Patents by Inventor Rollin W. Mettler, Jr.

Rollin W. Mettler, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit module and method of making same
    Patent number: 4567545
    Abstract: An integrated circuit module adapted to connect an integrated circuit to an electrical connector. A lead frame (20) with lengthened leads (22), compared to the lead frame of a conventional DIP packaged IC, is laminated to a nonconductive substrate (46). The leads (22) of the lead frame have contact ends (28) laminated in spaced relation along a contact edge (52) of the substrate (46) for contacting the electrical connector. The use of a printed circuit board and the necessity for soldering the IC thereto are thereby eliminated.The leads (22) may comprise two sets (48,54) with the first set (48) laminated to a first surface (50) of the substrate (46) and the second set (54) wrapped around an edge of the substrate (46) and laminated to the second surface (56). The IC module may include a hermetically sealed IC chip (26) electrically connected to the lead frame (20) with interconnecting wires (22) and substrate (46) may be shaped to allow external electrical components to be mounted on the IC module.
    Type: Grant
    Filed: May 18, 1983
    Date of Patent: January 28, 1986
    Inventor: Rollin W. Mettler, Jr.