Abstract: Compounds of formula Ia or Ib wherein A is an (n+1)-valent aliphatic, cycloaliphatic, araliphatic or aromatic radical and n is an integer from 0 to 5, E is an (m+1)-valent aliphatic, cycloaliphatic, araliphatic or aromatic radical and m is an integer from 0 to 3, X is —O—, —C(?O)O or —CHR4—, with R4 and R3 together forming an ethylene group, R1 and R2 are, each independently of the other, hydrogen or methyl, R3 is hydrogen, or R3 and R4 together form an ethylene group, and R5 is a monovalent aliphatic, cycloaliphatic, araliphatic or aromatic radical, are highly reactive curing agents for epoxy resins and yield cured products having improved resistance to chemicals.

Abstract: Epoxy acrylates of the formulae (A), (B) and epoxy acrylate mixtures comprising at least one of the compounds (A) or (B) are novel and find use in coating materials or adhesives featuring high UV stability

Abstract: Epoxy acrylates of the formulae (A), (B) and epoxy acrylate mixtures comprising at least one of the compounds (A) or (B) are novel and find use in coating materials or adhesives featuring high UV stability.

Abstract: Compounds of formula Ia or Ib 1

Abstract: A carboxyl group-containing epoxy acrylate is prepared by the reaction of an epoxy resin advanced with an aromatic biphenol compound which is reacted with a polycarboxylic acid anhydride in the presence or absence of a catalyst and a polymerization inhibitor at an elevated temperature. The carboxyl group-containing epoxy acrylate is mixed with a photoinitiator to obtain a photoresist formulation.

Abstract: Compounds of formula Ia or Ib wherein A is an (n+1)-valent aliphatic, cycloaliphatic, araliphatic or aromatic radical and n is an integer from 0 to 5, E is an (m+1)-valent aliphatic, cycloaliphatic, araliphatic or aromatic radical and m is an integer from 0 to 3, X is —O—, —COO— or —CHR4—, R1 and R2 are, each independently of the other, hydrogen or methyl, R3 is hydrogen, and R5 is a monovalent aliphatic, cycloaliphatic, araliphatic or aromatic radical, are highly reactive curing agents for epoxy resins and yield cured products having improved resistance to chemicals.

Abstract: Epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae III and IV of the claims that are relatively polymolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerized polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae III and IV of the claims that are relatively polymolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerised polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerised polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: Compounds active as accelerators for curable epoxy and polyurethane systems, those compounds having been prepared by means of a transamination reaction by reacting (a) a substituted phenolic compound (Mannich base) having at least one substituent of formula R1(R2)N—CH(R3)—  (A), wherein R1 and R2 are each independently of the other linear or branched C1-4alkyl and R3 is hydrogen, methyl, ethyl or phenyl, with (b) a compound of formula R4(R5)N—CnH2n—(NH—CnH2n)q—NH2  (B), wherein R4 and R5 are each independently of the other C1-C6alkyl or together form a radical of formula —(CH2)5— or —(CH2)2—O—(CH2)2—, n is an integer from 2 to 5 and q is zero, 1, 2 or 3, and the compound obtained or the compounds present in the mixture obtained has/have on average, per molecule, at least one substituent of formula (R4)(R5)N—CnH2n—(NH—CnH2n)q—NH—CH(R3)—, and the use of those compounds as acceler

Abstract: Curable epoxy resin compositions, which are obtainable by heating a composition containing at least one epoxy compound, which contains on average at least one, preferably more than one, 1,2-epoxy group and optionally also one or several hydroxyl groups in the molecule, in the presence of at least one Lewis acid as catalyst, wherein the Lewis acid is a salt of trifluoromethanesulfonic acid or of perchloric acid, the counterion of which carries a 2- to 6-fold positive charge, until the epoxy value, measured in equivalent epoxy/kg (Eq/kg) of the starting material, has been reduced by 1 to 60 percent, preferably by 5 to 50 percent; a process for their preparation, and their use for the preparation of fully cured moulded compositions or coatings.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae III and IV of the claims that are relatively polymolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerized polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: A process is described for the preparation of photopolymerizable compositions, wherein the photopolymerizable compositions can be photopolymerized by the irradiation of emission lines of differing wavelength from a UV/VIS laser light source, and contain a photopolymerizable compound and at least two photoinitiators, by adjusting the sensitivity to radiation. The ratio between the concentrations of the individual photoinitiators is so adjusted that the composition has virtually the same optical density for the radiation of the different emission lines at which the photoinitiators are effective.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerized polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: A process is described for the preparation of photopolymerizable compositions, wherein the photopolymerizable compositions can be photopolymerized by the irradiation of emission lines of differing wavelength from a UV/VIS laser light source, and contain a photopolymerizable compound and at least two photoinitiators, by adjusting the sensitivity to radiation. The ratio between the concentrations of the individual photoinitiators is so adjusted that the composition has virtually the same optical density for the radiation of the different emission lines at which the photoinitiators are effective.

Abstract: A liquid photosensitive composition comprising(1) 40 to 80% by weight of a urethane (meth)acrylate having a functionality of 2 to 4 and a molecular weight (Mw) of 500 to 10,000,(2) 5 to 40% by weight of a hydroxyl group containing aliphatic or cycloaliphatic di(meth)acrylate,(3) 0 to 40% by weight of a mono(meth)acrylate or of a mono-N-vinyl compound having a Mw of not more than 500,(4) 0.1 to 10% by weight of a photoinitiator,(5) 0 to 30% by weight of an aliphatic or cycloaliphatic di(meth)acrylate which differs from (2), of an aliphatic tri(meth)acrylate or of an aromatic di- or tri(meth)acrylate, and(6) 0 to 5% by weight of customary additives, such that the proportion of components (1) to (6) together is 100% by weight.The composition is a photosensitive composition which can be polymerised by irradiation with actinic light and which is suitable for the production preferably of three-dimensional objects by the stereolithographic technique.