sven Walczyk, Roelf Anco Jacob Groenhuis, Rolf Brenner, Emiel De Bruin
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Patent number: 9077049Abstract: A zinc-air button cell comprising a zinc-containing anode and an air cathode as electrochemical active components and a casing surrounding the anode and the cathode and having 1 to 128 inlet openings through which atmospheric oxygen can enter the casing, wherein 1) the casing comprises a cell cup and a cell lid, 2) the inlet openings are introduced in a bottom portion of the cell cup, 3) at least a part of the inlet openings has an opening area of <0.025 mm2, and 4) the air cathode is a substantially flat layer and seated directly on the bottom portion of the cell cup.Type: GrantFiled: August 18, 2011Date of Patent: July 7, 2015Assignee: Varta Microbattery GmbHInventors: Winfried Gaugler, Wolf-U. Barenthin, Rolf Brenner
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Publication number: 20150140739Abstract: Disclosed is a discrete semiconductor device package (100) comprising a semiconductor die (110) having a first surface and a second surface opposite said first surface carrying a contact (112); a conductive body (120) on said contact; an encapsulation material (130) laterally encapsulating said conductive body; and a capping member (140, 610) such as a solder cap, a further semiconductor die or a combination thereof in conductive contact with the solder portion, said solder cap extending over the encapsulation material. A further solder cap (150) may be provided over the first surface. A method of manufacturing such a discrete semiconductor device package is also disclosed.Type: ApplicationFiled: January 28, 2015Publication date: May 21, 2015Inventors: Tim BOETTCHER, Sven WALCZYK, Roelf Anco Jacob GROENHUIS, Rolf BRENNER, Emiel DE BRUIN
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Patent number: 8981566Abstract: Disclosed is a discrete semiconductor device package (100) comprising a semiconductor die (110) having a first surface and a second surface opposite said first surface carrying a contact (112); a conductive body (120) on said contact; an encapsulation material (130) laterally encapsulating said conductive body; and a capping member (140, 610) such as a solder cap, a further semiconductor die or a combination thereof in conductive contact with the solder portion, said solder cap extending over the encapsulation material. A further solder cap (150) may be provided over the first surface. A method of manufacturing such a discrete semiconductor device package is also disclosed.Type: GrantFiled: May 8, 2013Date of Patent: March 17, 2015Assignee: NXP B.V.Inventors: Tim Boettcher, Sven Walczyk, Roelf Anco Jacob Groenhuis, Rolf Brenner, Emiel De Bruin
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Publication number: 20140154561Abstract: A button cell includes a sealed housing including a cup having a base, a circumferential sleeve, an intermediate region connecting the base and sleeve, and a cut edge, a cover having a base, a circumferential sleeve, and a cut edge, and a seal, wherein the cover is arranged with the cut edge in front into the cup, and the seal between the cup and cover is arranged such that it isolates them from each other, and wherein the sleeve of the cover is divided into a single-walled section and an adjoining circumferential double-walled opening edge with a U-shaped cross-section formed by bending the cut edge of the cover radially outwardly, the sleeve of the cover has a circumferential notch directly below the circumferential double-walled opening edge, in which its external diameter has a minimum value, and the sleeve of the cup has a circumferential protuberance formed by radial drawing-in.Type: ApplicationFiled: May 21, 2012Publication date: June 5, 2014Applicant: Varta Microbattery GmbHInventor: Rolf Brenner
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Publication number: 20130320551Abstract: Disclosed is a discrete semiconductor device package (100) comprising a semiconductor die (110) having a first surface and a second surface opposite said first surface carrying a contact (112); a conductive body (120) on said contact; an encapsulation material (130) laterally encapsulating said conductive body; and a capping member (140, 610) such as a solder cap, a further semiconductor die or a combination thereof in conductive contact with the solder portion, said solder cap extending over the encapsulation material. A further solder cap (150) may be provided over the first surface. A method of manufacturing such a discrete semiconductor device package is also disclosed.Type: ApplicationFiled: May 8, 2013Publication date: December 5, 2013Applicant: NXP B.VInventors: Tim BOETTCHER, Sven WALCZYK, Roelf Anco Jacob GROENHUIS, Rolf BRENNER, Emiel DE BRUIN
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Patent number: 8586232Abstract: A method for producing a button cell with a housing includes a cell cup with a base region, a lateral region, an edge region lying therebetween and a cut edge, and a cell cover with a cover region, a lateral region, an edge region lying therebetween and a cut edge, connected to one another via a seal. The method includes at least applying the seal to the lateral region, inserting the cell cover with the seal into the cell cup, wherein a region is formed in which the lateral regions and overlap one another, and exerting a pressure on the lateral region of the cell cup. The heights of the lateral regions and are matched to one another such that the cut edge is pressed against the lateral region by pressure. The cell cup of button cells have an inner radius which is essentially constant in the region in the direction of the cut edge.Type: GrantFiled: March 16, 2010Date of Patent: November 19, 2013Assignee: Varta Microbattery GmbHInventor: Rolf Brenner
