Patents by Inventor Rolf Rief

Rolf Rief has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Current converter assembly in a flat housing
    Patent number: 4488167
    Abstract: Current converter assembly, including a parallelepipedal housing having an upper surface and an interior being filled with a hardened cast insulating compound, the housing including a flat frame having an open top and bottom, a rectangular edge section extended all around the frame, a rib extended all around the frame toward the interior thereof at substantially the middle of the edge section, and steadying struts disposed on the rib, a ceramic plate having a surface facing the interior of the housing and having outer dimensions corresponding to the length and width of the flat frame, conducting copper foils disposed on the surface of the ceramic plate facing the interior of the housing, semiconductor chips being soldered on the copper foils, connecting straps connecting the semiconductor chips to each other, and connecting elements being extended out of the housing from the ceramic plate in a direction perpendicular to the ceramic plate, the connecting elements being retained by the steadying struts and bein
    Type: Grant
    Filed: July 9, 1982
    Date of Patent: December 11, 1984
    Assignee: Brown, Boveri & Cie AG
    Inventors: Arno Neidig, H/u/ bert Hettmann, Bernd Le/u/ kel, Rolf Rief
  • Semiconductor power module
    Patent number: 4436951
    Abstract: Semiconductor power module, including a substantially prismatic plastic housing with a lower surface having a recess with a shoulder-like step formed in the periphery thereof, a ceramic plate being inserted into the step and having an outer flat surface extending beyond the lower surface of the housing and an inner flat surface facing the interior of the housing, metallizations, semiconductor components and solder jumpers disposed on the inner surface of the ceramic plate, external contact elements being disposed on the inner surface of the ceramic plate and being freely accessible from on top of the housing, the housing including a frame having an open top and bottom, a central fastening part having a lower surface and having a hole formed therethrough for fastening the module to a heat sink, and radially-directed spokes extended between the frame and the central fastening part, the ceramic plate being braced against the lower surface of the central fastening part and having a breakthrough formed therein in
    Type: Grant
    Filed: July 17, 1981
    Date of Patent: March 13, 1984
    Assignee: Brown, Boveri & Cie AG
    Inventors: Rolf Rief, Peter Wetzel