Abstract: A process chamber of an installation for the thermal treatment of printed circuit boards is described. The process chamber may include a fan wheel supported on a shaft parallel to the printed circuit boards, the fan wheel being disposed between two walls of the process chamber. The fan wheel is open at its two end faces and the two end faces are at such a distance from the walls of the process chamber that gas flows in unimpeded in two substreams between the end faces of the fan wheel and the walls and flows out from the cylindrical surface of the fan wheel over the length thereof and in the extent of the process chamber in the form of a ribbon-shaped gas stream, the gas stream being directed essentially in the cross section through a channel onto the printed circuit boards.

Abstract: The invention relates to a process for the reflow soldering of printed circuit board assemblies provided with solder paste in a sealed chamber with heating in the chamber. In a first process step, the pressure in the chamber is amplified in comparison with the atmospheric pressure and the temperature in the chamber is increased by convection heating to melt the solder paste and, in a second process step, the pressure is again lowered to atmospheric pressure in controlled manner while maintaining the temperature.

Abstract: The invention relates to a process for soldering electrical components to soldering positions, which are provided with soldering material, on a plastic sheet provided with applied conductor tracks. The plastic sheet is heated, from the side which is remote from the components, to a below its damage temperature and after heating its side which is remote from the components is thermally insulated. Then, the side which faces the components is acted on by a heating-gas stream which is concentrated onto the locations which are to be soldered by a template which has windows.

Abstract: The invention relates to a process for soldering electrical components to soldering positions, which are provided with soldering material, on a plastic sheet provided with applied conductor tracks. The plastic sheet is heated, from the side which is remote from the components, to a below its damage temperature and after heating its side which is remote from the components is thermally insulated. Then, the side which faces the components is acted on by a heating-gas stream which is concentrated onto the locations which are to be soldered by a template which has windows.