Abstract: A conductive copper foil for use in preparing printed circuit boards is protected from damage during storage, shipment and further processing by covering at least one side of the foil with a sheet of plastic film. The film is removably joined with the foil as a result of the essential absence of gaseous material between the film and the foil. Thus, the film conforms intimately to the contours and shape of the foil surface and clings tightly thereto to permit movement and further processing of the foil with the film adhering tightly thereto. The absence of air between the film and the foil is produced by oppositely statically electrically charging the film and the foil such that they are forced together sufficiently to squeeze the air out from therebetween.

Abstract: A conductive copper foil for use in preparing printed circuit boards is protected from damage during storage, shipment and further processing by covering one side of the foil with a sheet of polyethylene film. The film is removably joined with the foil by an adhesive material placed between the film and the foil in a marginal area of the latter. The film is selected to be sufficiently resistant to laminating temperature and pressure conditions so as to remain in its covering, protecting relationship to the foil and avoid sticking to the laminating press plate and retain its removability from the foil after lamination.