Patents by Inventor Roman Li

Roman Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip double-sided layout on PCB
    Patent number: 10757812
    Abstract: The present invention provides a printed circuit board and a layout method thereof and an electronic equipment. On the printed circuit board is arranged a first processor chip and a second processor chip, wherein the first processor chip is arranged on a first surface of the printed circuit board; the second processor chip is arranged on a second surface of the printed circuit board; and a first through-hole is disposed on the printed circuit board, part of pins of the first processor chip being connected to part of pins of the second processor chip via the first through-hole.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: August 25, 2020
    Assignee: NVIDIA CORPORATION
    Inventors: Joey Cai, Tiger Yan, Oliver Yi, Jacky Zhu, Roman Li