Patents by Inventor Romain Boulet

Romain Boulet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230185089
    Abstract: An optical device and to a corresponding manufacturing process, the device including a textured layer including, on its surface, first macro-textures; and a carrier including, on its surface, a holographic layer intermediate between the textured layer and the carrier. The holographic layer includes a diffraction grating forming, via a holographic effect, an arrangement of pixels in a basis of at least two distinct colours. The textured layer is assembled by lamination with the carrier so that the holographic layer, placed between the textured layer and the carrier, is deformed by the first macro-textures so as to include second macro-textures conformal with the first macro-textures, the visual appearance of the arrangement of pixels being personalized via the second macro-textures.
    Type: Application
    Filed: December 13, 2022
    Publication date: June 15, 2023
    Applicant: IDEMIA FRANCE
    Inventors: Romain BOULET, Leon SEGEREN, Paul AZUELOS
  • Patent number: 8642443
    Abstract: The present invention relates to the field of semiconductor manufacturing. More specifically, it relates to a method of forming islands of at least partially relaxed strained material on a target substrate including the steps of forming islands of the strained material over a side of a first substrate; bonding the first substrate, on the side including the islands of the strained material, to the target substrate; and after the step of bonding splitting the first substrate from the target substrate and at least partially relaxing the islands of the strained material by a first heat treatment.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: February 4, 2014
    Assignee: Soitec
    Inventor: Romain Boulet
  • Publication number: 20120241918
    Abstract: The present invention relates to the field of semiconductor manufacturing. More specifically, it relates to a method of forming islands of at least partially relaxed strained material on a target substrate including the steps of forming islands of the strained material over a side of a first substrate; bonding the first substrate, on the side including the islands of the strained material, to the target substrate; and after the step of bonding splitting the first substrate from the target substrate and at least partially relaxing the islands of the strained material by a first heat treatment.
    Type: Application
    Filed: March 23, 2012
    Publication date: September 27, 2012
    Applicant: SOITEC
    Inventor: Romain Boulet