Abstract: An electrical component and a method for the manufacture thereof, comprising a connection arrangement between an active surface of an electrical component and a carrier, wherein electrical connecting elements are disposed in a connection zone on the active surface and/or on the carrier, and at least one spacer element is provided, which is disposed on the active surface and/or on the carrier. The at least one spacer element has a smaller height than the connecting elements before the connecting elements are reflowed to produce the electrically conductive connection, and is preferably disposed in an edge region of the connection zone.

Abstract: An electrical component and a method for the manufacture thereof, comprising a connection arrangement between an active surface of an electrical component and a carrier, wherein electrical connecting elements are disposed in a connection zone on the active surface and/or on the carrier, and at least one spacer element is provided, which is disposed on the active surface and/or on the carrier. The at least one spacer element has a smaller height than the connecting elements before the connecting elements are reflowed to produce the electrically conductive connection, and is preferably disposed in an edge region of the connection zone.

Abstract: Solder materials, such as a solder paste, and contact surfaces for solder connections are provided in which a metal stearate is used as a flux. The metal stearate is applied either as a solid layer on the solder particles or as contact surfaces or is present as a dispersion or solution in a binder. Advantageously, such materials allow one to avoid the use of classical fluxes. In particular, non-resin solder materials can be provided. A simplified storage and processability of the solder materials results, while at the same time producing comparatively better solder connections. The ability to use metal stearates as a flux is achieved if the first oxide of the metals used is formed from pure metal at lower oxygen activity (ao) than the first chromium oxide of chromium, preferably lower than the first titanium oxide of titanium, and if the metal stearate is present in a sufficient amount.

Abstract: The invention relates to a device for the controlled displacement of an upward-directed spray nozzle to individual spray points that are situated a distance apart, in particular for spraying flux in wave soldering units. The spray nozzle is situated axially on a rotary axle rotated by a rotary drive, to which a deflection force directly radially to the rotary axle is applied in such a way that, when the rotary axle rotates, the spray nozzle executes a self-contained annular motion whose contour is limited in the radial direction by a stationary mask surrounding the spray nozzle.

Abstract: The invention relates to a method and a device for the reflow soldering of circuit-board conductors with components and modules applied to a printed-circuit board by means of a solder paste, wherein, through radiation of an electromagnetic wave, an absorption material absorbing the radiation is heated and said heating is transferred to the solder paste for melting a solder contained in the solder paste. The solder paste is mixed with the absorption material to form a mixed material and the mixed material is applied to the soldering joints of the circuit-board conductors.

Abstract: The invention relates to a process chamber of an installation for the thermal treatment of printed circuit boards, with a fan wheel supported on a shaft parallel to the printed circuit boards, said fan wheel being disposed between two walls of the process chamber. The fan wheel is open at its two end faces and the two end faces are at such a distance from the walls of the process chamber that gas flows in unimpeded in two substreams between the end faces of the fan wheel and the walls and flows out from the cylindrical surface of the fan wheel over the length thereof and in the extent of the process chamber in the form of a ribbon-shaped gas stream, said gas stream being directed essentially in said cross section through a channel onto the printed circuit boards.

Abstract: An apparatus for the temperature regulation processing of electronic components such as semiconductor circuits, printed circuit boards and the like comprises a temperature regulated housing through which the components are conveyed on carriers. The carriers enter through an inlet slot in the housing provided with temperature regulating members and are conveyed onto a magazine and then out through an outlet slot opposite the inlet slot once processing is complete. Inside the housing, the carriers are loaded on a progressively loaded magazine provided with adjacently arranged holders. Once all the holders are loaded, the magazine is filled and in an end position. The magazine is then displaced to its starting position in a fast reverse run. A new carrier is conveyed in through the inlet slot thereby causing the temperature regulated carrier occupying the holder to be conveyed out through the outlet slot.

Abstract: The invention relates to a method for the temperature regulation of components, for example semiconductor circuits, printed circuit boards and the like, in which the components are conveyed on carriers through an inlet slot into a temperature-regulating housing provided with temperature-regulating members and are conveyed out through an outlet slot opposite the inlet slot. The carriers are accommodated by a magazine in the housing, which magazine is provided with adjacently arranged holders and, after the first holder has been loaded, is displaced progressively in one direction from a starting position into successive accommodating positions in which the individual holders of the magazine are loaded one after the other.

Abstract: A method and apparatus for the temperature regulation of components such as semiconductor circuits, printed circuit boards and the like. The components are conveyed on carriers through an inlet slot into a temperature regulating housing provided with temperature regulating members and are convey out through an outlet slot opposite the inlet slot. In the housing, the carriers are loaded on a magazine provided with adjacently arranged holders. After the first holder is loaded in the starting position, the magazine is displaced progressively in one direction into successive positions in which the remaining holders of the magazine are loaded one after the other. Once all the holders are loaded, the magazine is filled and in an end position. Thereupon the magazine is displaced back to its starting position in a fast reverse run in the opposite direction.