Abstract: A method for repairing interconnect interruptions. Faults at the interconnects occurring in manufacturing processes of printed circuit boards were previously repaired with suitable methods. The fashioning of the interconnects in a meander form and their miniaturization requires a completely new procedure. The dimensions of current interconnects amount, for example, to: width.times.height=70 .mu.m.times.20 .mu.m. For repairing such interconnects that are usually arranged in extremely tight proximity on an interconnect carrier, it is necessary to position preforms utilized for repair absolutely congruently on the interconnect interruption and to hold them until the joining zones are completely formed between the preform and the interconnect. This is achieved by use of an insulating foil having work windows and by use of a preform panel that contains a plurality of preforms.