Patents by Inventor Romain JAILLET

Romain JAILLET has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming electronic chip package having a conductive layer between a chip and a support
    Patent number: 11784104
    Abstract: The invention concerns a device comprising a support, an electrically-conductive layer covering the support, a semiconductor substrate on the conductive layer, and an insulating casing.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: October 10, 2023
    Assignee: STMICROELECTRONICS (TOURS) SAS
    Inventors: Olivier Ory, Romain Jaillet
  • ELECTRONIC CHIP PACKAGE HAVING A SUPPORT AND A CONDUCTIVE LAYER ON THE SUPPORT
    Publication number: 20220020652
    Abstract: The invention concerns a device comprising a support, an electrically-conductive layer covering the support, a semiconductor substrate on the conductive layer, and an insulating casing.
    Type: Application
    Filed: September 30, 2021
    Publication date: January 20, 2022
    Applicant: STMICROELECTRONICS (TOURS) SAS
    Inventors: Olivier ORY, Romain JAILLET
  • Electronic chip package having a support and a conductive layer on the support
    Patent number: 11158556
    Abstract: The invention concerns a device comprising a support, an electrically-conductive layer covering the support, a semiconductor substrate on the conductive layer, and an insulating casing.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: October 26, 2021
    Assignee: STMICROELECTRONICS (TOURS) SAS
    Inventors: Olivier Ory, Romain Jaillet
  • ELECTRONIC CHIP PACKAGE
    Publication number: 20200075445
    Abstract: The invention concerns a device comprising a support, an electrically-conductive layer covering the support, a semiconductor substrate on the conductive layer, and an insulating casing.
    Type: Application
    Filed: August 27, 2019
    Publication date: March 5, 2020
    Inventors: Olivier ORY, Romain JAILLET