Abstract: With a pick-up tool with a suction organ made of elastically deformable material, a surface for picking the semiconductor chip is formed convex. On placing the semiconductor chip onto an already mounted semiconductor chip the centre of the semiconductor chip impacts first. The convex surface is increasingly deformed as a result of the pressure build-up until it and the picked semiconductor chip are flat. The pressure builds up from the centre of the suction organ outwards. In doing so, the semiconductor chip is rolled onto the lower semiconductor chip, whereby the air can continuously escape.