Abstract: Vacuum clamping device for clamping workpieces, in particular for clamping flat substrates, such as wafers for example, comprising a base plate having a suction surface, wherein a plurality of suction openings are formed in the suction surface of the base plate, wherein the base plate can be connected to at least one negative-pressure device via at least one suction line, characterized in that the suction openings are arranged in a peripheral region of the suction surface of the base plate.

Abstract: Vacuum clamping device for clamping workpieces, in particular for clamping flat substrates, such as wafers for example, comprising a base plate having a suction surface, wherein a plurality of suction openings are formed in the suction surface of the base plate, wherein the base plate can be connected to at least one negative-pressure device via at least one suction line, characterized in that the suction openings are arranged in a peripheral region of the suction surface of the base plate.

Abstract: The invention relates to an inspection system (10) for defect analysis of a wire connection (11) between a substrate (13) and a semiconductor component (15, 16) of a product (12), the inspection system comprising a first projection device (24), a line scan camera (28) and a processing device, the first projection device having at least one slit projection means (25), the slit projection means being capable of projecting a light slit (33) onto a wire (21, 22) of the wire connection, light of the light slit reflected by the wire in a detection plane (39) of the line scan camera extending perpendicularly, preferably orthogonally to a substrate surface (14) being detectable by means of the line scan camera, analysis image information of the product being derivable from a plurality of line scan image information of the line scan camera by means of the processing device, wherein the slit projection means is arranged in relation to the line scan camera in such a manner that the light slit can be projected onto the p

Abstract: The invention relates to an inspection system (10) for defect analysis of a wire connection (11) between a substrate (13) and a semiconductor component (15, 16) of a product (12), the inspection system comprising a first projection device (24), a line scan camera (28) and a processing device, the first projection device having at least one slit projection means (25), the slit projection means being capable of projecting a light slit (33) onto a wire (21, 22) of the wire connection, light of the light slit reflected by the wire in a detection plane (39) of the line scan camera extending perpendicularly, preferably orthogonally to a substrate surface (14) being detectable by means of the line scan camera, analysis image information of the product being derivable from a plurality of line scan image information of the line scan camera by means of the processing device, wherein the slit projection means is arranged in relation to the line scan camera in such a manner that the light slit can be projected onto the p

Abstract: The present invention relates to a device (10), a method and an application thereof for optically measuring the surface of a tested product (5), especially a PCB-product for reflow soldering paste inspection. The device comprises at least one white light source (1) for emitting a beam of white light, at least one collimation unit (4) for collimating said beam of white light (30), at least one spectrometer unit, preferably an optical prism (2) or an optical diffraction grading (51), for splitting said beam of white light (30) into a beam of multichromatic light (31) being directed onto said tested product (5) under a predetermined incident angle ?, and at least one camera (3) for recording a reflected beam of monochromatic light (32) of said tested product (5). Z-axis surface height information of said tested product (5) can be extracted from a hue value of said reflected beam of mono chromatic light (32) while relatively moving said tested product (5) in a x-axis scanning direction (9).