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Patent number: 8508035Abstract: Aspects of the present invention are directed to circuits, circuit packages and related methods. In accordance with various example embodiments, respective electrodes are implemented to facilitate contact to a semiconductor device via different surfaces and/or sidewalls, as may be useful in connecting the device to an external package having a plurality of semiconductor devices in which same-surface connections to the devices are spatially restricted. The semiconductor device has opposing surfaces and sidewalls connecting the surfaces, and contacts to respective different regions in the device. Respective electrodes are coupled to the respective contacts and extend along/around the device to provide access to the contacts via different surfaces.Type: GrantFiled: December 2, 2011Date of Patent: August 13, 2013Assignee: NXP B.V.Inventors: Roelf Anco Jacob Groenhuis, Sven Walczyk, Emiel Bruin, Rolf Brenner
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Publication number: 20130196222Abstract: A button cell with a housing includes a cup part and a cover part, which each have a floor region and a lateral surface region adjacent thereto and extending up to a first cut edge. A positive and a negative electrode, separated by a separator, are arranged in the housing. The cup part and the cover part are physically separated and electrically isolated from one another by a film seal, wherein the film seal surrounds the outer side of the cover part in the lateral surface region like a collar and is turned over the cut edge of the cover part inwardly. The film seal in this case forms, together with the separator and the cover part, a closed cavity in which the negative electrode is arranged.Type: ApplicationFiled: March 17, 2011Publication date: August 1, 2013Applicant: VARTA MICROBATTERY GMBHInventors: Rolf Brenner, Eduard Pytlik
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Publication number: 20130183596Abstract: A zinc-air button cell comprising a zinc-containing anode and an air cathode as electrochemical active components and a casing surrounding the anode and the cathode and having 1 to 128 inlet openings through which atmospheric oxygen can enter the casing, wherein 1) the casing comprises a cell cup and a cell lid, 2) the inlet openings are introduced in a bottom portion of the cell cup, 3) at least a part of the inlet openings has an opening area of <0.025 mm2, and 4) the air cathode is a substantially flat layer and seated directly on the bottom portion of the cell cup.Type: ApplicationFiled: August 18, 2011Publication date: July 18, 2013Applicant: VARTA MICROBATTERY GMBHInventors: Winfried Gaugler, Wolf-U. Barenthin, Rolf Brenner
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Publication number: 20130140705Abstract: Aspects of the present invention are directed to circuits, circuit packages and related methods. In accordance with various example embodiments, respective electrodes are implemented to facilitate contact to a semiconductor device via different surfaces and/or sidewalls, as may be useful in connecting the device to an external package having a plurality of semiconductor devices in which same-surface connections to the devices are spatially restricted. The semiconductor device has opposing surfaces and sidewalls connecting the surfaces, and contacts to respective different regions in the device. Respective electrodes are coupled to the respective contacts and extend along/around the device to provide access to the contacts via different surfaces.Type: ApplicationFiled: December 2, 2011Publication date: June 6, 2013Inventors: Roelf Anco Jacob Groenhuis, Sven Walczyk, Emiel Bruin, Rolf Brenner
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Publication number: 20120112351Abstract: Disclosed is a method of manufacturing a discrete semiconductor device package (100), comprising providing a wafer comprising a plurality of semiconductor devices (50), each of said semiconductor devices comprising a substrate (110) having a top contact (130) and a bottom contact (150); partially sawing said wafer with a first sawing blade such that the semiconductor devices are partially separated from each other by respective incisions (20); lining said incisions with an electrically insulating film (160); and sawing through said incisions with a second sawing blade such that the semiconductor devices are fully separated from each other. A resulting discrete semiconductor device package (100) and a carrier (200) comprising such a discrete semiconductor device package (100) are also disclosed.Type: ApplicationFiled: November 9, 2011Publication date: May 10, 2012Applicant: NXP B.V.Inventors: Sven WALCZYK, Roelf Anco Jacob GROENHUIS, Paul Dijkstra, Emiel de BRUIN, Rolf Brenner
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Publication number: 20120080353Abstract: A retail and storage pack of the blister card type for zinc-air button cells includes a support, and a transparent plastics film fixed thereon and has cup-shaped stamp-outs for reception of the button cells, wherein the pack is divided into single pack regions which can respectively be torn off separately and each of which respectively comprises at least one of the cup-shaped stamp-outs, and wherein the support is provided with an adhesive layer to which button cells received in the cup-shaped stamp-outs adhere by their base, which bases are provided with air inlet openings.Type: ApplicationFiled: June 2, 2010Publication date: April 5, 2012Applicant: VARTA MICROBATTERY GMBHInventor: Rolf Brenner