Patents by Inventor Rom Becker

Rom Becker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic assembly and method for thermal balancing of surfacemount devices
    Patent number: 12171056
    Abstract: A device may include a printed circuit board (PCB), a plurality of surface-mount devices disposed on the PCB, wherein a thermal mass of each of the surface-mount devices ranges between a first thermal mass value and a second thermal mass value that is greater than the first thermal mass value, and a plurality of thermal capacitors disposed on the PCB, wherein a thermal mass of each of the thermal capacitors is equal to or greater than the first thermal mass value of the surface-mount devices.
    Type: Grant
    Filed: June 20, 2022
    Date of Patent: December 17, 2024
    Assignee: MELLANOX TECHNOLOGIES LTD.
    Inventors: Igor Loiferman, Tomer Klein, Rom Becker
  • DEVICE FOR LIQUID COOLING OF NETWORK INTERFACE DEVICES
    Publication number: 20240090165
    Abstract: An electronic device may include a receptacle cage comprising a longitudinal aperture extending along a portion of a top surface of the receptacle cage, a cooling body disposed directly on the top surface of the receptacle cage, wherein a longitudinal portion of a bottom surface of the cooling body is disposed within the longitudinal aperture on the top surface of the receptacle cage, a first conduit to deliver a liquid coolant into an interior of the cooling body, and a second conduit to deliver the liquid coolant from the interior of the cooling body.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 14, 2024
    Applicant: Mellanox Technologies Ltd.
    Inventors: Oren Weltsch, Igal Gutman, Rom Becker, Shay Zaretsky, Ayal Shabtay, Michal Shlomai Hermon, Kfir Katz
  • ELECTRONIC ASSEMBLY AND METHOD FOR THERMAL BALANCING OF SURFACEMOUNT DEVICES
    Publication number: 20230413417
    Abstract: A device may include a printed circuit board (PCB), a plurality of surface-mount devices disposed on the PCB, wherein a thermal mass of each of the surface-mount devices ranges between a first thermal mass value and a second thermal mass value that is greater than the first thermal mass value, and a plurality of thermal capacitors disposed on the PCB, wherein a thermal mass of each of the thermal capacitors is equal to or greater than the first thermal mass value of the surface-mount devices.
    Type: Application
    Filed: June 20, 2022
    Publication date: December 21, 2023
    Applicant: Mellanox Technologies Ltd.
    Inventors: Igor LOIFERMAN, Tomer KLEIN, Rom BECKER
  • NETWORK INTERFACE DEVICE HAVING HEAT DISSIPATING MEMBERS
    Publication number: 20230137375
    Abstract: A network interface device may include: a frame having: a first frame end, a second frame end, a top frame surface, a bottom frame surface, a first lateral frame surface and a second lateral frame surface, wherein the top frame surface includes a longitudinal frame indent extending along a portion of the top frame surface and between the first lateral frame surface and the second lateral frame surface; and heat dissipating members protruding from the longitudinal frame indent of the top frame surface.
    Type: Application
    Filed: November 2, 2021
    Publication date: May 4, 2023
    Applicant: Mellanox Technologies Ltd.
    Inventors: Ayal SHABTAY, Alon Rokach, Bar Noyman, Jamal Mousa, Nimer Hazin, Rom Becker