Abstract: A substrate for contacting an electrical pin arranged in a housing includes a base having a recess receiving the electrical pin, a metal leadframe having a contacting region electrically and/or thermally contacting the electrical pin, and a contact pin extending along a mating direction in a plane parallel to the metal leadframe and configured to electrically contact a mating contact pin of a mating connector. The metal leadframe is rigidly fixed to the base to prevent a relative movement between the metal leadframe and the substrate. The substrate is movable with respect to the housing along a locking direction from an unlocked position where the substrate is not locked to the housing to a locked position in which the substrate is locked to the housing. A movement of the contacting region with respect to the electrical pin is prevented in the locked position.